Advanced adhesives in electronics materials, properties and applications
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and pr...
| Otros Autores: | , |
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Cambridge :
Woodhead Pub
2011.
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| Edición: | 1st edition |
| Colección: | Woodhead Publishing Series in Electronic and Optical Materials
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| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009628399106719 |
| Sumario: | Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for |
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| Notas: | Description based upon print version of record. |
| Descripción Física: | 1 online resource (279 p.) |
| Bibliografía: | Includes bibliographical references and index. |
| ISBN: | 9780857092892 |
