Tabla de Contenidos: “…CHAPTER 1 OPTICAL FIBER AND OPTICAL DEVICES; 1.1 Optical Fiber; 1.2 Light Source; 1.2.1 Semiconductor Laser; 1.2.2 Optical Fiber Laser; 1.3 Optical Amplifier; 1.3.1 Erbium Doped Fiber Amplifier; 1.3.2 Semiconductor Optical Amplifier; 1.4 Detector; 1.5 Optical Fiber Passive Device; 1.5.1 Optical Fiber Coupler; 1.5.2 Optical Fiber Isolator; 1.5.3 Optical Fiber Circulator; 1.5.4 Optical Fiber Polarizer; 1.5.5 Optical Fiber Switcher; 1.6 Optical Fiber Modulator; ; CHAPTER 2 OPTICAL FIBER BRAGG GRATING SENSING TECHNOLOGY; 2.1 Principle of Fiber Bragg Grating Sensing; 2.2 Photosensitivity of Ge-Doped Fiber; 2.3 Fabrication of Fiber Bragg Grating; 2.4 Package Design for Strain and Temperature Sensing; 2.4.1 Package Design for Strain Sensing; 2.4.2 Package Design for Temperature Sensing; 2.4.3 Performance Evaluation Under Cryogenic Temperature; 2.5 Demodulation of Fiber Bragg Grating Sensing for Space Application; 2.5.1 Demodulation Theory of Fiber Bragg Grating Sensing; 2.5.2 Demodulation Instrument Development; 2.5.3 Effect of Environment Temperature Variation; ; CHAPTER 3 EXTRINSIC-FABRY-PEROT-INTERFEROMETER-BASED OPTICAL FIBER SENSING TECHNOLOGY; 3.1 Principle of Fabry-Perot Interferometer; 3.2 Fabry-Perot Interferometer Based Optical Fiber Sensor Structure; 3.3 Silicon-Diaphragm Optical Fiber Sensor; 3.3.1 Silicon-Diaphragm Optical Fiber Pressure Sensor; 3.3.2 Silicon-Diaphragm Optical Fiber Temperature Sensor; 3.3.3 Non-Intrusive Optical Fiber Sensor Head Chip Inspection Method; 3.4 Polarization Low Coherence Interference Demodulation for Pressure Sensing; 3.4.1 Demodulation Theory; 3.4.2 Demodulation Instrument; 3.4.3 Demodulation Algorithm; 3.4.4 Low Coherence Interference Multiplexing; 3.5 Application; 3.5.1 Optical Fiber Pressure Sensing in Ocean Application; 3.5.2 Optical Fiber Pressure Sensing in Aviation Application; ; CHAPTER 4 EXTRINSIC-FABRY-PEROT-INTERFEROMETER-BASED OPTICAL FIBER ACOUSTIC SENSING TECHNOLOGY; 4.1 Polymer-Diaphragm; 4.2 Senor Design and Parameters Optimization; 4.3 Demodulation; 4.3.1 Quadrature Phase Demodulation Theory; 4.3.2 Dual-Laser Quadrature Phase Demodulation Instrument; 4.3.3 Phase-Shifting Demodulation Instrument Using Birefringence Crystals; 4.4 Optical Fiber Acoustic Sensing in Space Application; ; CHAPTER 5 EXTRINSIC-FABRY-PEROT-INTERFEROMETER-BASED OPTICAL FIBER HIGH TEMPERATURE SENSING TECHNOLOGY; 5.1 Sapphire Material Characteristic and Solid Cavity; 5.2 Sensor Design and Parameters Optimization; 5.3 Spectrum Demodulation Theory; 5.4 Spectrum Demodulation Instrument; 5.5 Optical Fiber High Temperature Sensing in Aviation Application; ; CHAPTER 6 ASSEMBLE FREE MICRO-INTERFEROMETER?…”

Tabla de Contenidos: “….) -- 1.1 INTRODUCCIÓN A LA LÓGICA DIGITAL INTEGRADA -- 1.1.1 CIRCUITOS INTEGRADOS -- 1.1.2 CIRCUITOS COMBINACIONALES -- 1.1.3 CIRCUITOS SECUENCIALES -- 1.1.4 MEMORIAS DE SEMICONDUCTORES -- 1.1.5 DISPOSITIVOS LÓGICOS PROGRAMABLES -- 1.2 INTRODUCCIÓN A LA ARQUITECTURA ARM -- 2 ELEMENTOS HARDWARE -- 2.1 CONECTORES Y HARDWARE PARA EL TRATAMIENTO (...) -- 2.1.1 TARJETAS DE MEMORIA -- 2.1.2 CONECTORES PARA LA MEMORIA RAM Y (...) -- 2.1.3 CABLES Y CONECTORES USB Y MINI USB -- 2.1.4 CONECTOR RJ45 -- 2.1.5 REDES -- 2.2 CONECTORES PARA EL TRATAMIENTO DE AUDIO (...) -- 2.2.1 CONECTOR JACK -- 2.2.2 HDMI -- 2.2.3 CONECTOR RCA -- 2.2.4 CONECTOR CSI -- 2.2.5 GPU PARA GRÁFICOS -- 3 HARDWARE DE LA PLACA RASPBERRY PI -- 3.1 DEFINICIÓN DE RASPBERRY PI -- 3.1.1 UN POCO DE HISTORIA -- 3.2 HARDWARE DE LA RASPBERRY PI -- 3.2.1 CONECTORES EN LA RASPBERRY PI -- 3.2.2 ARM -- 3.2.3 PROCESADOR GRÁFICO VIDEOCORE IV -- 3.2.4 PINES GPIO -- 3.2.5 LEDS DE ESTADO -- 3.2.6 PUERTOS Y BUSES EN RASPBERRY PI -- 4 MODELOS Y ACCESORIOS DE RASPBERRY PI -- 4.1 MODELOS DE RASPBERRY PI -- 4.1.1 RASPBERRY PI 1 -- 4.1.2 RASPBERRY PI 2 -- 4.1.3 RASPBERRY PI ZERO -- 4.1.4 RASPBERRY PI 3 -- 4.1.5 RASPBERRY PI COMPUTE MODULE -- 4.1.6 RESUMEN DE LAS DIFERENCIAS ENTRE (...) -- 4.2 ACCESORIOS DE LAS PLACAS RASPBERRY PI -- 4.2.1 CAJA RASPBERRY PI -- 4.2.2 FUENTE DE ALIMENTACIÓN UNIVERSAL -- 4.2.3 CÁMARA DE RASPBERRY PI -- 4.2.4 PI NOIR CAMERA V2 -- 4.2.5 RASPBERRRY PI USB WIFI DONGLE -- 4.2.6 SENSE HAT -- 4.2.7 RASPBERRY PI TOUCH DISPLAY -- 5 SISTEMAS DE HARDWARE LIBRE -- 5.1 LICENCIAS SOFTWARE Y HARDWARE -- 5.2 PROYECTOS DE PLACAS HARDWARE ABIERTAS -- 5.2.1 PINE A64 -- 5.2.2 ODROID -- 5.2.3 OLINUXINO -- 5.2.4 CUBIEBOARD -- 5.2.5 ROCK LITE PRO…”

Tabla de Contenidos: “…The Ends are the Means -- Begin at the Edge -- Making a Mark -- Acting on Markers -- Propagator Nodes Provide the "and" -- Open-Source Networking Solutions -- Gaining Access -- The Standards Conundrum -- Machine-to-Machine Communications and Autonomy -- Shared Vocabularies and de facto Standards -- Build it and End Devices will Come -- OEM Leverage -- Shared Software and Business Process Vocabularies -- Working in Groups -- Call to Constituencies for the IoT -- Semiconductor Providers -- Appliance and Other End Device Manufacturers -- Networking Equipment Vendors -- Home Automation/Entertainment Suppliers -- Carriers and Big Data Providers -- Major End-to-End OEMs -- Global Scope, Vast Numbers, Constant Adaptation, New Insights -- Index…”

Tabla de Contenidos: “…6.3.1.3 Ultrashort pulse lasers -- 6.3.2 Wavelength based division -- 6.3.2.1 Mid infrared lasers (mid IR) -- 6.3.2.2 Infrared lasers (IR lasers) -- 6.3.2.3 Ultraviolet lasers (UV lasers) -- 6.4 Material removal mechanisms -- 6.4.1 Thermal ablation -- 6.4.2 Cold ablation/photochemical ablation/photo ablation -- 6.5 Laser microprocessing of materials -- 6.5.1 Direct laser micromachining in open surroundings -- 6.5.1.1 Metals and alloys -- 6.5.1.2 Semiconductors, composites, and specially developed materials -- 6.5.1.3 Glass and polymers -- 6.5.2 Direct laser micromachining in different surrounding conditions -- 6.6 Challenges and future of laser processing -- References -- 7 Underwater pulsed laser beam cutting with a case study -- 7.1 Introduction -- 7.2 Laser as a machine tool -- 7.3 Laser material interaction -- 7.4 Laser beam cutting -- 7.4.1 Process characteristics -- 7.4.2 Cut quality characteristics -- 7.4.3 Principles of laser beam cutting -- 7.4.3.1 Different types of laser beam cutting -- 7.4.3.1.1 Laser sublimation cutting -- 7.4.3.1.2 Controlled fracture technique -- 7.4.3.1.3 Laser fusion cutting -- 7.4.3.1.4 Reactive fusion cutting -- 7.4.3.1.5 Laser cutting at different assisted medium -- 7.4.3.1.6 Laser beam microcutting -- 7.4.4 Application of laser beam machining -- 7.5 Underwater laser beam machining -- 7.5.1 Advantages of laser beam cutting at submerged condition -- 7.5.2 Material removal mechanism of nanosecond pulsed laser beam cutting at submerged condition -- 7.5.3 Development of different types of liquid-assisted laser beam machining -- 7.5.3.1 Laser beam cutting in submerged condition -- 7.5.3.2 Underwater assist gas jet/waterjet assisted laser beam cutting -- 7.5.3.3 Molten salt-jet-guided/chemical laser beam -- 7.5.3.4 Water jet following the laser beam…”

Tabla de Contenidos: “…5.5 Design Procedure 122 -- 5.6 Analysis 123 -- 5.7 Applications 126 -- 5.8 Summary 133 -- Acknowledgment 133 -- References 133 -- 6 High Power Electronics: Key Technology forWind Turbines 136 -- 6.1 Introduction 136 -- 6.2 Development of Wind Power Generation 137 -- 6.3 Wind Power Conversion 138 -- 6.4 Power Converters for Wind Turbines 143 -- 6.5 Power Semiconductors for Wind Power Converter 149 -- 6.6 Controls and Grid Requirements for Modern Wind Turbines 150 -- 6.7 Emerging Reliability Issues for Wind Power System 155 -- 6.8 Conclusion 156 -- References 156 -- 7 Photovoltaic Energy Conversion Systems 160 -- 7.1 Introduction 160 -- 7.2 Power Curves and Maximum Power Point of PV Systems 162 -- 7.3 Grid-Connected PV System Configurations 165 -- 7.4 Control of Grid-Connected PV Systems 181 -- 7.5 Recent Developments in Multilevel Inverter-Based PV Systems 192 -- 7.6 Summary 195 -- References 195 -- 8 Controllability Analysis of Renewable Energy Systems 199 -- 8.1 Introduction 199 -- 8.2 Zero Dynamics of the Nonlinear System 201 -- 8.3 Controllability of Wind Turbine Connected through L Filter to the Grid 202 -- 8.4 Controllability of Wind Turbine Connected through LCL Filter to the Grid 208 -- 8.5 Controllability and Stability Analysis of PV System Connected to Current Source Inverter 219 -- 8.6 Conclusions 228 -- References 229 -- 9 Universal Operation of Small/Medium-Sized Renewable Energy Systems 231 -- 9.1 Distributed Power Generation Systems 231 -- 9.2 Control of Power Converters for Grid-Interactive Distributed Power Generation Systems 243 -- 9.3 Ancillary Feature 259 -- 9.4 Summary 267 -- References 268 -- 10 Properties and Control of a Doubly Fed Induction Machine 270 -- 10.1 Introduction. …”

Tabla de Contenidos: “…JUNTURAS ÓPTICAS EN SEMICONDUCTORES -- 7.3. EMISORES ÓPTICOS USADOS EN SISTEMAS DE F.O -- 7.3.1. …”

Tabla de Contenidos: “…-- 4.4 COMPROBACIÓN DE FUSIBLES -- 5 RESISTENCIAS -- 5.1 RESISTENCIAS FIJAS -- 5.1.1 Clasificación -- 5.1.2 Características -- 5.2 RESISTENCIAS VARIABLES -- 5.2.1 Potenciómetros -- 5.2.2 Fotorresistencias -- 5.2.3 Termistores -- 5.2.4 Varistores -- 6 CONDENSADORES -- 6.1 CLASIFICACIÓN -- 6.1.1 Condensadores fijos -- 6.1.2 Condensadores variables -- 6.2 CARACTERÍSTICAS DE UN CAPACITOR -- 6.3 IDENTIFICACIÓN DE UN CONDENSADOR -- 6.4 FUNCIONAMIENTO DE UN CAPACITOR -- 6.4.1 Corriente continua -- 6.4.2 Corriente alterna -- 7 BOBINAS Y TRANSFORMADORES -- 7.1 LA INDUCTANCIA -- 7.2 REACTANCIA INDUCTIVA -- 7.3 CLASIFICACIÓN DE LAS BOBINAS -- 7.4 IDENTIFICACIÓN -- 7.5 SIMBOLOGÍA DE LAS BOBINAS -- 7.6 INDUCTANCIA MUTUA -- 7.7 TRANSFORMADORES -- 7.8 FUNCIONAMIENTO DE UN TRANSFORMADOR -- 7.9 CLASIFICACIÓN DE TRANSFORMADORES -- 7.10 ESTRUCTURA BÁSICA -- 7.11 IDENTIFICACIÓN -- 7.12 RELACIÓN DE TRANSFORMACIÓN -- 7.13 RELACIÓN DE POTENCIA -- 7.14 LEYES BÁSICAS -- 7.15 PÉRDIDAS EN LOS TRANSFORMADORES -- 8 DIODOS -- 8.1 SEMICONDUCTORES INTRÍNSECOS Y EXTRÍNSECOS -- 8.2 EL DIODO -- 8.3 TIPOS DE DIODOS -- 8.4 FUNCIONAMIENTO -- 8.5 LA UNIÓN PN -- 8.5.1 Polarización inversa -- 8.5.2 Polarización directa -- 8.6 TIPOS DE DIODOS -- 8.6.1 Diodos rectificadores -- 8.6.2 Diodos Zener -- 8.6.3 Diodos LED…”
Acceso restringido con credenciales UPSA

Tabla de Contenidos: “…Cover -- Title Page -- Copyright -- Contents -- Preface -- Chapter 1 Sources of Energy and Technologies -- 1.1 Energy Uses in Different Countries -- 1.2 Energy Sources -- 1.2.1 Non‐Renewable Energy Resources -- 1.2.2 Renewable Sources of Energy -- 1.3 Energy and Environment -- 1.3.1 Climate Change -- 1.4 Review of Technologies for Renewable Energy System -- 1.4.1 Fluid Dynamics -- 1.4.1.1 Conservation of Mass -- 1.4.1.2 Conservation of Momentum -- 1.4.1.3 Conservation of Energy -- 1.5 Thermodynamics -- 1.5.1 Enthalpy -- 1.5.2 Specific Heat -- 1.5.3 Zeroth Law -- 1.5.4 First Law -- 1.5.4.1 Limitations of First law -- 1.5.5 Second Law of Thermodynamics -- 1.5.5.1 Kelvin-Planck Statement -- 1.5.5.2 Clausius Statement -- 1.5.6 Third Law of Thermodynamics -- 1.6 Thermodynamic Power Cycles -- 1.6.1 Ideal Cycle (Carnot Cycle) -- 1.6.2 Rankine Cycle -- 1.6.3 Brayton Cycle -- 1.7 Summary -- References -- Chapter 2 Power Electronic Converters -- 2.1 Types of Power Electronic Converters -- 2.2 Power Semiconductor Devices -- 2.2.1 Thyristor -- 2.2.1.1 Line Commutation -- 2.2.1.2 Load Commutation -- 2.2.1.3 Forced Commutation -- 2.2.2 Gate Turn‐Off Thyristor (GTO) -- 2.2.3 Power Bipolar Junction Transistor -- 2.2.4 Power MOSFET -- 2.2.5 Insulated Gate Bipolar Transistor (IGBT) -- 2.3 ac‐to‐dc Converters -- 2.3.1 Single‐Phase Diode Bridge Rectifiers -- 2.3.2 Three‐Phase Full‐Wave Bridge Diode Rectifiers -- 2.3.3 Single‐Phase Fully Controlled Rectifiers -- 2.3.4 Three‐Phase Fully Controlled Bridge Converter -- 2.4 dc‐to‐ac Converters (Inverters) -- 2.4.1 Single‐Phase Voltage Source Inverters -- 2.4.2 Square‐Wave PWM Inverter -- 2.4.3 Single‐Pulse‐Width Modulation -- 2.4.4 Multiple‐Pulse‐Width Modulation -- 2.4.5 Sinusoidal‐Pulse‐Width Modulation -- 2.4.6 Three‐Phase Voltage Source Inverters -- 2.4.7 Single‐Phase Current Source Inverters…”

Tabla de Contenidos: “…Einsatz von Programmierrichtlinien -- Regeln und Direktiven -- Verbindlichkeiten -- 5.3 Dynamische Testverfahren -- 5.3.1 Spezifikationsbasierte Testverfahren -- 5.3.1.1 Äquivalenzklassenbildung -- 5.3.1.2 Grenzwertanalyse -- 5.3.2 Erfahrungsbasierte Testverfahren -- Intuitive Testfallermittlung -- 5.3.3 Strukturbasierte Testverfahren -- 5.3.3.1 Anweisungstest -- 5.3.3.2 Entscheidungstests -- 5.3.3.3 Bedingungstest -- (Einfacher) Bedingungstest -- Mehrfachbedingungstest -- Modifizierter Bedingungs-/Entscheidungstest (MC/DC-Test) -- 5.3.4 Testverfahren für die Testdurchführung -- 5.3.4.1 Back-to-Back-Test -- Back-to-Back-Test unterschiedlicher Softwareversionen -- Back-to-Back-Test Programmcode gegen Funktionsmodell -- Back-to-Back-Test System gegen Software -- 5.3.4.2 Fehlereinfügungstest -- 5.4 Gegenüberstellung und Auswahl -- Teststufe -- Testart -- Testbasis -- Testaktivität -- Risiken -- Stand der Technik -- Erfahrung und Intuition -- Anhang -- A ISO 26262 -- A.1 Zusammenfassung der Bände -- Band 1 - Vocabulary -- Band 2 - Management of functional safety -- Band 3 - Concept phase -- Band 4 - Product development at the system level -- Band 5 - Product development at the hardware level -- Band 6 - Product development at the software level -- Band 7 - Production and operation -- Band 8 - Supporting processes -- Band 9 - Automotive Safety Integrity Level (ASIL)-oriented and safety- oriented analysis -- Band 10 - Guideline on ISO 26262 -- Band 11 - Guideline on application of ISO 26262 to semiconductors (nur ISO 26262:2018) -- Band 12 - Adaption of ISO 26262 for motorcycles (nur ISO 26262:2018) -- A.2 Übersicht der testrelevanten Methodentabellen -- B Automotive SPICE -- B.1 Prozessspezifikation SWE.6 -- B.2 ASPICE-Prozesse und VDA-Scope -- B.3 Generische Praktiken und Ressourcen -- B.4 Verfeinerte NPLF-Skala -- C Gegenüberstellung der Teststufen…”

Tabla de Contenidos: “…Chapter 1 Introductory Concepts -- 1-1 Digital and Analog Quantities -- 1-2 Binary Digits, Logic Levels, and Digital Waveforms -- 1-3 Basic Logic Functions -- 1-4 Combinational and Sequential Logic Functions -- 1-5 Introduction to Programmable Logic -- 1-6 Fixed-Function Logic Devices -- 1-7 Test and Measurement Instruments -- 1-8 Introduction to Troubleshooting -- Chapter 2 Number Systems, Operations, and Codes -- 2-1 Decimal Numbers -- 2-2 Binary Numbers -- 2-3 Decimal-to-Binary Conversion -- 2-4 Binary Arithmetic -- 2-5 Complements of Binary Numbers -- 2-6 Signed Numbers -- 2-7 Arithmetic Operations with Signed Numbers -- 2-8 Hexadecimal Numbers -- 2-9 Octal Numbers -- 2-10 Binary Coded Decimal (BCD) -- 2-11 Digital Codes -- 2-12 Error Codes -- Chapter 3 Logic Gates -- 3-1 The Inverter -- 3-2 The AND Gate -- 3-3 The OR Gate -- 3-4 The NAND Gate -- 3-5 The NOR Gate -- 3-6 The Exclusive-OR and Exclusive-NOR Gates -- 3-7 Programmable Logic -- 3-8 Fixed-Function Logic Gates -- 3-9 Troubleshooting -- Chapter 4 Boolean Algebra and Logic Simplification -- 4-1 Boolean Operations and Expressions -- 4-2 Laws and Rules of Boolean Algebra -- 4-3 DeMorgan's Theorems -- 4-4 Boolean Analysis of Logic Circuits -- 4-5 Logic Simplification Using Boolean Algebra -- 4-6 Standard Forms of Boolean Expressions -- 4-7 Boolean Expressions and Truth Tables -- 4-8 The Karnaugh Map -- 4-9 Karnaugh Map SOP Minimization -- 4-10 Karnaugh Map POS Minimization -- 4-11 The Quine-McCluskey Method -- 4-12 Boolean Expressions with VHDL -- Applied Logic -- Chapter 5 Combinational Logic Analysis -- 5-1 Basic Combinational Logic Circuits -- 5-2 Implementing Combinational Logic -- 5-3 The Universal Property of NAND and NOR Gates -- 5-4 Combinational Logic Using NAND and NOR Gates -- 5-5 Pulse Waveform Operation -- 5-6 Combinational Logic with VHDL -- 5-7 Troubleshooting -- Applied Logic -- Chapter 6 Functions of Combinational Logic -- 6-1 Half and Full Adders -- 6-2 Parallel Binary Adders -- 6-3 Ripple Carry and Look-Ahead Carry Adders -- 6-4 Comparators -- 6-5 Decoders -- 6-6 Encoders -- 6-7 Code Converters -- 6-8 Multiplexers (Data Selectors) -- 6-9 Demultiplexers -- 6-10 Parity Generators/Checkers -- 6-11 Troubleshooting -- Applied Logic -- Chapter 7 Latches, Flip-Flops, and Timers -- 7-1 Latches -- 7-2 Flip-Flops -- 7-3 Flip-Flop Operating Characteristics -- 7-4 Flip-Flop Applications -- 7-5 One-Shots -- 7-6 The Astable Multivibrator -- 7-7 Troubleshooting -- Applied Logic -- Chapter 8 Shift Registers -- 8-1 Shift Register Operations -- 8-2 Types of Shift Register Data I/Os -- 8-3 Bidirectional Shift Registers -- 8-4 Shift Register Counters -- 8-5 Shift Register Applications -- 8-6 Logic Symbols with Dependency Notation -- 8-7 Troubleshooting -- Applied Logic -- Chapter 9 Counters -- 9-1 Finite State Machines -- 9-2 Asynchronous Counters -- 9-3 Synchronous Counters -- 9-4 Up/Down Synchronous Counters -- 9-5 Design of Synchronous Counters -- 9-6 Cascaded Counters -- 9-7 Counter Decoding -- 9-8 Counter Applications -- 9-9 Logic Symbols with Dependency Notation -- 9-10 Troubleshooting -- Applied Logic -- Chapter 10 Programmable Logic -- 10-1 Simple Programmable Logic Devices (SPLDs) -- 10-2 Complex Programmable Logic Devices (CPLDs) -- 10-3 Macrocell Modes -- 10-4 Field-Programmable Gate Arrays (FPGAs) -- 10-5 Programmable Logic Software -- 10-6 Boundary Scan Logic -- 10-7 Troubleshooting -- Applied Logic -- Chapter 11 Data Storage -- 11-1 Semiconductor Memory Basics -- 11-2 The Random-Access Memory (RAM) -- 11-3 The Read-Only Memory (ROM) -- 11-4 Programmable ROMs -- 11-5 The Flash Memory -- 11-6 Memory Expansion -- 11-7 Special Types of Memories -- 11-8 Magnetic and Optical Storage -- 11-9 Memory Hierarchy -- 11-10 Cloud Storage -- 11-11 Troubleshooting -- Chapter 12 Signal Conversion and Processing -- 12-1 Analog-to-Digital Conversion -- 12-2 Methods of Analog-to-Digital Conversion -- 12-3 Methods of Digital-to-Analog Conversion -- 12-4 Digital Signal Processing -- 12-5 The Digital Signal Processor (DSP) -- Chapter 13 Data transmission -- 13-1 Data Transmission Media -- 13-2 Methods and Modes of Data Transmission -- 13-3 Modulation of Analog Signals with Digital Data -- 13-4 Modulation of Digital Signals with Analog Data -- 13-5 Multiplexing and Demultiplexing -- 13-6 Bus Basics -- 13-7 Parallel Buses -- 13-8 The Universal Serial Bus (USB) -- 13-9 Other Serial Buses -- 13-10 Bus Interfacing -- Chapter 14 Data Processing and Control -- 14-1 The Computer System -- 14-2 Practical Computer System Considerations -- 14-3 The Processor: Basic Operation -- 14-4 The Processor: Addressing Modes -- 14-5 The Processor: Special Operations -- 14-6 Operating Systems and Hardware -- 14-7 Programming -- 14-8 Microcontrollers and Embedded Systems -- 14-9 System on Chip (SoC) -- Chapter 15 Integrated Circuit Technologies -- 15-1 Basic Operational Characteristics and Parameters -- 15-2 CMOS Circuits -- 15-3 TTL (Bipolar) Circuits -- 15-4 Practical Considerations in the Use of TTL -- 15-5 Comparison of CMOS and TTL Performance -- 15-6 Emitter-Coupled Logic (ECL) Circuits -- 15-7 PMOS, NMOS, and E2CMOS…”

Tabla de Contenidos: “…Student accomodation (Coimbra, Portugal) / Aires Mateus e Associados. Semiconductor assembly plant (Wasserburg am Inn, Germany) / Von Seidlein. …”

Tabla de Contenidos: “…La CPU y el almacenamiento primario -- Almacenamiento primario -- Tipos de memoria de semiconductores -- La unidad de aritmética y lógica y la unidad de control -- 1.3. …”

Tabla de Contenidos: “…CONVERSIÓN FOTOVOLTAICA -- 3.3.1. SEMICONDUCTORES Y DOPAJE -- 3.3.2. LA MAGIA ESTÁ EN LA JUNTURA P-N…”

Tabla de Contenidos: “…-- Introduction to the Key Sensing Modalities -- Mechanical Sensors -- MEMS Sensors -- Accelerometers -- Gyroscopes -- Optical Sensors -- Photodetectors -- Infrared (IR) -- Fiber Optic -- Interferometers -- Semiconductor Sensors -- Gas Sensors -- Temperature Sensors -- Magnetic Sensors -- Optical Sensors -- Ion-Sensitive Field-Effect Transistors (ISFETs) -- Electrochemical Sensors -- Potentiometric Sensors -- Amperometric Sensors -- Coulometric -- Conductometric Sensors -- Biosensors -- Transducers for Biosensors -- Key Characteristics of Biosensors -- Application Domains -- Environmental Monitoring -- Air -- Water -- Sound (Noise Pollution) -- Soil -- Healthcare -- Wellness -- Monitoring Recreational Activity -- Personal Safety -- Activity and Location Detection -- Sensor Characteristics -- Range -- Transfer Function -- Linear Transfer Functions -- Linearization -- Non-Linear Transfer Functions -- Linearity and Nonlinearity -- Sensitivity -- Environmental Effects -- Modifying Inputs -- Interfering Inputs -- Hysteresis -- Resolution -- Accuracy -- Precision -- Error -- Systematic Errors -- Random Errors (Noise) -- Error Bands -- Statistical Characteristics -- Repeatability -- Tolerance -- Dynamic Characteristics -- Response Time…”

Tabla de Contenidos: “…Chapter 7 - Innovations in Manufacturing7.1 Introduction7.2 Pharmaceuticals7.3 Heavy Equipment7.4 Automotive7.5 Semiconductor7.6 Concluding Remarks 7.7 References8. …”

Tabla de Contenidos: “…-- Advantages/Disadvantages of Change Cycles -- Organisational Barriers to Change -- Performance-Driven Organisational Change -- Rate of Change -- Organisational Effectiveness -- Differents States of Change -- The Future State of Change -- The Current State of Change -- The Delta State of Change -- Creating Change -- Implementation of Change -- Practical tools to Understands Change -- General Guidelines for Effective Change -- Summary -- Case Study: A Semiconductor Solutions Company With an offshore Development Center in India -- Review Questions -- Organisational Resistance to Change -- Introduction -- Reactions to Change -- Core Facts of Resistance to Change -- Individual and Group Resistance to Change -- Individual Resistance -- Organisational Resistance -- Consequences of Resistance to Change -- Overcoming Resistance to Change -- Startegies for Introducing Planned Change -- Empirical-rational Strategy -- Normative-reductive Strategy -- Power-coercive Strategy -- Techniques to Manage Resistance During Change -- Education and Communication -- Sense of Participation and Invilvement -- Assistance and Support -- Incentives -- Negotiation -- Manipulation and Co-optation -- Coercion -- Othr Strategies for Introducing Change…”

Tabla de Contenidos: “…Cover -- Inside Front Cover -- Title Page -- Copyright Page -- Dedication -- Contents -- Foreword -- Preface -- About the Author -- Part One Introduction -- Chapter 1 Basic Concepts and Computer Evolution -- 1.1 Organization and Architecture -- 1.2 Structure and Function -- 1.3 A Brief History of Computers -- 1.4 The Evolution of the Intel x86 Architecture -- 1.5 Embedded Systems -- 1.6 Arm Architecture -- 1.7 Cloud Computing -- 1.8 Key Terms, Review Questions, and Problems -- Chapter 2 Performance Issues -- 2.1 Designing for Performance -- 2.2 Multicore, Mics, and Gpgpus -- 2.3 Two Laws that Provide Insight: Ahmdahl's Law and Little's Law -- 2.4 Basic Measures of Computer Performance -- 2.5 Calculating the Mean -- 2.6 Benchmarks and Spec -- 2.7 Key Terms, Review Questions, and Problems -- Part Two The Computer System -- Chapter 3 A Top- Level View of Computer Function and Interconnection -- 3.1 Computer Components -- 3.2 Computer Function -- 3.3 Interconnection Structures -- 3.4 Bus Interconnection -- 3.5 Point-to-Point Interconnect -- 3.6 Pci Express -- 3.7 Key Terms, Review Questions, and Problems -- Chapter 4 Cache Memory -- 4.1 Computer Memory System Overview -- 4.2 Cache Memory Principles -- 4.3 Elements of Cache Design -- 4.4 Pentium 4 Cache Organization -- 4.5 Key Terms, Review Questions, and Problems -- Appendix 4A Performance Characteristics of Two- Level Memories -- Chapter 5 Internal Memory -- 5.1 Semiconductor Main Memory -- 5.2 Error Correction -- 5.3 DDR Dram -- 5.4 Flash Memory -- 5.5 Newer Nonvolatile Solid-State Memory Technologies -- 5.6 Key Terms, Review Questions, and Problems -- Chapter 6 External Memory -- 6.1 Magnetic Disk -- 6.2 Raid -- 6.3 Solid State Drives -- 6.4 Optical Memory -- 6.5 Magnetic Tape -- 6.6 Key Terms, Review Questions, and Problems -- Chapter 7 Input/Output -- 7.1 External Devices -- 7.2 I/O Modules…”

Tabla de Contenidos: “…-- Electricity Versus Electronics -- THE PAINFUL TRUTH -- Cell Phone -- Computers -- Robots -- 2 - Electronic Concepts: More Interesting Than You Think: Some Basic Stuff You Really Need to Know -- INTRODUCTION -- ELECTRICITY AND ELECTRONICS -- Atoms and Electrons -- Charge, Voltage, and Current -- Dynamic Electricity and Current Flow -- Direction of Current Flow -- Conductors, Insulators, and Semiconductors -- MAGNETISM -- Magnetic Fields -- Electromagnetism -- Electromagnetic Induction -- VOLTAGE SOURCES -- Direct Current Voltages -- Alternating Current Voltages -- PRACTICAL DIRECT CURRENT AND ALTERNATING CURRENT VOLTAGE SOURCES -- Direct Current Voltage Sources -- Fuel Cell -- Alternating Current Voltage Sources -- Analog and Digital Signals -- Fourier Theory and the Frequency Domain -- 3 - The Systems Versus Components View of Electronics: A Fresh New Way to Learn About Electronics -- A Fresh New Way to Learn About Electronics -- INTRODUCTION -- WHY SYSTEMS AND NOT CIRCUITS? …”

Tabla de Contenidos: “…-- Behaving differently depending on frequency -- Uses for Inductors -- Using Inductors in Circuits -- Reading inductance values -- Combining shielded inductors -- Tuning in to Radio Broadcasts -- Resonating with RLC circuits -- Ensuring rock‐solid resonance with crystals -- Influencing the Coil Next Door: Transformers -- Letting unshielded coils interact -- Isolating circuits from a power source -- Stepping up, stepping down voltages -- Chapter 9 Diving into Diodes -- Are We Conducting or Aren't We? -- Sizing up semiconductors -- Creating N‐types and P‐types -- Joining N‐types and P‐types to create components -- Forming a Junction Diode -- Biasing the diode -- Conducting current through a diode -- Rating your diode -- Identifying with diodes -- Which end is up? …”

Tabla de Contenidos: “…Resistor Noise -- 14.1.2. Semiconductor Noise -- 14.2. Total Noise Contributions -- 14.3. …”