International Workshop on System-Level Interconnect Prediction, Association for Computing Machinery, sponsoring body, Institute of Electrical and Electronics Engineers, sponsoring body, Ho, T., & Taskin, B. (2016). SLIP '16: Proceedings of the 18th ACM/IEEE System Level Interconnect Prediction 2016 Workshop : 2016, Austin, TX, USA. ACM.
Cita Chicago Style (17a ed.)International Workshop on System-Level Interconnect Prediction, sponsoring body Association for Computing Machinery, sponsoring body Institute of Electrical and Electronics Engineers, Tsung-Yi Ho, y Baris Taskin. SLIP '16: Proceedings of the 18th ACM/IEEE System Level Interconnect Prediction 2016 Workshop : 2016, Austin, TX, USA. New York: ACM, 2016.
Cita MLA (9a ed.)International Workshop on System-Level Interconnect Prediction, et al. SLIP '16: Proceedings of the 18th ACM/IEEE System Level Interconnect Prediction 2016 Workshop : 2016, Austin, TX, USA. ACM, 2016.