Tabla de Contenidos: “…About the Author xxxvii Acknowledgements xxxix 1 ESD, EOS, EMI, EMC, and Latchup 1 1.1 Electrostatic Discharge (ESD) 1 1.2 Human Body Model (HBM) 2 1.3 Machine Model (MM) 3 1.4 Cassette Model 3 1.5 Charged Device Model (CDM) 4 1.6 Transmission Line Pulse (TLP) 5 1.7 Very Fast Transmission Line Pulse (VF-TLP) 8 1.8 Electrical Overstress (EOS) 8 1.9 Electrical Overstress (EOS) 8 1.10 EOS Sources - Lightning 9 1.11 EOS Sources - Electromagnetic Pulse (EMP) 9 1.12 EOS Sources - Machinery 10 1.13 EOS Sources - Power Distribution 10 1.14 EOS Sources - Switches, Relays, and Coils 10 1.15 EOS Design Flow and Product Definition 10 1.16 EOS Sources - Design Issues 11 1.17 Electromagnetic Interference (EMI) 12 1.18 Electromagnetic Compatibility (EMC) 13 1.19 Latchup 13 Questions and Answers 14 1.20 Summary and Closing Comments 15 References 15 2 ESD in Manufacturing 21 2.1 Flooring 21 2.2 Work Surfaces 21 2.3 Garments 22 2.4 Wrist Straps 22 2.5 Shoes - Footwear 22 2.6 Ionization 23 2.7 Clean Rooms 24 2.8 Carts 26 2.9 Shipping Tubes 26 2.10 Trays 27 2.11 Measurements 27 2.12 Verification 28 2.13 Audit 28 2.14 Triboelectric Charging - How Does it Happen? 29 2.15 Conductors, Semiconductors, and Insulators 30 2.16 Static Dissipative Materials 30 2.17 ESD and Materials 31 2.18 Electrification and Coulomb's Law 31 2.19 Electromagnetism and Electrodynamics 33 2.20 Electrical Breakdown 33 2.21 Electro-Quasistatics and Magnetoquasistatics 36 2.22 Electrodynamics and Maxwell's Equations 36 2.23 Electrostatic Discharge (ESD) 36 2.24 Electromagnetic Compatibility (EMC) 37 2.25 Electromagnetic Interference (EMI) 37 2.26 Fundamentals of Manufacturing and Electrostatics 37 2.27 Materials, Tooling, Human Factors, and Electrostatic Discharge 38 2.28 Materials and Human-induced Electric Fields 39 2.29 Manufacturing Environment and Tooling 39 2.30 Manufacturing Equipment and ESD Manufacturing Problems 39 2.31 Manufacturing Materials 39 2.32 Measurement and Test Equipment 40 2.33 Manufacturing Testing for Compliance 41 2.34 Grounding and Bonding Systems 42 2.35 Work Surfaces 42 2.36 Wrist Straps 43 2.37 Constant Monitors 43 2.38 Footwear 43 2.39 Floors 44 2.40 Personnel Grounding with Garments 44 2.41 Garments 44 2.42 Air Ionization 44 2.43 Seating 45 2.44 Packaging and Shipping 46 2.45 Trays 46 2.46 ESD Identification 46 2.47 ESD Program Auditing 46 2.48 ESD On-Chip Protection 47 2.49 ESD, EOS, EMI, EMC, and Latchup 47 2.50 Manufacturing Electrical Overstress (EOS) 48 2.51 EMI 50 2.52 EMC 50 2.53 Summary and Closing Comments 50 References 50 3 ESD Standards 55 3.1 Factory - Flooring 55 3.2 Factory - Resistance Measurement of Materials 56 3.3 JEDEC 58 3.4 International Electro-Technical Commission (IEC) 59 3.5 IEEE 59 3.6 Department of Defense (DOD) 59 3.7 Military Standards 59 3.8 SAE 60 3.9 Summary and Closing Comments 60 Questions and Answers 60 References 61 4 ESD Testing 65 4.1 Electrostatic Discharge (ESD) Testing 65 4.2 ESD Models 65 4.3 HBM Test System 69 4.4 HBM Two-pin Test System 69 4.5 Machine Model (MM) 69 4.6 Small Charge Model (SCM) 70 4.7 Small Charge Model Source 71 4.8 CDM Pulse Waveform 72 4.9 HMM Equivalent Circuit 77 4.10 HMM Test Equipment 77 4.11 HMM Test Configuration 78 4.12 HMM Fixture Board 78 4.13 Transmission Line Pulse (TLP) 82 4.14 TLP Test Systems 84 4.15 IEC 61000-4-2 87 4.16 Equivalent Circuit 89 4.17 Test Equipment 89 4.18 Cable Discharge Event (CDE) 90 4.19 CDE Pulse Waveform 93 4.20 Equivalent Circuit 93 4.21 Commercial Test Systems 94 4.22 Systems Electromagnetic Interference (EMI) 95 4.23 Electromagnetic Compatibility (EMC) 95 4.24 Electrical Overstress (EOS) 95 4.25 Latchup 95 4.26 Electrical Overstress (EOS) 95 4.27 EOS Sources - Lightning 96 4.28 EOS Sources - Electromagnetic Pulse (EMP) 97 4.29 Electromagnetic Compatibility 97 4.30 Summary and Closing Comments 100 References 100 5 ESD Device Physics 117 5.1 Electro-thermal Instability 117 5.2 Stable System 118 5.3 Unstable System 118 5.4 Differential Relation of Voltage and Current 120 5.5 Time Constant Hierarchy 121 5.6 Thermal Physics Time Constants 121 5.7 Adiabatic, Thermal Diffusion Time Scale and Steady State 121 5.8 Electro-quasistatic and Magnetoquasistatics 122 5.9 Electrical Instability 124 5.10 Thermal Physics Time Constants 125 5.11 Adiabatic, Thermal Diffusion Time Scale and Steady State 126 5.12 Electrical Instability and Breakdown 126 5.13 Spatial Instability and Electro-thermal Current Constriction 127 5.14 Equipotential Surface 127 5.15 Heat Flow 128 5.16 Conservation of Heat 128 5.17 Electric Potential and Temperature Gradient 128 5.18 Electric Energy, Resistivity, and Thermal Conductivity 129 5.19 Breakdown 131 5.20 Electron Current Continuity Relationship 136 5.21 Air Breakdown and Peak Currents 138 5.22 Electro-thermal Instability 139 5.23 Mathematical Methods - Green's Function and Method of Images 141 5.24 Mathematical Methods - Green's Function and Method of Images 143 5.25 Mathematical Methods - Integral Transforms of the Heat Conduction Equation 148 5.26 Flux Potential Transfer Relations Matrix Methodology 152 5.27 Heat Equation Variable Conductivity 154 5.28 Mathematical Methods - Boltzmann Transformation 156 5.29 Mathematical Methods - The Duhamel Formulation 158 5.30 Spherical Source Tasca Model 160 5.31 Wunsch-Bell Model 163 5.32 The Smith and Littau Model 166 5.33 The Arkihpov-Astvatsaturyan-Godovosyn-Rudenko Model 168 5.34 The Vlasov-Sinkevitch Model 169 5.35 The Dwyer, Franklin and Campbell Model 169 5.36 Negative Differential Resistor and Resistor Ballasting 174 5.37 Ash Model - Nonlinear Failure Power Thresholds 176 5.38 Statistical Models for ESD Prediction 178 5.39 Summary and Closing Comments 180 References 180 6 ESD Events and Protection Circuits 189 6.1 Human Body Model (HBM) 189 6.2 Machine Model (MM) 191 6.3 Charged Device Model 193 6.4 Human Metal Model (HMM) 197 6.5 IEC 61000-4-2 History 204 6.6 IEC 61000-4-5 209 6.7 Cable Discharge Event (CDE) 213 6.8 CDM Scope 215 References 219 7 ESD Failure Mechanism 235 7.1 Tables of CMOS ESD Failure Mechanisms 235 7.2 LOCOS Isolation-Defined CMOS 235 7.3 LOCOS-bound Thick Oxide MOSFET 241 7.4 LOCOS-Bound Structures 242 7.5 Shallow Trench Isolation (STI) 245 7.6 STI Pull-down ESD Failure Mechanism 245 7.7 STI Pull-Down and Gate Wrap-Around 246 7.8 MOSFETs 247 7.9 LOCOS-bound Thick Oxide MOSFET 252 7.10 Bipolar Transistor Devices 254 7.11 Silicide Blocked N-diffusion Resistors 259 7.12 Silicon Germanium ESD Failure Mechanisms 259 7.13 Silicon Germanium Carbon ESD Failure Mechanisms 259 7.14 Gallium Arsenide Technology ESD Failure Mechanisms 260 7.15 Indium Gallium Arsenide ESD Failure Mechanisms 261 7.16 Micro Electromechanical (MEM) Systems 263 7.17 Micro-mirror Array Failures 265 7.18 EOS Bond Pad and Interconnect Failure 269 7.19 Summary and Closing Comments 272 References 273 8 ESD Design Synthesis 281 8.1 ESD Design Synthesis and Architecture Flow 281 8.2 ESD Design - the Signal Path and the Alternate Current Path 287 8.3 ESD Electrical Circuit and Schematic Architecture Concepts 289 8.4 The Ideal ESD Network 289 8.5 Mapping Semiconductor Chips and ESD Designs 293 8.6 Mapping across Semiconductor Fabricators 294 8.7 ESD Design Mapping across Technology Generations 295 8.8 ESD Networks, Sequencing, and Chip Architecture 306 8.9 ESD Layout and Floorplan-related Concepts 314 8.10 ESD Architecture and Floor-planning 323 8.11 Digital and Analog CMOS Architecture 347 8.12 Digital and Analog Floorplan - Placement of Analog Circuits 348 8.13 Mixed-signal Architecture - Digital, Analog, and RF Architecture 350 8.14 Summary and Closing Comments 351 Questions 351 References 352 9 On-chip ESD Protection Circuits - Input Circuitry 363 9.1 Receivers and ESD 363 9.2 Receivers and Receiver Delay Time 363 9.3 ESD Loading Effect on Receiver Performance 364 9.4 Receivers and HBM 365 9.5 Receivers and CDM 366 9.6 Receivers and Receiver Evolution 368 9.7 Receiver Circuits with Half-pass Transmission Gate 368 9.8 Receiver with Full-pass Transmission Gate 371 9.9 Receiver, Half-pass Transmission Gate, and Keeper Network 373 9.10 Receiver, Half-pass Transmission Gate, and the Modified Keeper Network 377 9.11 Receiver Circuits with Pseudo-zero VT Half-pass Transmission Gates 379 9.12 Receiver with Zero VT Transmission Gate 381 9.13 Receiver Circuits with Bleed Transistors 383 9.14 Receiver Circuits with Test Functions 384 9.15 Receiver with…”

“…The indexing terms are essentially collected from thesauri, and are not controlled, the same happening to the subject headings in their syntax. …”
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“…Die Autorin zeigt Ihnen, wie wie Sie Ihren eigenen Weg finden und den Flow für bessere fotografische Leistungen und mehr Spaß an der Kreativität anwenden können Biographical note: In Pia Parolin schlagen zwei Herzen: sie ist Biologin und Fotografin, Italienerin und Deutsche, lebt in Deutschland und Frankreich, liebt die Natur- und die Straßenfotografie. …”

“…. - Burhan Ul Haq, Director of Products, Enablers Both broader and deeper than I expected. - Maxim Volgin, Quantitative Marketing Manager, KLM Great book with actionable insights. - Simon Tschk̲e, Head of Research, German Edge Cloud…”

“…Quarante ans plus tard, il a entame le classement et l'edition des inventaires des archives de plusieurs protagonistes du concile: Suenens, Charue, De Smedt, Heuschen, Philips, Willebrands, Heylen, Lanne. La decouverte de documents inedits fut ... l'origine de la publication d'un certain nombre d'articles qui concernent des acteurs belges et de la mise sous les projecteurs de quelques peripeties moins connues mais cruciales de l'histoire conciliaire et postconciliaire (notamment la reponse des eveques belges au Questionnaire du cardinal Ottaviani en 1966, et la reaction du cardinal Suenens et de l'episcopat belge a l'encyclique Humanae vitae en 1968). …”

“…Anders, who was also a student of Edmund Husserl, described Rodin's sculptural images of the human body as artistic expressions of an historical experience of loss and isolation, as objects which could stimulate a deepened reflection about modernity as crises. Josef Schmoll gen. …”

“…From planning to administering to the logging that happens continuously thereafter, the topics in this lesson should serve you for many years to come. …”

“…“While directors know reputation is important, it often is treated as a vague ‘good’ until something bad happens. Nir Kossovsky does a great job, with many examples, of connecting reputation to stock price and to behaviors, before and after crises. …”

“…Also get to know the dangers of Find My stalking and how to identify the risk, deter unwanted tracking from happening, block it if you find it--and report it to law enforcement or get other help. …”

“…Dieser praktische Leitfaden zeigt Ihnen, wie Kubernetes und die Container-Technologie dabei helfen können, in Bezug auf Schnelligkeit, Agilität, Zuverlässigkeit und Effizienz in ganz neue Bereiche vorzudringen.Die Autoren Brendan Burns, Joe Beda und Kelsey Hightower haben bei Google und in anderen Firmen mit Kubernetes gearbeitet und erklären Ihnen, wie sich dieses System in den Lebenszyklus einer verteilten Anwendung einfügt. …”

“…Manage your media: What happens when a backup drive fills up, or becomes so old that you worry about its future reliability? …”

“…Both polycystic kidney disease’s forms have a pathogeny and similar clinic, but in the patients with mutation in PKD2, the clinical manifestations appear later and the progression to end stage renal failure happens 10 years later than in the patients with mutation in PKD1. …”
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“…Academics and practitioners in spatial design disciplines (architecture, urban design, etc.) are showing increasing interest in collaborating with engineers/scientists, and a new generation of design firms specializing in providing tailored ISS solutions have appeared as well. This is all happening in the broader context of a country with deep traditions of art and culture, and we hope conference participants will find this setting ideal for contemplating how this exciting field of research will shape and integrate into the world in the years to come. …”

“…In the end, the volume contributes to a deeper understanding of the ambivalence inherent to modern reproduction Der Band bietet eine umfassende historische Rekonstruktion von politischen Strategien, Konflikten, Haltungen und Normierungen, die das heterogene Feld der menschlichen Reproduktion, verstanden als sowohl Fortpflanzung als auch Obsorge über Kinder umfassend, durchziehen. …”

“…With this episode, you'll see how Acceptance Tests turn out to be completely unique from all other tests in ONE very important way and have all the foundations in place to delve deeper into the specifics of Acceptance Testing in the rest of this series. …”

“…Humanism, baroque and enlightenment, three currents which are amply discussed in the present volume, could more easily expand from Italy to Austria because of the before described dynastical connections and they established themselves still deeper because of the immigration or the long stays of Italian authors in the cultural centers of the Austrian monarchy, first of all of course in Vienna. …”

“…In this context, this study was created with the aim of providing the phenomenon of attribution in newspaper discourse with deeper insights that help improve the knowledge about language event's reports in science popularization articles. …”
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“…Andererseits kommen qualitative Quellen zum Einsatz, mit denen Aspekte von Mobilität aus einer individuellen Ebene herausgearbeitet werden und die helfen, längerfristige Trends auszuleuchten oder zu hinterfragen. …”

“…Your security perimeter is defined by wherever your information and people happen to be. We are attacked by professional adversaries who are better funded than we will ever be. …”