Cita APA (7a ed.)

Zschech, E. (2005). Materials for information technology: Devices, interconnects and packaging. Springer berlin Heidelberg.

Cita Chicago Style (17a ed.)

Zschech, Ehrenfried. Materials for Information Technology: Devices, Interconnects and Packaging. New York, NY: Springer berlin Heidelberg, 2005.

Cita MLA (9a ed.)

Zschech, Ehrenfried. Materials for Information Technology: Devices, Interconnects and Packaging. Springer berlin Heidelberg, 2005.