Tabla de Contenidos: “…Front Cover -- Three-Dimensional Integrated Circuit Design -- Copyright Page -- Dedication -- Contents -- List of Figures -- About the Authors -- Preface to the Second Edition -- Preface to the First Edition -- Acknowledgments -- Organization of the Book -- 1 Introduction -- 1.1 Interconnect Issues in Integrated Systems -- 1.2 Three-Dimensional or Vertical Integration -- 1.2.1 Opportunities for Three-Dimensional Integration -- 1.2.2 Challenges of Three-Dimensional Integration -- 1.2.2.1 Technological/manufacturing limitations -- 1.2.2.2 Testing -- 1.2.2.3 Global interconnect design -- 1.2.2.4 Thermal issues -- 1.2.2.5 CAD algorithms and tools -- 1.3 Book Organization -- 2 Manufacturing of Three-Dimensional Packaged Systems -- 2.1 Stacking Methods for Transistors, Circuits, and Dies -- 2.1.1 System-in-Package -- 2.1.2 Transistor and Circuit Level Stacking -- 2.2 System-on-Package -- 2.3 Technologies for System-in-Package -- 2.3.1 Wire Bonded System-in-Package -- 2.3.2 Peripheral Vertical Interconnects -- 2.3.3 Area Array Vertical Interconnects -- 2.3.4 Metalizing the Walls of an SiP -- 2.4 Technologies for 2.5-D Integration -- 2.4.1 Interposer Materials -- 2.4.2 Metallization Processes -- 2.4.3 Vertical Interconnects -- 2.5 Summary -- 3 Manufacturing Technologies for Three-Dimensional Integrated Circuits -- 3.1 Monolithic Three-Dimensional ICs -- 3.1.1 Laser Crystallization -- 3.1.2 Seed Crystallization -- 3.1.3 Double-Gate Metal Oxide Semiconductor Field Effect Transistors for Stacked Three-Dimensional ICs -- 3.1.4 Molecular Bonding -- 3.2 Three-Dimensional ICs with Through Silicon Via or Intertier Via -- 3.2.1 Wafer Level Integration -- 3.2.2 Die-to-Die Integration -- 3.2.3 Bonding of Three-Dimensional ICs -- 3.3 Contactless Three-Dimensional ICs -- 3.3.1 Capacitively Coupled Three-Dimensional ICs…”

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Tabla de Contenidos: “…Front Cover; Three-Dimensional Integrated Circuit Design; Copyright Page; Dedication Page; Contents; Preface; Acknowledgments; Chapter 1: Introduction; Chapter 2: Manufacturing of 3-D Packaged Systems; Chapter 3: 3-D Integrated Circuit Fabrication Technologies; Chapter 4: Interconnect Prediction Models; Chapter 5: Physical Design Techniques for 3-D ICs; Chapter 6: Thermal Management Techniques; Chapter 7: Timing Optimization for Two-Terminal Interconnects; Chapter 8: Timing Optimization for Multiterminal Interconnects; Chapter 9: 3-D Circuit Architectures…”

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Tabla de Contenidos: “…v. II : 3rd ed. - Bibliogr…”