TEI '08 : second International Conference on Tangible and Embedded Interaction : February 18-20 2008, Bonn, Germany : conference proceedings

Detalles Bibliográficos
Autor principal:	International Conference on Tangible and Embedded Interaction (corporate author)
Autores Corporativos:	International Conference on Tangible and Embedded Interaction Corporate Author (corporate author), Conference on Tangible and Embedded Interaction 2008 (-), Association for Computing Machinery-Digital Library
Formato:	Libro electrónico
Idioma:	Inglés
Publicado:	[Place of publication not identified] ACM 2008
Colección:	ACM Other conferences
Materias:	Electrical & Computer Engineering Engineering & Applied Sciences Telecommunications
Ver en Biblioteca Universitat Ramon Llull:	https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009714199006719

Descripción
Notas:	Bibliographic Level Mode of Issuance: Monograph
Descripción Física:	1 online resource (267 pages)

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