Materials for information technology devices, interconnects and packaging
| Autor principal: | |
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| Formato: | Libro |
| Publicado: |
New York, NY :
Springer berlin Heidelberg
2005.
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| Colección: | Engineering materials and processes
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| Materias: | |
| Ver en Universidad de Navarra: | https://unika.unav.edu/discovery/fulldisplay?docid=alma991002730909708016&context=L&vid=34UNAV_INST:VU1&search_scope=34UNAV_TODO&tab=34UNAV_TODO&lang=es |
| Descripción Física: | 505 p. ; 24 cm |
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| ISBN: | 9781852339418 |
