Bibliographic Details
Corporate Authors: |
ACM SIGPLAN/SIGBED Conference on Languages, Compilers, and Tools for Embedded Systems
(-),
ACM Special Interest Group on Programming Languages, sponsoring body
(sponsoring body),
Association for Computing Machinery. Special Interest Group on Embedded Systems, sponsoring body |
Other Authors: |
Kuo, Tei-Wei, editor
(editor),
Whalley, David B., editor |
Format: | eBook
|
Language: | Inglés |
Published: |
New York :
ACM
2016.
|
Series: | ACM Conferences
|
Subjects: | |
See on Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009713930706719 |