Technology of Welding and Joining

Technology of Welding and Joining

In this book, you will find information on new materials and new welding technologies. Problems related to the welding of difficult-to-weld materials are considered and solved. The latest welding technologies and processes are presented. This book provides an opportunity to learn about the latest tr...

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Bibliographic Details
Other Authors: Węgrzyn, Tomasz (Editor)
Format: eBook
Language:Inglés
Published: Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute 2021
Subjects:
Technology: general issues
laser cladding
cryogenic conditions
Fe-based coatings
fiber laser
molybdenum alloy
welding
status
progress
high-energy ball milling
soldering
joining
microstructure
interface
Kovar alloy
DM305 electronic glass
glass solder
low temperature sealing
tin
electrochemical migration
dendrite
inhibitor
heat dissipation
interfacial heat transfer
SLID
Cu/Ga
low temperature bonding
thermal interface material (TIM)
spray-deposited Al-Cu-Li alloy
GTAW
welded joint
performance analysis
heat resistant steels
post-weld heat treatment
mechanical properties
stainless steels
weldability
aggressive environments
marine environments
heat input
laser welding
amorphous alloy
weld quality
three-dimensional metal waveguide components
ultrasonic welding
electron backscattered diffraction (EBSD)
finite element method
recrystallization
civil engineering
mechanical engineering
transport
smart city
micro-jet welding
mechanical resistance
mini-specimen
fracture
fatigue limit
See on Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009654613406719
Description
Summary:In this book, you will find information on new materials and new welding technologies. Problems related to the welding of difficult-to-weld materials are considered and solved. The latest welding technologies and processes are presented. This book provides an opportunity to learn about the latest trends and developments in the welding industry. Enjoy reading.
Physical Description:1 electronic resource (196 p.)

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