| Sumario: | Welcome to the 16th ACM International Symposium on Mobility Management and Wireless Access - MobiWac 2018. This year, MobiWac takes place in Montreal, Canada, and it continues its successful track record of being a forum that brings together scientists, engineers, and practitioners to share experiences and discuss novel advances in mobility management and wireless access related topics, aiming at advancing knowledge and identifying new directions for future research and development. The call for papers attracted a large number of very high-quality submissions worldwide, which made the selection process difficult and competitive. The accepted papers, which represents 26% acceptance rate, cover a wide variety of topics, including mobility management, wireless access, vehicular networks, low power and lossy networks, localization and tracking, quality of service, security and applications. The accepted papers come from 10 countries, which reflects the international nature of the symposium. This year, the best paper award will be selected by a committee composed of well-known and internationally respected researchers in the fields of mobility management and wireless networking. The winner will be announced at the conference banquet and will be reported in the proceedings of MobiWac 2019. At this point, we take the opportunity to congratulate the winners of the best paper award for MobiWac 2017: "Design and Analysis of Virtualized Caching Service on Cellular Infrastructure," S. M. Y. Shin, S. Chung, and S. Kim (Yonsei University, Korea) Sewing together MobiWac 2018 required a team effort. We would like to thank the authors for their contributions to the sustained growth of the symposium. We also would like to express our deep appreciation to the numerous researchers who served on the Technical Program Committee and as external reviewers. We would further like to thank the Steering Committee for their guidance and support with the advices during the planning of the symposium, local arrangements, and ACM production of the proceedings. Finally, we would like to express our gratitude to our sponsor, ACM and ACM SIGSIM for their continued support of these successful symposia.
|
|---|
