SLIP '16 : proceedings of the 18th ACM/IEEE System Level Interconnect Prediction 2016 Workshop : 2016, Austin, TX, USA

SLIP '16 proceedings of the 18th ACM/IEEE System Level Interconnect Prediction 2016 Workshop : 2016, Austin, TX, USA

Detalles Bibliográficos
Autores Corporativos: International Workshop on System-Level Interconnect Prediction (-), Association for Computing Machinery, sponsoring body (sponsoring body), Institute of Electrical and Electronics Engineers, sponsoring body
Otros Autores: Ho, Tsung-Yi, editor (editor), Taskin, Baris, editor
Formato: Libro electrónico
Idioma:Inglés
Publicado: New York : ACM 2016.
Colección:ACM Conferences
Materias:
Interconnects (Integrated circuit technology) > Congresses.
Semiconductors > Junctions > Mathematical models > Congresses.
Multiprocessors > Congresses.
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009713929006719
Descripción
Descripción Física:1 online resource (57 pages)

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