TEI'22 : proceedings of the Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction : 13-16 February 2022

TEI'22 proceedings of the Sixteenth International Conference on Tangible, Embedded, and Embodied Interaction : 13-16 February 2022

Detalles Bibliográficos
Autores Corporativos: International Conference on Tangible, Embedded and Embodied Interaction (-), Association for Computing Machinery, author, issuing body (author), Han'guk Kwahak Kisurwŏn, host intitution (host intitution), SIGCHI (Group : U.S.), sponsoring body (sponsoring body)
Formato: Libro electrónico
Idioma:Inglés
Publicado: New York : Association for Computing Machinery 2022.
Colección:ACM Conferences
Materias:
Embedded computer systems > Congresses.
Interactive computer systems > Congresses.
User interfaces (Computer systems) > Congresses.
Virtual reality > Congresses.
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009714494306719
Descripción
Notas:Conference held online due to COVID-19.
Descripción Física:1 online resource (758 pages) : illustrations
Bibliografía:Includes bibliographical references.

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