TEI '08 : second International Conference on Tangible and Embedded Interaction : February 18-20 2008, Bonn, Germany : conference proceedings

Bibliographic Details
Main Author: International Conference on Tangible and Embedded Interaction (corporate author)
Corporate Authors: International Conference on Tangible and Embedded Interaction Corporate Author (corporate author), Conference on Tangible and Embedded Interaction 2008 (-), Association for Computing Machinery-Digital Library
Format: eBook
Language:Inglés
Published: [Place of publication not identified] ACM 2008
Series:ACM Other conferences
Subjects:
See on Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009714199006719

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