Materials characterization introduction to microscopic and spectroscopic methods
This book covers state-of-the-art techniques commonly used in modern materials characterization. Two important aspects of characterization, materials structures and chemical analysis, are included. Widely used techniques, such as metallography (light microscopy), X-ray diffraction, transmission and...
| Main Author: | |
|---|---|
| Format: | eBook |
| Language: | Inglés |
| Published: |
Singapore ; Hoboken, NJ :
J. Wiley
c2008.
|
| Subjects: | |
| See on Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009665116306719 |
Table of Contents:
- MATERIALS CHARACTERIZATION Introduction to Microscopic and Spectroscopic Methods; Contents; Preface; 1 Light Microscopy; 1.1 Optical Principles; 1.1.1 Image Formation; 1.1.2 Resolution; 1.1.3 Depth of Field; 1.1.4 Aberrations; 1.2 Instrumentation; 1.2.1 Illumination System; 1.2.2 Objective Lens and Eyepiece; 1.3 Specimen Preparation; 1.3.1 Sectioning; 1.3.2 Mounting; 1.3.3 Grinding and Polishing; 1.3.4 Etching; 1.4 Imaging Modes; 1.4.1 Bright-Field and Dark-Field Imaging; 1.4.2 Phase Contrast Microscopy; 1.4.3 Polarized Light Microscopy; 1.4.4 Nomarski Microscopy
- 1.4.5 Fluorescence Microscopy1.5 Confocal Microscopy; 1.5.1 Working Principles; 1.5.2 Three-Dimensional Images; References; Questions; 2 X-ray Diffraction Methods; 2.1 X-ray Radiation; 2.1.1 Generation of X-rays; 2.1.2 X-ray Absorption; 2.2 Theoretical Background of Diffraction; 2.2.1 Diffraction Geometry; 2.2.2 Diffraction Intensity; 2.3 X-ray Diffractometry; 2.3.1 Instrumentation; 2.3.2 Samples and Data Acquisition; 2.3.3 Distortions of Diffraction Spectra; 2.3.4 Applications; 2.4 Wide Angle X-ray Diffraction and Scattering; 2.4.1 Wide Angle Diffraction; 2.4.2 Wide Angle Scattering
- ReferencesQuestions; 3 Transmission Electron Microscopy; 3.1 Instrumentation; 3.1.1 Electron Sources; 3.1.2 Electromagnetic Lenses; 3.1.3 Specimen Stage; 3.2 Specimen Preparation; 3.2.1 Pre-Thinning; 3.2.2 Final Thinning; 3.3 Image Modes; 3.3.1 Mass-Density Contrast; 3.3.2 Diffraction Contrast; 3.3.3 Phase Contrast; 3.4 Selected Area Diffraction; 3.4.1 Selected Area Diffraction Characteristics; 3.4.2 Single-Crystal Diffraction; 3.4.3 Multi-Crystal Diffraction; 3.4.4 Kikuchi Lines; 3.5 Images of Crystal Defects; 3.5.1 Wedge Fringe; 3.5.2 Bending Contours; 3.5.3 Dislocations; References
- Questions4 Scanning Electron Microscopy; 4.1 Instrumentation; 4.1.1 Optical Arrangement; 4.1.2 Signal Detection; 4.1.3 Probe Size and Current; 4.2 Contrast Formation; 4.2.1 ElectronSpecimen Interactions; 4.2.2 Topographic Contrast; 4.2.3 Compositional Contrast; 4.3 Operational Variables; 4.3.1 Working Distance and Aperture Size; 4.3.2 Acceleration Voltage and Probe Current; 4.3.3 Astigmatism; 4.4 Specimen Preparation; 4.4.1 Preparation for Topographic Examination; 4.4.2 Preparation for Micro-Composition Examination; 4.4.3 Dehydration; References; Questions; 5 Scanning Probe Microscopy
- 5.1 Instrumentation5.1.1 Probe and Scanner; 5.1.2 Control and Vibration Isolation; 5.2 Scanning Tunneling Microscopy; 5.2.1 Tunneling Current; 5.2.2 Probe Tips and Working Environments; 5.2.3 Operational Modes; 5.2.4 Typical Applications; 5.3 Atomic Force Microscopy; 5.3.1 Near-Field Forces; 5.3.2 Force Sensors; 5.3.3 Operational Modes; 5.3.4 Typical Applications; 5.4 Image Artifacts; 5.4.1 Tip; 5.4.2 Scanner; 5.4.3 Vibration and Operation; References; Questions; 6 X-ray Spectroscopy for Elemental Analysis; 6.1 Features of Characteristic X-rays; 6.1.1 Types of Characteristic X-rays
- 6.1.2 Comparison ofK,L andM Series
