WAIE 2019 proceedings of the International Workshop on Artificial Intelligence and Education

It is our pleasure to introduce the Proceedings of the 2019 International Workshop on Artificial Intelligence and Education (WAIE 2019). It has been taken place in Singapore during November 25-27, 2019, with technical sponsorship of Université de Montréal, Canada and Okayama University, Japan.

Detalles Bibliográficos
Autor principal: Association for Computing Machinery (author)
Autor Corporativo: Association for Computing Machinery, author, issuing body (author)
Formato: Libro electrónico
Idioma:Inglés
Publicado: New York, New York : Association for Computing Machinery 2019.
Colección:ACM international conference proceeding series.
Materias:
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009714421306719
Descripción
Sumario:It is our pleasure to introduce the Proceedings of the 2019 International Workshop on Artificial Intelligence and Education (WAIE 2019). It has been taken place in Singapore during November 25-27, 2019, with technical sponsorship of Université de Montréal, Canada and Okayama University, Japan.
Descripción Física:1 online resource (44 pages) : illustrations