Tabla de Contenidos: “…Rice Husk, andPineapple Waste for Fabrication of Super Capacitor -- 9.5 Factors Contributing in the Fabrication of Super Capacitor from Agro Waste -- 9.6 Conclusion -- Acknowledgment -- References -- 10 Computational Intelligence Techiques for Optimization in Networks Ashu Gautam and Rashima Mahajan -- 10.1 Introduction Focussing on Pedagogy of Impending Approach -- 10.1.1 Security Challenge in Networks -- 10.1.2 Attacks Vulnerability in Complex Networks -- 10.2 Relevant Analysis -- 10.3 Broad Area of Research -- 10.3.1 Routing Protocols -- 10.3.2 Hybrid Protocols -- 10.4 Problem Identification -- 10.5 Objectives of the Study -- 10.6 Methodology to be Adopted -- 10.7 Proposed/Expected Outcome of the Research -- References -- 11 R&D Export and ICT Regimes in India Zeba -- 11.1 Introduction -- 11.2 Artificial Intelligence: the ..…”

Tabla de Contenidos: “…LAS LENGUAS Y LOS MEDIOS: UNA HISTORIA DE MÁS DE CINCO SIGLOS(pp. 1217-1240) -- Raúl Ávila -- https://www.jstor.org/stable/j.ctt1657th3.11 -- En la actualidad, en las habitaciones de los hoteles se ofrece al viajero, como algo normal, un televisor, una radio, un teléfono y, cada vez más frecuentemente, una conexión para internet1…”
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“…Archaeologists exploited these factors to gain public and financial support and interest, and build and maintain a reading public for their work, supported by the seasonal nature of excavation and tourism. …”

Tabla de Contenidos: “…SOMBRAS DE CINE": UNIDAD DIDÁCTICA EN EDUCACIÓN PRIMARIA COMBINANDO EL TEATRO DE SOMBRAS CON EL SÉPTIMO ARTE -- CAPÍTULO 35.ANAÍSIS DEL PENSAMIENTO CIENTÍFICO EN ESTUDIANTES DE PREGRADO Y POSTGRADO.EL CASO DE HONDURAS -- CAPÍTULO 36.FORMACIÓN DE TUTORES DE RESILIENCIA, UNA MIRADA TRANSCULTURAL DE LAS COMPETENCIAS DOCENTES -- CAPÍTULO 37.ESCUELAS Y COMUNIDAD: LA COLABORACIÓN ENTRE CENTROS EDUCATIVOS Y RECURSOS DEL ENTORNO COMO BASE PARA LA ATENCIÓN A LA DIVERSIDAD CULTURAL -- CAPÍTULO 38.EL JAZZ EN LAS ENSEÑANZAS PROFESIONALES DE MÚSICA.UNA MIRADA A LOS PROYECTOS DE INNOVACIÓN EDUCATIVA: EL CASO DEL CAMM -- CAPÍTULO 39.FROM VOIDNESS TO LANGUAGE: THE SIGN LANGUAGE INTERPRETER IN HIGHER EDUCATION -- CAPÍTULO 40.LA COMPETENCIA EMOCIONAL Y EL RENDIMIENTO ACADÉMICO EN EL MARCO DE LA PANDEMIA -- CAPÍTULO 41.FACTORES QUE AFECTAN A MENORES NO ACOMPAÑADOS EN EL ÁMBITO EUROPEO: UNA REVISIÓN SISTEMÁTICA -- CAPÍTULO 42.LA DIVERSIDAD FAMILIAR DESDE LA PERSPECTIVA DEL ALUMNADO DE EDUCACIÓN INFANTIL -- CAPÍTULO 43.PROMOVIENDO LA REFLEXIÓN Y EL PENSAMIENTO CRÍTICO EN LA FORMACIÓN INICIAL DEL PROFESORADO DE CIENCIAS DE EDUCACIÓN SECUNDARIA -- CAPÍTULO 44.MARCA PERSONAL INCLUSIVA: CÓMO LOGRARLO A TRAVÉS DE UN PROYECTO DE INNOVACIÓN DOCENTE -- CAPÍTULO 45.LA LITERATURA PARA UNA EDUCACIÓN INTERCULTURAL E INCLUSIVA: EL TRATAMIENTO DE LA DIFERENCIA EN LA ISLA (ARMIN GREDER) -- CAPÍTULO 46.PUNTO DE PARTIDA: LAS EMOCIONES TRAS EL CONFINAMIENTO DEL PROFESORADO -- CAPÍTULO 47.…”

“…Optimize projects with best practice bread boarding and wire management techniques Build-in comms capability with LoRa radios, Xbees, Bluetooth LE, and cellular networks Enable WiFi Internet access; connect to Cloud services; talk to iOS and Android phones Measure time, store data to non-volatile memory, and read/write to SD cards Discover flex PCBs, watch form factors, and other techniques for making wearables Explore enclosure options like laser cut, 3D printed, and commercial enclosures Get tips on avoiding regulatory problems and bringing a prototype to market Marc De Vinck is the Dexter F. …”

“…The quantitative analysis uses a gravity model and finds compelling evidence that the introduction of SDOC in the EU was a factor that influenced the evolution of import flows into EU markets positively. …”

“…La crisis económica ha obligado a reducir los presupuestos de las radiotelevisiones públicas, lo que está repercutiendo en la calidad de su servicio. Además, factores como la instrumentalización política o la corrupción en su gestión económica, han generado fuertes críticas hacia el papel de estos medios de titularidad pública en nuestra sociedad. …”

“…Kai has authored a number of books on leadership and cyber security , has been published extensively in print and online, has appeared on radio and television, and has featured in printed media. …”

Tabla de Contenidos: “…LOCOS-bound Lateral N-Well to N-Well Bipolar ESD Element 738 16.13 LOCOS-bound Lateral N+ to N-well Bipolar ESD Element 738 16.14 LOCOS-bound Lateral pnp Bipolar ESD Element 739 16.15 LOCOS-bound Thick Oxide MOSFET ESD Element 739 16.16 Shallow Trench Isolation 739 16.17 STI-bound ESD Structures 741 16.18 Substrate Modeling - Electrical and Thermal Discretization 746 16.19 Heavily Doped Substrates 750 16.20 Retrograde Wells and ESD Scaling 766 16.21 Triple Well and Isolated MOSFET CMOS 775 16.22 Summary and Closing Comments 779 References 779 17 ESD in Silicon on Insulator 783 17.1 Silicon on Insulator (SOI) Technologies 783 17.2 Elimination of CMOS Latchup 784 17.3 Lack of Vertical Bipolar Transistors 785 17.4 Floating Gate Tie Downs 785 17.5 Physical Separation of MOSFETs from the Bulk Substrate 785 17.6 SOI ESD Design Fundamental Concepts 786 17.7 SOI Lateral Diode Structure 791 17.8 Transistors - Bulk versus SOI Technology 791 17.9 SOI Buried Resistors (BR) Elements 796 17.10 Dynamic Threshold MOS (DTMOS) SOI MOSFET 797 17.11 SOI P+ Body Contact Abutting n+ Drain 798 17.12 Transmission Line Pulse (TLP) Testing of SOI Diode Designs 798 17.13 SOI ESD with MOSFET Drain and Body Width Ratio Variation 799 17.14 SOI Dual-Gate MOSFET Structure 799 17.15 SOI ESD Design - Mixed Voltage T-Shape Layout Style 800 17.16 SOI ESD Design: Double Diode Network 802 17.17 Bulk to SOI ESD Design Remapping 803 17.18 SOI ESD Diode Design Parameters 804 17.19 SOI ESD Design in Mixed Voltage Interface Environments 808 17.20 Comparison of Bulk with SOI ESD Results 809 17.21 SOI ESD Design with Aluminum Interconnects 810 17.22 SOI ESD Design with Copper Interconnects 812 17.23 SOI ESD Design with Gate Circuitry 813 17.24 Summary and Closing Comments 815 References 815 18 ESD in Analog Circuits 821 18.1 Analog Design Circuits 821 18.2 Single-ended Receivers 822 18.3 Schmitt Trigger Receivers 822 18.4 Differential Receivers 822 18.5 Comparators 824 18.6 Current Sources 825 18.7 Current Mirrors 825 18.8 Widlar Current Mirror 826 18.9 Wilson Current Mirror 826 18.10 Voltage Regulators 827 18.11 Buck Converters 828 18.12 Boost Converters 828 18.13 Buck-Boost Converters 829 18.14 Cuk Converters 830 18.15 Voltage Reference Circuits 830 18.16 Brokaw Bandgap Voltage Reference 830 18.17 Converters 831 18.18 Analog-to-Digital Converter (ADC) 831 18.19 Digital-to-Analog Converters (DAC) 832 18.20 Oscillators 832 18.21 Phase Lock Loop (PLL) Circuits 832 18.22 Delay Locked Loop (DLL) 833 18.23 Analog and ESD Design Synthesis 833 18.24 Analog Chip Architecture - Separation of Analog Power from Digital Power, AVDD-DVDD 836 18.25 ESD Failure in Phase Lock Loop (PLL) and System Clock 837 18.26 ESD Failure in Current Mirrors 837 18.27 ESD Failure in Schmitt Trigger Receivers 838 18.28 ESD Design Practice - Prevent ESD Failure in Schmitt Trigger 840 18.29 Analog-Digital Architecture: Isolated Digital and Analog Domains 841 18.30 ESD Protection Solution - Connectivity of AVDD-to-VDD 842 18.31 ESD Solution: Connectivity of AVSS-to-DVSS 843 18.32 Digital and Analog Domain with ESD Power Clamps 843 18.33 Digital and Analog Domain with Master-Slave ESD Power Clamps 846 18.34 High Voltage, Digital, and Analog Domain Floorplan 846 18.35 Floor-planning of Digital and Analog 846 18.36 Inter-domain Signal Lines ESD Failures 849 18.37 Digital-to-Analog Signal Line ESD Failures 849 18.38 Digital-to-Analog Core Spatial Isolation 851 18.39 Digital-to-Analog Core Ground Coupling 851 18.40 Digital-to-Analog Core Resistive Ground Coupling 852 18.41 Digital-to-Analog Core Diode Ground Coupling 852 18.42 Domain-to-Domain Signal Line ESD Networks 852 18.43 Domain-to-Domain Third-party Coupling Networks 853 18.44 Domain-to-Domain Cross-domain ESD Power Clamp 854 18.45 Digital-to-Analog Domain Moat 855 18.46 Analog and ESD Circuit Integration 855 18.47 Integrated Body Ties 856 18.48 Self-Protecting vs Non-self Protecting Designs 856 References 856 19 ESD in RF CMOS 865 19.1 CMOS and ESD 865 19.2 RF CMOS 865 19.3 RF CMOS and ESD 865 19.4 RF CMOS ESD Failure Mechanisms 865 19.5 RF CMOS - ESD Device Comparisons 866 19.6 RF ESD Metrics 867 19.7 Grounded Gate n-channel MOSFET versus STI Diode 868 19.8 Silicon-controlled Rectifier 869 19.9 SCR versus GGNMOS 869 19.10 Shallow Trench Isolation and Polysilicon Gated Diodes 869 19.11 RF ESD Design 870 19.12 RF ESD Design Layout - Circular RF ESD Devices 870 19.13 Disadvantage of RF ESD Circular Element 871 19.14 RF ESD Design - ESD Wiring Design 872 19.15 RF ESD Design - Loading Capacitance 872 19.16 Metal Capacitance 873 19.17 Analog Metal (AM) 873 19.18 RF ESD Design Practices 874 19.19 RF Passives - ESD and Schottky Barrier Diodes 874 19.20 Schottky Barrier Diodes and Metallurgy 875 19.21 Silicon Germanium Schottky Barrier Diodes 876 19.22 Schottky Barrier RF ESD Design Practice 877 19.23 RF Passives - ESD and Inductors 877 19.24 Quality Factor, Q 878 19.25 Incremental Model of an Inductor 878 19.26 Inductor Coil Parameters 878 19.27 RF Passives - ESD and Capacitors 882 19.28 Capacitors and RF Applications 882 19.29 Capacitors in ESD Networks 882 19.30 Types of Radio Frequency Capacitors 883 19.31 Metal-Oxide-Semiconductor and Metal-Insulator-Metal Capacitors 883 19.32 Varactors and Hyper-abrupt Junction Varactor Capacitors 884 19.33 Metal-ILD-Metal Capacitors 884 19.34 Vertical Parallel Plate (VPP) Capacitors 884 19.35 Tips: ESD RF Design Practices for Capacitors 885 19.36 Summary and Closing Comments 886 Problems 886 References 888 20 ESD in Silicon Germanium 891 20.1 Heterojunctions Bipolar Transistors 891 20.2 Silicon Germanium 891 20.3 Silicon Germanium HBT Devices 892 20.4 Silicon Germanium Device Structure 893 20.5 Silicon Germanium Film Deposition 894 20.6 Silicon Germanium Emitter-Base Region 895 20.7 Silicon Germanium Physics 895 20.8 Silicon Germanium Bandgap 896 20.9 Silicon Germanium Intrinsic Temperature 896 20.10 Position-dependent Silicon Germanium Profile 896 20.11 Position-dependent Intrinsic Temperature 897 20.12 SiGe Collector Current with Graded Germanium Concentration 897 20.13 Silicon Germanium ESD and Time Constants 898 20.14 Silicon Germanium Base Transit Time 898 20.15 Silicon Germanium Breakdown Voltages 898 20.16 Silicon Germanium ESD Measurements 899 20.17 Silicon Germanium Collector-to-Emitter ESD Stress 899 20.18 Transmission Line Pulse Testing of Silicon Germanium HBT 899 20.19 Transmission Line Pulse (TLP) I-V Characteristic 899 20.20 Wunsch-Bell Characteristic of Silicon Germanium HBT 901 20.21 Comparison of Silicon Germanium HBT and Silicon BJT 901 20.22 Wunsch-Bell Characteristic of SiGe HBT versus Si BJT 902 20.23 Intrinsic Base Resistance in SiGe HBT 904 20.24 SiGe HBT Electro-thermal HBM Simulation of Collector-Emitter Stress 904 20.25 Silicon Germanium Transistor Emitter-Base Design 905 20.26 Epitaxial-Base Hetero-Junction Bipolar Transistor (HBT) Emitter-Base Design 907 20.27 Self-aligned Silicon Germanium HBT Device 907 20.28 Non-Self Aligned Silicon Germanium HBT 908 20.29 Emitter-Base Design RF Frequency Performance Metrics 908 20.30 SiGe HBT Emitter-Base Resistance Model 909 20.31 SiGe HBT Emitter-Base Design and Silicide Placement 909 20.32 Silicide Material and ESD 910 20.33 Titanium Silicide and ESD 911 20.34 Cobalt Salicide 913 20.35 Self-aligned (SA) Emitter Base Design 914 20.36 Non-Self Aligned (NSA) Emitter Base Design 917 20.37 Non-Self Aligned HBT Human Body Model (HBM) Step Stress 918 20.38 Transmission Line Pulse (TLP) Step Stress 918 20.39 RF Testing of SiGe HBT Emitter-Base Configuration 921 20.40 Unity Current Gain Cutoff Frequency - Collector Current Plots 923 20.41 f MAX and f T 924 20.42 Electrothermal Simulation of Emitter-Base Stress 925 20.43 Field-Oxide (FOX) Isolation Defined Silicon Germanium Heterojunction Bipolar Transistor HBM Data 926 20.44 Silicon Germanium HBT Multiple-emitter Study 927 20.45 RF ESD Design Practice 927 20.46 Silicon Germanium ESD Failure Mechanisms 928 20.47 Summary and Closing Comments 928 References 928 21 ESD in Silicon Germanium Carbon 935 21.1 Heterojunctions and Silicon Germanium Carbon Technology 935 21.2 Silicon Germanium Carbon 935 21.3 Silicon Germanium Carbon Collector-Emitter ESD Measurements 937 21.4 Silicon Germanium Transistor Emitter-Base Design 940 21.5 Silicon Germanium Carbon - ESD-Induced S-Parameter Degradation 943 21.6 Silicon Germanium Carbon ESD Failure Mechanisms 945 21.7.…”

“…<br><br>SOBRE EL AUTOR<br><br><b>Boris Alexandre SPASOV</b>, "humanista", fue director delegado de Radio Del Caribe Internacional, en América Latina. …”
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“…La recerca es basa en un marc teòric que aborda el màrqueting de les arts, la comunicació en les arts, l'audiència de les arts escèniques, el procés de presa de decisions i els factors que afecten l'audiència i els patrons d'assistència. …”
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