Soldering in electronics assembly
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a phot...
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Oxford ; Boston :
Newnes
1999.
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| Edición: | 2nd ed |
| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009627303606719 |
Tabla de Contenidos:
- Front Cover; Soldering in Electronics Assembly; Copyright Page; Contents; Foreword; Preface; Acknowledgements; Chapter 1. Soldering process; Time on its side; Printed circuit board; Soldering; Soldering processes; Component/solder (CS) processes; Solder/component (SC) processes; Cleaning; Quality; Safety; Chapter 2. Electronics assemblies; Joints; Through-hole joints; Surface mounted components; Surface mounted joints; Assembly variations; Assembly classification; Chapter 3. Solder; Metallurgical properties of tin/lead alloys; The soldered joint; Solderability; Protective coatings
- Chapter 4. Lead-free solderWhat's needed in the future?; Lead-free soldering - now a hot topic!; The age of lead-free soldering is approaching fast; ITRI; Chapter 5. Flux; Need for flux; How fluxes work; Categorization of fluxes; Choosing a flux; Application of fluxes; SC soldering process flux; Chapter 6. Solder paste; Solder paste or adhesive application; Dispensing; Pin transfer; Using solder paste; Solder paste parameters; Chapter 7. CS soldering processes; Hand soldering; Mass CS soldering processes; Inert atmosphere soldering; Handling assemblies; Solder pots and pumps
- Solder pot heatersSoldering; Soldering process monitoring; Chapter 8. SC soldering processes; Heat application; Infra-red soldering; Hot air convection; Hot vapour soldering; Laser soldering; Light beam soldering; Heated collet or hot bar; Miscellaneous SC soldering processes; Comparison of soldering processes; Chapter 9. Profiling soldering processes; Profiles; Infra-red soldering temperature profiles; Hot vapour soldering temperature profiles; Heated collet temperature profiles; Optimizing temperature profiles; Chapter 10. Cleaning soldered assemblies; The Montreal Protocol
- Why clean at all?Contamination; Classifications of cleaner; Cleaning processes; Contamination testing; Comparing the cleaning options; Chapter 11. Avoiding problems - soldering quality; Have problems occurred?; Statistical process control; Solutions to problems; Criteria for the assessment of soldered joints; Characteristics of soldered joints; Classification of soldered joints; Features of solder joints on surface mounted boards; X-ray inspection; Visual inspection standards; Photographic guide to defects; Chapter 12. Standards & specifications; Why comply with standards
- Reference to standardsLevels of standards; Standards organizations and bodies; Standards for electronics assembly manufacture; Guide to relevant worldwide standards; Glossary; References; Further reading; Worldwide addresses; Appendix 1. Why not blame the machine?; Appendix 2. Problems & solutions; Appendix 3. Soldering safety; Appendix 4. Comparing soldering processes & machines; Index
