Tabla de Contenidos: “…9.3.1.2 Jetting Regime as Function of Fluid Properties and Laser Fluence -- 9.3.1.3 Jettability Phase Diagram -- 9.3.2 Jet Formation Dynamics during Laser Printing of Viscoelastic Alginate Solutions -- 9.3.2.1 Ink Coating Preparation and Design of Experiments -- 9.3.2.2 Typical Jetting Regimes -- 9.3.2.3 General Observation of the Jetting Dynamics -- 9.3.2.4 Effects of Laser Fluence on Jetting Dynamics -- 9.3.2.5 Effects of Alginate Concentration on Jetting Dynamics -- 9.3.2.6 Jettability Phase Diagram -- 9.4 Laser Printing Applications Using Optimized Printing Conditions -- 9.5 Conclusions and Future Work -- Acknowledgments -- References -- Chapter 10 Congruent LIFT with High‐Viscosity Nanopastes -- 10.1 Introduction -- 10.2 Congruent LIFT (or LDT) -- 10.3 Applications -- 10.4 Achieving Congruent Laser Transfers -- 10.5 Issues and Challenges -- 10.6 Summary -- Acknowledgment -- References -- Chapter 11 Laser Printing of Nanoparticles -- 11.1 Introduction, Setup, and Motivation -- 11.2 Laser‐Induced Transfer -- 11.3 Materials for Laser Printing of Nanoparticles -- 11.4 Laser Printing from Bulk‐Silicon and Silicon Films -- 11.5 Magnetic Resonances of Silicon Particles -- 11.6 Laser Printing from Prestructured Films -- 11.7 Applications: Sensing, Metasurfaces, and Additive Manufacturing -- 11.8 Outlook -- References -- Part III Applications -- Chapter 12 Laser Printing of Electronic Materials -- 12.1 Introduction and Context -- 12.2 Organic Thin‐Film Transistor -- 12.2.1 Operation and Characteristics of OTFTs -- 12.2.2 Laser Printing of the Semiconductor Layer -- 12.2.3 Laser Printing of Dielectric Layers -- 12.2.4 Laser Printing of Conducting Layers -- 12.2.5 Single‐Step Printing of Full OTFT Device -- 12.3 Organic Light‐Emitting Diode -- 12.4 Passive Components -- 12.5 Interconnection and Heterogeneous Integration -- 12.6 Conclusion -- References…”

Tabla de Contenidos: “…10.4.2 - Lightning and Thunderstorms -- 10.4.3 - Aircraft Impact -- 10.4.3.1 - Background -- 10.4.3.2 - Airfield Proximity -- 10.4.4 - Earthquake -- 10.4.5 - Meteorological Factors -- 10.4.6 - Other Consequences -- Part 4 - Achieving Reliability and Maintainability -- Chapter 11 - Design and Assurance Techniques -- 11.1 - Specifying and Allocating the Requirement -- 11.2 - Stress Analysis -- 11.3 - Environmental Stress Protection -- 11.4 - Failure Mechanisms -- 11.4.1 - Types of Failure Mechanism -- 11.4.2 - Failures in Semiconductor Components -- 11.4.3 - Discrete Components -- 11.5 - Complexity and Parts -- 11.5.1 - Reduction of Complexity -- 11.5.2 - Part Selection -- 11.5.3 - Redundancy -- 11.6 - Burn-In and Screening -- 11.7 - Maintenance Strategies -- Chapter 12 - Design Review, Test and Reliability Growth -- 12.1 - Review Techniques -- 12.2 - Categories of Testing -- 12.2.1 - Environmental Testing -- 12.2.2 - Marginal Testing -- 12.2.3 - High-Reliability Testing -- 12.2.4 - Testing for Packaging and Transport -- 12.2.5 - Multiparameter Testing -- 12.2.6 - Step-Stress Testing -- 12.3 - Reliability Growth Modeling -- 12.3.1 - The CUSUM Technique -- 12.3.2 - Duane Plots -- Chapter 13 - Field Data Collection and Feedback -- 13.1 - Reasons for Data Collection -- 13.2 - Information and Difficulties -- 13.3 - Times to Failure -- 13.4 - Spreadsheets and Databases -- Equipment code -- How found -- Type of fault -- Action taken -- Discipline -- Free text -- 13.5 - Best Practice and Recommendations -- 13.6 - Analysis and Presentation of Results -- 13.7 - Manufacturers' data -- 13.8 - Anecdotal Data -- 13.9 - Examples of Failure Report Forms -- 13.10 - No-Fault-Found (NFF) -- Chapter 14 - Factors Influencing Down Time -- 14.1 - Key Design Areas -- 14.1.1 - Access -- 14.1.2 - Adjustment -- 14.1.3 - Built-In Test Equipment…”

Tabla de Contenidos: “…Cover -- Dedication -- Preface -- Contents -- Part A: Electrical Fundamentals -- 1: Systems of Units -- 1.1 Introduction -- 1.2 Scientific Notation -- 1.3 Fundamental and Derived Units -- 1.3.1 Fundamental Units -- 1.3.2 Derived Units -- 1.4 Standards and Units -- 1.5 Systems of Units -- 1.6 The SI System of Units -- 1.7 Importance of SI System -- 1.8 Definitions -- Summary -- Multiple Choice Questions (MCQ) -- Conventional Questions (CQ) -- 2: Electrons in Action -- 2.1 Introduction -- 2.2 Conduction in Solids -- 2.3 Bonding in Atoms -- 2.4 Energy Bands -- 2.5 Electrons in Action -- 2.6 Direction of Current Flow -- 2.7 Diffusion Current Momentarily -- 2.8 Drift Velocity -- 2.9 The Nature of Electric Current -- 2.10 Effects of Electricity -- Summary -- Multiple Choice Questions (MCQ) -- Conventional Questions (CQ) -- 3: Electric Circuit -- 3.1 Introduction -- 3.2 Electric Circuit -- 3.3 Current -- 3.4 Electromotive Force -- 3.5 Reference Zero -- 3.6 Safety Precautions While Handling Electric Circuits -- 3.7 Insulators -- 3.8 Semiconductors -- 3.9 Conductors -- Summary -- Multiple Choice Questions (MCQ) -- Conventional Questions (CQ) -- 4: Simple d.c. …”

Tabla de Contenidos: “…Front Cover -- Three-Dimensional Integrated Circuit Design -- Copyright Page -- Dedication -- Contents -- List of Figures -- About the Authors -- Preface to the Second Edition -- Preface to the First Edition -- Acknowledgments -- Organization of the Book -- 1 Introduction -- 1.1 Interconnect Issues in Integrated Systems -- 1.2 Three-Dimensional or Vertical Integration -- 1.2.1 Opportunities for Three-Dimensional Integration -- 1.2.2 Challenges of Three-Dimensional Integration -- 1.2.2.1 Technological/manufacturing limitations -- 1.2.2.2 Testing -- 1.2.2.3 Global interconnect design -- 1.2.2.4 Thermal issues -- 1.2.2.5 CAD algorithms and tools -- 1.3 Book Organization -- 2 Manufacturing of Three-Dimensional Packaged Systems -- 2.1 Stacking Methods for Transistors, Circuits, and Dies -- 2.1.1 System-in-Package -- 2.1.2 Transistor and Circuit Level Stacking -- 2.2 System-on-Package -- 2.3 Technologies for System-in-Package -- 2.3.1 Wire Bonded System-in-Package -- 2.3.2 Peripheral Vertical Interconnects -- 2.3.3 Area Array Vertical Interconnects -- 2.3.4 Metalizing the Walls of an SiP -- 2.4 Technologies for 2.5-D Integration -- 2.4.1 Interposer Materials -- 2.4.2 Metallization Processes -- 2.4.3 Vertical Interconnects -- 2.5 Summary -- 3 Manufacturing Technologies for Three-Dimensional Integrated Circuits -- 3.1 Monolithic Three-Dimensional ICs -- 3.1.1 Laser Crystallization -- 3.1.2 Seed Crystallization -- 3.1.3 Double-Gate Metal Oxide Semiconductor Field Effect Transistors for Stacked Three-Dimensional ICs -- 3.1.4 Molecular Bonding -- 3.2 Three-Dimensional ICs with Through Silicon Via or Intertier Via -- 3.2.1 Wafer Level Integration -- 3.2.2 Die-to-Die Integration -- 3.2.3 Bonding of Three-Dimensional ICs -- 3.3 Contactless Three-Dimensional ICs -- 3.3.1 Capacitively Coupled Three-Dimensional ICs…”

Tabla de Contenidos: “…2.5.4 Relative humidity measurement -- 2.5.5 Tilt measurement -- 2.5.6 Other applications -- 2.6 Future trends -- Sources of further information and advice -- References -- 3 - Smart temperature sensors and temperature sensor systems -- 3.1 Introduction -- 3.2 Measuring temperature, temperature differences, and temperature changes in industrial applications -- 3.3 Temperature-sensing elements -- 3.3.1 Introduction -- 3.3.2 Temperature sensor characteristics of bipolar junction transistors -- 3.3.3 ΔVBE temperature sensors -- 3.3.4 Bipolar junction transistors in complementary metal-oxide semiconductor (CMOS) technology -- 3.4 Basic concepts of smart temperature sensors -- 3.4.1 Architectures of smart temperature sensor systems -- 3.4.2 Temperature sensors with a duty-cycle-modulated (DEM) output -- 3.5 Methods to improve the accuracy of CMOS smart temperature-sensor systems -- 3.5.1 Dynamic element matching -- 3.5.2 Chopping -- 3.6 Principles of BJT-based smart temperature sensors with DCM -- 3.7 Signal processing of duty cycle modulated signals -- 3.7.1 Three methods of averaging -- 3.7.1.1 First type of averaging: best accuracy at any speed -- 3.7.1.2 Second type of averaging: simplest method -- 3.7.1.3 Third method of averaging: best accuracy at intermediate and low speeds -- 3.8 Fabrication and test results -- 3.8.1 Fabrication -- 3.8.2 Accuracy over temperature range and supply voltage range -- 3.8.3 Noise -- 3.8.4 Packaging shift and long-term stability -- 3.8.5 Performance summary -- 3.8.6 Simple systems with digital and analog signal processing -- 3.9 Summary -- References -- 4 - Capacitive sensors for displacement measurement in the subnanometer range -- 4.1 Introduction -- 4.2 Challenges for subnanometer displacement measurement with capacitive sensors -- 4.3 Offset capacitance cancellation technique…”

Tabla de Contenidos: “…Cover -- Title Page -- Copyright Page -- Preface -- Acknowledgments -- Brief Contents -- Contents -- 1 Introduction -- 1.1 The Electrical/Electronics Industry -- 1.2 A Brief History -- 1.3 Units of Measurement -- 1.4 Systems of Units -- 1.5 Significant Figures, Accuracy, and Rounding Off -- 1.6 Powers of Ten -- 1.7 Fixed-Point, Floating-Point, Scientific, and Engineering Notation -- 1.8 Conversion Between Levels of Powers of Ten -- 1.9 Conversion Within and Between Systems of Units -- 1.10 Symbols -- 1.11 Conversion Tables -- 1.12 Calculators -- 1.13 Computer Analysis -- 2 Voltage and Current -- 2.1 Introduction -- 2.2 Atoms and Their Structure -- 2.3 Voltage -- 2.4 Current -- 2.5 Voltage Sources -- 2.6 Ampere-Hour Rating -- 2.7 Battery Life Factors -- 2.8 Conductors and Insulators -- 2.9 Semiconductors -- 2.10 Ammeters and Voltmeters -- 2.11 Applications -- 2.12 Computer Analysis -- 3 Resistance -- 3.1 Introduction -- 3.2 Resistance: Circular Wires -- 3.3 Wire Tables -- 3.4 Temperature Effects -- 3.5 Types of Resistors -- 3.6 Color Coding and Standard Resistor Values -- 3.7 Conductance -- 3.8 Ohmmeters -- 3.9 Resistance: Metric Units -- 3.10 The Fourth Element-The Memristor -- 3.11 Superconductors -- 3.12 Thermistors -- 3.13 Photoconductive Cell -- 3.14 Varistors -- 3.15 Applications -- 4 Ohm's Law, Power, and Energy -- 4.1 Introduction -- 4.2 Ohm's Law -- 4.3 Plotting Ohm's Law -- 4.4 Power -- 4.5 Energy -- 4.6 Efficiency -- 4.7 Circuit Breakers, GFCIs, and Fuses -- 4.8 Applications -- 4.9 Computer Analysis -- 5 Series dc Circuits -- 5.1 Introduction -- 5.2 Series Resistors -- 5.3 Series Circuits -- 5.4 Power Distribution in a Series Circuit -- 5.5 Voltage Sources in Series -- 5.6 Kirchhoff's Voltage Law -- 5.7 Voltage Division in a Series Circuit -- 5.8 Interchanging Series Elements -- 5.9 Notation -- 5.10 Ground Connection Awareness…”

“…They have found applications as diverse as catalysis, in Boron Neutron Capture Therapy, as liquid crystals and as semiconductors. This Special Issue illustrates the very comprehensive world of heteroborane chemistry, from liquid crystals to BNCT agents, di-halogen bonding to quantum chemical calculations of tetrel complexes of the carbonium ylide CB11H11, nickellacarboranes as potential acid–base sensors to revealing how the selective formations of metallacarborane diastereomers can arise and metallacarboranes as function as radical cation salts with dielectric or semiconductor properties…”

“…Among these, "organic semiconductors" combine the progress of semiconductors and plastic of the last century, becoming the subject of intense industrial and academic research. …”

“…However, solar cells (SCs) based on bulk semiconductors have quite limited maximum attainable performance. …”

“…These goals can be achieved by doping the semiconductor lattice with metal and/or non-metal elements in order to reduce band gap energy, thereby providing the semiconductor with the ability to absorb light at a wavelength higher than the UV range. …”

“…This book concentrates on the semiconductor physics of carbon nanotubes, it brings unique insight into the phenomena encountered in the electronic structure when operating with carbon nanotubes. …”

“…This book contains chapters about application of titanium dioxide in different branches of economy such as the agriculture, the food industry, the medicine, the cosmetics, the water treatment technologies, and the semiconductors…”

“…This book discusses the production of semiconductors and nanomaterials through the pyrolysis process…”

“…It focuses on the compound's uses in environmental remediation, photocatalytic materials, rechargeable lithium-ion batteries, thin films, energy storage, semiconductors, and much more. This volume is a useful resource for researchers, scientists, engineers, and students…”

“…Written in a lucid style, this book assimilates the best practices of conceptual pedagogy, dealing at length with various topics such as crystallography, principles of quantum mechanics, free electron theory of metals, dielectric and magnetic properties, semiconductors, nanotechnology, etc…”

“…The photonic gain media, which are normally based on glass- or semiconductor-based waveguides, can amplify many high speed wavelength division multiplexed channels simultaneously. …”

“…Cheap large-scale production is possible by using highly parallel microfabrication techniques, and semiconductor-based nanophotonic devices can be integrated together with electronic circuitry on a common chip. …”

Tabla de Contenidos: “…New trends on power semiconductors 9.4.1. Modulation Techniques 9.4.2. Review of different modulation methods. 9.4.3. …”

Tabla de Contenidos: “…2.3 Computer storage technologies -- 2.3.1 Punched cards - Hollerith and IBM -- 2.3.2 Punched paper tapes -- 2.3.3 Handwriting recognition -- 2.3.4 Delay line memories -- 2.3.5 Core memories -- 2.3.6 Semiconductor memories -- 2.3.7 Redundant array of Independent Memories - RAIM -- 2.3.8 Magnetic Random Access Memory - MRAM -- 2.3.9 Magnetic tapes and tape libraries -- 2.3.10 An analytical model for a tape library -- 2.3.11 Summary of a recent article on magnetic tapes -- 2.3.12 Origins of Hard Disk Drives - HDDs -- 2.3.13 HDD manufacturers -- 2.3.14 Storage technologies expected to replace disk drives -- 2.3.15 Magnetic bubble memories -- 2.3.16 Charged Couple Devices - CCDs -- 2.3.17 Micro-Electro-Mechanical Systems - MEMS -- 2.3.18 IBM Zurich millipede -- 2.3.19 Phase Change Memory - PCM -- 2.3.20 Flash memories -- 2.3.21 Companies producing flash memories -- 2.3.22 Elevating commodity storage with the SALSA host translation layer -- 2.3.23 Flash SSD versus magnetic HDD pricing -- 2.3.24 Pure Storage design of Purity -- 2.3.25 Intel/Micron 3D_XPoint Optane Memory -- 2.3.26 Processing In Memory - PIM -- 2.3.27 Universal memory technology - UltraRAM -- 2.3.28 Racetrack memory -- 2.3.29 Optical storage -- 2.3.30 Holographic memory -- 2.3.31 M-DISC and storage longevity -- 2.3.32 Persistent and NonVolatile Memory - NVM -- 2.3.33 Glass as a new storage medium -- 2.3.34 DNA based archival storage system -- 2.4 Reliability studies of DRAM, HDDs, &amp -- flash SSDs -- 2.4.1 Flash SSD reliability at Facebook, Google &amp -- NetApp -- 2.5 Storage Networking Industry Association - SNIA -- 2.5.1 Solid state storage performance -- 2.5.2 Persistent Memory Forum -- 2.5.3 Computational storage -- 2.6 Big data and its sources -- 2.7 Sources of storage content -- 2.8 Ranking and description of media companies -- 2.9 Sources of news: newspapers, radio and TV stations…”

Tabla de Contenidos: “…Bipolar junction transistor (BJT) -- 2.6.2. Metal oxide semiconductor field effect transistor (MOSFET) -- 2.6.3. …”