Tabla de Contenidos: “…5.1.1 Discrepancy of Secondary Waves and Boundary Conditions Numbers -- 5.1.2 Resolution of Moving Boundaries "Paradoxes -- 5.2 Evolution of an Electromagnetic Wave after the Beginning of Medium Boundary Movement -- 5.3 Relativistic Uniform Accelerated Movement of a Medium Boundary -- 5.4 Electromagnetic Field Energy Accumulation in a Collapsing Dielectric Layer -- 5.4.1 Increase of the Wave Amplitudes in the Collapsing Layer -- 5.4.2 The Energy Accumulation in the Layer -- 5.4.3 Generation of Electromagnetic Pulses by the Collapsing Layer -- 6: An Electromagnetic Field in a Metallic Waveguide with a Moving Medium -- 6.1 Expansion of an Electromagnetic Field by Non-Stationary Eigen-Functions of a Waveguide -- 6.2 Equations for a Field in the Waveguide with a Non-Stationary Insertion -- 6.3 Vibration of a Boundary of a Plane Dielectric Resonator -- 6.4 Uniform Movement of a Dielectric Layer in Presence of Waveguide Dispersion -- 6.5 Penetration of an Electromagnetic Wave through Plasma Boundary after Its Start in a Waveguide -- 6.6 Interaction of an Electromagnetic Wave with a Plasma Bunch Moving in a Metallic Waveguide -- 6.6.1 Main Ratios for Electromagnetic Waves in a Waveguide with a Relativistic Moving Plasma Bunch -- 6.6.2 Characteristic Matrix for Waves in a Waveguide with a Plasma Layer -- 6.7 Frequency Multiplication and Amplitude Amplification -- 6.7.1 Enhanced Reflectivity from the Moving Plasma Bunch -- 6.8 Resonance Effects in a Stratified Plasma Cluster Moving in a Waveguide -- 6.8.1 The Characteristic Matrix for Stratified Plasma Cluster -- 6.8.2 Resonance Effects -- 7: Non-Stationary Electromagnetic Processes in Time-Varying Dielectric Waveguides -- 7.1 Wave Equations for Longitudinal and Transverse Components in Generalized Functions…”

Tabla de Contenidos: “…Intro -- Title Page -- Copyright Page -- Table of Contents -- Introduction -- About This Book -- Foolish Assumptions -- Icons Used in This Book -- Beyond the Book -- Where to Go from Here -- Part 1 Getting Started with 3D Printing -- Chapter 1 Seeing How 3D Printers Fit into Modern Manufacturing -- Embracing Additive Manufacturing -- Defining additive manufacturing -- Contrasting additive manufacturing with traditional manufacturing -- Machining/subtractive fabrication -- Molding/injection molding -- Understanding the advantages of additive manufacturing -- Personalization -- Complexity -- Sustainability -- Recycling and planned obsolescence -- Economies of scale -- Exploring the Applications of 3D Printing -- Chapter 2 Exploring the Types of 3D Printing -- Exploring Basic Forms of Additive Manufacturing -- Photopolymers -- Granular powders -- Binding powder -- Blown powder -- Laminates -- Filament-based production -- Understanding the Limitations of Current Technologies -- Considering fabrication rates -- Exploring size constraints -- Identifying object design constraints -- Understanding material restrictions -- Chapter 3 Exploring Applications of 3D Printing -- Looking at Current Uses of 3D Printing -- Rapid prototyping -- Direct digital fabrication -- Restoration and repair -- Designing for the Future with 3D Printing -- Household goods -- Buildings -- Bridges -- Examining Molding and Casting through 3D Printing -- Lost-material casting -- Sintered metal infusion -- Applying Artistic Touches and Personalization -- Medical implants -- Biological implants (organs) -- Item personalization -- Clothing and textiles -- Customizing Designs on the Fly -- Military operations -- Space -- Part 2 Outlining 3D-Printing Resources -- Chapter 4 Identifying Available Materials for 3D Printing -- Exploring Extruded Materials -- Thermoplastics…”

Tabla de Contenidos: “…Ten - Sustainability Assessment and Performance Improvement of Electroplating Process Systems -- INTRODUCTION -- FUNDAMENTALS FOR PROCESS SUSTAINABILITY -- SUSTAINABILITY METRICS SYSTEM -- Economic Sustainability -- Environmental Sustainability -- Social Sustainability -- SUSTAINABILITY ASSESSMENT FRAMEWORK -- Technology Evaluation -- Investment Assessment -- Goal Setting and Need for Sustainability Performance Improvement -- Technology Selection -- CASE STUDY -- Technology Candidate Selection -- Technology 1: The Cleaning and Rinse Operation Optimization Technology -- Technology 2: The Optimal Water Use and Reuse Network Design Technology -- Technology 3: The Near-Zero Chemical and Metal Discharge Technology -- Technology 4: The Environmentally Conscious Dynamic Hoist Scheduling Technology [23] -- Sustainability Assessment of Technologies -- Technology Recommendation -- CONCLUDING REMARKS -- ACKNOWLEDGMENT -- REFERENCES -- Eleven - Strategic Sustainable Assessment of Retrofit Design for Process Performance Evaluation -- INTRODUCTION -- STATE OF THE ART -- Sustainability in Retrofit Design -- Economic Pillar -- Environmental Pillar -- Social Pillar -- FRAMEWORK FOR ASSESSMENT OF RETROFIT DESIGN ALTERNATIVES -- Step 1: Identify Bottleneck -- Step 2: Classify the Retrofit Action -- Step 3: Define the Level of Analysis' Detail -- Step 4: Select Economic, Environmental, and Social Indicators -- Step 5: Report the Assessment Employed -- CASE STUDY: β-GALACTOSIDASE PRODUCTION -- Step 1: Identify Bottleneck -- Step 2: Classify the Retrofit Action -- Step 3: Define the Level of Analysis' Detail -- Step 4: Select Economic, Environmental, and Social Indicators -- Step 5: Report the Assessment Employed -- CONCLUSIONS -- REFERENCES -- Twelve - Chemical Engineering and Biogeochemical Cycles: A Techno-Ecological Approach to Industry Sustainability -- MOTIVATION…”

Tabla de Contenidos: “…6.6 Summary -- Exercises -- 7 SIMPLE CODE INJECTION TECHNIQUES FOR ELF -- 7.1 Bare-Metal Binary Modification Using Hex Editing -- 7.2 Modifying Shared Library Behavior Using LD_PRELOAD -- 7.3 Injecting a Code Section -- 7.4 Calling Injected Code -- 7.5 Summary -- Exercises -- PART III: ADVANCED BINARY ANALYSIS -- 8 CUSTOMIZING DISASSEMBLY -- 8.1 Why Write a Custom Disassembly Pass? …”

“…New to this edition: Examples of near-metal antenna techniques Discu…”

“…You'll work with multi-node Kubernetes clusters on Raspberry Pi and networking plugins (such as Calico and Cilium) and implement service mesh, load balancing with MetalLB and Ingress, and AI/ML workloads on MicroK8s. …”

Tabla de Contenidos: “…6.6 The Oven -- 6.7 The Archaeological Material -- 6.8 The Gold Jewelry -- 6.9 Conclusions -- Bibliography -- 7 Towards the Theory of Social Status: Cultural Parameters of Secure Social Status in Prehistory (a -- 7.1 Setting -- 7.2 Towards the Sociological Theory of Social Status -- 7.2.1 Social Position and Social Status -- 7.2.2 Formal and Non-formal Social Status -- 7.2.3 Social Status is Mobile -- 7.2.4 Social Status and Social Class -- 7.2.5 Segmentation and Stratification, Ordinary and Elite -- 7.2.6 Theoretical Synthesis -- 7.3 Towards the Cultural Parameters of Secure Social Status in Prehistory -- 7.3.1 Houses and Secure Status -- 7.3.2 Burials in Settlements as Accumulation of Wealth -- 7.3.3 Prehistoric Figurines and Secure Status -- 7.3.4 Metal and Accumulation of Wealth -- 7.3.5 Sedentarization and Mobility, and Secure Status -- 7.3.6 Wealth and Secure Status -- 7.3.7 Health and Social Status -- 7.3.8 The Wealth of Learning -- 7.3.9 The Social Mind and Security -- 7.4 Social Complexity and Social Status: Yunatsite Culture Case Study -- 7.5 Conclusive Summary -- Bibliography -- 8 The Bronze and Early Iron Age Settlements in Romanian Dobroudja -- 8.1 The Early Bronze Age -- 8.2 The Middle and Late Bronze Age: The Coslogeni Culture -- 8.2.1 The Range -- 8.2.2 The Origin -- 8.2.3 The Evolution -- 8.2.4 The Habitats -- 8.2.4.1 The Settlements -- 8.2.4.1.1 The Types of Settlements -- 8.2.4.1.2 The Location of the Settlements -- 8.2.4.1.3 Size -- 8.2.4.2 The Houses -- 8.2.4.2.1 Types of Houses -- 8.2.4.2.2 The Fire Installations -- 8.2.4.2.2.1 Hearths -- 8.2.4.2.3 The Metallurgical Installations -- 8.2.4.3 The Pits -- 8.2.4.3.1 Domestic and Storage Pits -- 8.2.4.3.2 Ritual Pits -- 8.3 The Iron Age. …”

Tabla de Contenidos: “…Die Suche nach Geschwindigkeit und Skalierbarkeit -- Geld verdienen, zu viel davon -- Erstellung von Rechenzentren -- Anwendungen in der Cloud -- Eintritt in das Geschäft mit Cloud-Plattformen -- Googles Profil -- Maschinen über Menschen -- Benutzerfreundlichkeit über Funktionen -- Geschwindigkeit und Skalierung -- Technokratie -- Open-Source-Treiber -- Auf die lange Sicht -- In Beta bis zur Perfektion -- Zusammenfassung -- 9 Profile von Cloud-Anbietern -- Cloud Profiling -- Kundenorientierung -- Bewertung -- Vision -- Bewertung -- Produktverpackung -- Bewertung -- Zielgruppe der Endnutzer -- Bewertung -- Cloud Fokus -- Bewertung -- Zusammenfassung -- 10 Cloud-Technologie -- Infrastrukturdienste -- Netzwerke -- Computing -- Die Anatomie eines digitalen Computers -- Arten von Rechenleistung -- Arten von Instanzen -- Bare-Metal-Server -- Virtuelle Maschinen -- Container -- Entsprechende Computing-Begriffe und Dienste -- Speicherung -- Entsprechende Speicherbegriffe und -dienste -- Plattformdienste -- Datendienste -- Middleware -- Analytik -- Anwendungsdienste -- Betriebsdienste -- Serverlose Funktionen -- Softwaredienste -- Was ist charakteristisch für SaaS? …”

Tabla de Contenidos: “….); PÁGINA LEGAL; CONTENIDO; PRÓLOGO; 1 EL DINERO; 1.1 Definición; 1.2 Orígenes y desarrollo; 1.2.1 El trueque; 1.2.2 Precursores del dinero; 1.2.3 El oro y los metales preciosos; 1.2.4 La acuñación de monedas; 1.2.5 Consideraciones sobre la historia del dinero en Colombia; 1.2.6 El papel moneda; 1.2.7 Clases de dinero; 1.3 Funciones del dinero; 1.3.1 Medio de cambio o intercambio; 1.3.2 Unidad de cuenta; 1.3.3 Depósito de valor; 1.3.4 Patrón de pagos diferidos; 1.4 La demanda de dinero; 1.4.1 Demanda de dinero para transacciones…”

Tabla de Contenidos: “…10.2.4 Grungelizer -- 10.2.5 Amp Rack -- 10.3 Dynamik -- 10.3.1 Compressor -- 10.3.2 De-Esser -- 10.3.3 Limiter -- 10.3.4 Weitere Kompressoren -- 10.3.5 VSTDynamics -- 10.4 Ausklang -- Kapitel 11: Audio-Effekte II -- 11.1 Equalizer -- 11.1.1 DJ-EQ -- 11.1.2 Studio-EQ -- 11.2 Filter -- 11.2.1 DualFilter -- 11.2.2 MorphFilter -- 11.2.3 StepFilter -- 11.2.4 ToneBooster -- 11.2.5 Wah-Wah -- 11.3 Modulation -- 11.3.1 AutoPan -- 11.3.2 Chopper -- 11.3.3 Chorus -- 11.3.4 Flanger -- 11.3.5 Metalizer -- 11.3.6 Phaser -- 11.3.7 Ringmodulator -- 11.3.8 Rotary -- 11.3.9 Tranceformer -- 11.3.10 Tremolo und Vibrato -- 11.4 Pitch-Shift -- 11.4.1 Octaver -- 11.4.2 Pitch Correct -- 11.5 Ausklang -- Kapitel 12: »Effekt-Effizienz« -- 12.1 Welcher wann, welcher wo? …”

Tabla de Contenidos: “…DevinePart 5: Land Grabbing by Extractive Industries - Fossil Fuels, Minerals and MetalsChapter 15. Arctic Resource Extraction in the Context of Climate Crises and Ecological CollapsesMarkus KrögerChapter 16. …”

Tabla de Contenidos: “…1.4.2.3 Methods of Fabrication of LEDs1.4.2.4 Poly(fluorene)s; 1.4.2.5 NVK/PBD; 1.4.2.6 Functionalized Polymers; 1.4.2.7 Metal Complexes; 1.4.2.8 Mixed Dyes; 1.4.2.9 Multilayer Light-Emitting Diode; 1.4.2.10 Other Chromophores; 1.4.3 Organic Photorefractive Materials; 1.4.3.1 Photorefractive Formulations; 1.4.3.2 Holograms; 1.4.4 Photovoltaic Devices; 1.4.5 Amplified Spontaneous Emission; 1.4.6 Optical Elements; 1.4.7 Antistatic Polymer; 1.4.8 Other Applications; 1.4.8.1 Microscopic Imaging; 1.4.9 Analytical Applications; 1.4.10 Nanocomposites; 1.4.10.1 Poly(pyrrole)-Modified Nanocomposites…”

Tabla de Contenidos: “…RECOMMENDATIONS FOR FUTURE RESEARCH -- IgE Sensitivity -- Immunologically Mediated Adverse Reactions -- Local Versus Systemic Immunity -- Sensitizers -- Individual Differences in Sensitivity -- Development of Self-Antigens -- Effects of Exposure Conditions -- Epidemiology -- IGE AND CELLULAR IMMUNITY -- Cellular and Antibody Immunity -- Individual Variability -- Local Versus Systemic Immunity -- Organic Versus Chemical Hypersensitivity -- Effects of Exposure -- Particle Composition -- Chemical Haptens -- 4 Autoimmune Diseases -- DEFINITION OF THE PROBLEM -- INCIDENCE OF AUTOIMMUNE DISEASES -- SUSCEPTIBILITY VERSUS EXPOSURE -- XENOBIOTIC-INDUCED AUTOIMMUNITY -- MECHANISMS -- ANIMAL MODELS -- BIOLOGIC MARKERS -- MAJOR HISTOCOMPATIBILITY COMPLEX -- IMMUNOGLOBULIN ALLOTYPES -- OTHER GENETIC MARKERS -- RATE OF ACETYLATION -- Antinuclear Antibodies -- Specific Tissue Autoantibodies -- Histopathologic Examination -- Immune Complexes -- Complement -- SUMMARY AND RECOMMENDATIONS -- 5 The Capacity of Toxic Agents to Compromise the Immune System (Biologic Markers of Immunosuppression) -- CONSEQUENCES OF IMMUNOSUPPRESSION -- ENVIRONMENTAL CONTAMINANTS -- Human Studies -- Experimental Studies -- Aromatic Hydrocarbons -- Benzene -- Metals -- Complex Mixtures -- Miscellaneous -- INHALATION AND IMMUNOSUPPRESSION -- SKIN AND IMMUNOSUPPRESSION -- MYELOTOXICITY AND IMMUNOSUPPRESSION -- DIFFICULTIES IN ESTABLISHING HUMAN RISK -- FACTORS THAT AFFECT SUSCEPTIBILITY -- Age and External Factors -- Metabolic Differences -- Species Differences -- IMPORTANCE OF MECHANISTIC STUDIES -- SUMMARY -- RECOMMENDATIONS -- 6 Animal Models for Use in Detecting Immunotoxic Potential And Determining Mechanisms of Action -- ANIMAL IMMUNOTOXICITY BIOASSAYS -- Pathologic Evaluation -- Humoral Immunity -- Cellular Immunity -- Nonspecific Immunity -- Bone Marrow -- Host Resistance…”

Tabla de Contenidos: “…LOCOS-bound Lateral N-Well to N-Well Bipolar ESD Element 738 16.13 LOCOS-bound Lateral N+ to N-well Bipolar ESD Element 738 16.14 LOCOS-bound Lateral pnp Bipolar ESD Element 739 16.15 LOCOS-bound Thick Oxide MOSFET ESD Element 739 16.16 Shallow Trench Isolation 739 16.17 STI-bound ESD Structures 741 16.18 Substrate Modeling - Electrical and Thermal Discretization 746 16.19 Heavily Doped Substrates 750 16.20 Retrograde Wells and ESD Scaling 766 16.21 Triple Well and Isolated MOSFET CMOS 775 16.22 Summary and Closing Comments 779 References 779 17 ESD in Silicon on Insulator 783 17.1 Silicon on Insulator (SOI) Technologies 783 17.2 Elimination of CMOS Latchup 784 17.3 Lack of Vertical Bipolar Transistors 785 17.4 Floating Gate Tie Downs 785 17.5 Physical Separation of MOSFETs from the Bulk Substrate 785 17.6 SOI ESD Design Fundamental Concepts 786 17.7 SOI Lateral Diode Structure 791 17.8 Transistors - Bulk versus SOI Technology 791 17.9 SOI Buried Resistors (BR) Elements 796 17.10 Dynamic Threshold MOS (DTMOS) SOI MOSFET 797 17.11 SOI P+ Body Contact Abutting n+ Drain 798 17.12 Transmission Line Pulse (TLP) Testing of SOI Diode Designs 798 17.13 SOI ESD with MOSFET Drain and Body Width Ratio Variation 799 17.14 SOI Dual-Gate MOSFET Structure 799 17.15 SOI ESD Design - Mixed Voltage T-Shape Layout Style 800 17.16 SOI ESD Design: Double Diode Network 802 17.17 Bulk to SOI ESD Design Remapping 803 17.18 SOI ESD Diode Design Parameters 804 17.19 SOI ESD Design in Mixed Voltage Interface Environments 808 17.20 Comparison of Bulk with SOI ESD Results 809 17.21 SOI ESD Design with Aluminum Interconnects 810 17.22 SOI ESD Design with Copper Interconnects 812 17.23 SOI ESD Design with Gate Circuitry 813 17.24 Summary and Closing Comments 815 References 815 18 ESD in Analog Circuits 821 18.1 Analog Design Circuits 821 18.2 Single-ended Receivers 822 18.3 Schmitt Trigger Receivers 822 18.4 Differential Receivers 822 18.5 Comparators 824 18.6 Current Sources 825 18.7 Current Mirrors 825 18.8 Widlar Current Mirror 826 18.9 Wilson Current Mirror 826 18.10 Voltage Regulators 827 18.11 Buck Converters 828 18.12 Boost Converters 828 18.13 Buck-Boost Converters 829 18.14 Cuk Converters 830 18.15 Voltage Reference Circuits 830 18.16 Brokaw Bandgap Voltage Reference 830 18.17 Converters 831 18.18 Analog-to-Digital Converter (ADC) 831 18.19 Digital-to-Analog Converters (DAC) 832 18.20 Oscillators 832 18.21 Phase Lock Loop (PLL) Circuits 832 18.22 Delay Locked Loop (DLL) 833 18.23 Analog and ESD Design Synthesis 833 18.24 Analog Chip Architecture - Separation of Analog Power from Digital Power, AVDD-DVDD 836 18.25 ESD Failure in Phase Lock Loop (PLL) and System Clock 837 18.26 ESD Failure in Current Mirrors 837 18.27 ESD Failure in Schmitt Trigger Receivers 838 18.28 ESD Design Practice - Prevent ESD Failure in Schmitt Trigger 840 18.29 Analog-Digital Architecture: Isolated Digital and Analog Domains 841 18.30 ESD Protection Solution - Connectivity of AVDD-to-VDD 842 18.31 ESD Solution: Connectivity of AVSS-to-DVSS 843 18.32 Digital and Analog Domain with ESD Power Clamps 843 18.33 Digital and Analog Domain with Master-Slave ESD Power Clamps 846 18.34 High Voltage, Digital, and Analog Domain Floorplan 846 18.35 Floor-planning of Digital and Analog 846 18.36 Inter-domain Signal Lines ESD Failures 849 18.37 Digital-to-Analog Signal Line ESD Failures 849 18.38 Digital-to-Analog Core Spatial Isolation 851 18.39 Digital-to-Analog Core Ground Coupling 851 18.40 Digital-to-Analog Core Resistive Ground Coupling 852 18.41 Digital-to-Analog Core Diode Ground Coupling 852 18.42 Domain-to-Domain Signal Line ESD Networks 852 18.43 Domain-to-Domain Third-party Coupling Networks 853 18.44 Domain-to-Domain Cross-domain ESD Power Clamp 854 18.45 Digital-to-Analog Domain Moat 855 18.46 Analog and ESD Circuit Integration 855 18.47 Integrated Body Ties 856 18.48 Self-Protecting vs Non-self Protecting Designs 856 References 856 19 ESD in RF CMOS 865 19.1 CMOS and ESD 865 19.2 RF CMOS 865 19.3 RF CMOS and ESD 865 19.4 RF CMOS ESD Failure Mechanisms 865 19.5 RF CMOS - ESD Device Comparisons 866 19.6 RF ESD Metrics 867 19.7 Grounded Gate n-channel MOSFET versus STI Diode 868 19.8 Silicon-controlled Rectifier 869 19.9 SCR versus GGNMOS 869 19.10 Shallow Trench Isolation and Polysilicon Gated Diodes 869 19.11 RF ESD Design 870 19.12 RF ESD Design Layout - Circular RF ESD Devices 870 19.13 Disadvantage of RF ESD Circular Element 871 19.14 RF ESD Design - ESD Wiring Design 872 19.15 RF ESD Design - Loading Capacitance 872 19.16 Metal Capacitance 873 19.17 Analog Metal (AM) 873 19.18 RF ESD Design Practices 874 19.19 RF Passives - ESD and Schottky Barrier Diodes 874 19.20 Schottky Barrier Diodes and Metallurgy 875 19.21 Silicon Germanium Schottky Barrier Diodes 876 19.22 Schottky Barrier RF ESD Design Practice 877 19.23 RF Passives - ESD and Inductors 877 19.24 Quality Factor, Q 878 19.25 Incremental Model of an Inductor 878 19.26 Inductor Coil Parameters 878 19.27 RF Passives - ESD and Capacitors 882 19.28 Capacitors and RF Applications 882 19.29 Capacitors in ESD Networks 882 19.30 Types of Radio Frequency Capacitors 883 19.31 Metal-Oxide-Semiconductor and Metal-Insulator-Metal Capacitors 883 19.32 Varactors and Hyper-abrupt Junction Varactor Capacitors 884 19.33 Metal-ILD-Metal Capacitors 884 19.34 Vertical Parallel Plate (VPP) Capacitors 884 19.35 Tips: ESD RF Design Practices for Capacitors 885 19.36 Summary and Closing Comments 886 Problems 886 References 888 20 ESD in Silicon Germanium 891 20.1 Heterojunctions Bipolar Transistors 891 20.2 Silicon Germanium 891 20.3 Silicon Germanium HBT Devices 892 20.4 Silicon Germanium Device Structure 893 20.5 Silicon Germanium Film Deposition 894 20.6 Silicon Germanium Emitter-Base Region 895 20.7 Silicon Germanium Physics 895 20.8 Silicon Germanium Bandgap 896 20.9 Silicon Germanium Intrinsic Temperature 896 20.10 Position-dependent Silicon Germanium Profile 896 20.11 Position-dependent Intrinsic Temperature 897 20.12 SiGe Collector Current with Graded Germanium Concentration 897 20.13 Silicon Germanium ESD and Time Constants 898 20.14 Silicon Germanium Base Transit Time 898 20.15 Silicon Germanium Breakdown Voltages 898 20.16 Silicon Germanium ESD Measurements 899 20.17 Silicon Germanium Collector-to-Emitter ESD Stress 899 20.18 Transmission Line Pulse Testing of Silicon Germanium HBT 899 20.19 Transmission Line Pulse (TLP) I-V Characteristic 899 20.20 Wunsch-Bell Characteristic of Silicon Germanium HBT 901 20.21 Comparison of Silicon Germanium HBT and Silicon BJT 901 20.22 Wunsch-Bell Characteristic of SiGe HBT versus Si BJT 902 20.23 Intrinsic Base Resistance in SiGe HBT 904 20.24 SiGe HBT Electro-thermal HBM Simulation of Collector-Emitter Stress 904 20.25 Silicon Germanium Transistor Emitter-Base Design 905 20.26 Epitaxial-Base Hetero-Junction Bipolar Transistor (HBT) Emitter-Base Design 907 20.27 Self-aligned Silicon Germanium HBT Device 907 20.28 Non-Self Aligned Silicon Germanium HBT 908 20.29 Emitter-Base Design RF Frequency Performance Metrics 908 20.30 SiGe HBT Emitter-Base Resistance Model 909 20.31 SiGe HBT Emitter-Base Design and Silicide Placement 909 20.32 Silicide Material and ESD 910 20.33 Titanium Silicide and ESD 911 20.34 Cobalt Salicide 913 20.35 Self-aligned (SA) Emitter Base Design 914 20.36 Non-Self Aligned (NSA) Emitter Base Design 917 20.37 Non-Self Aligned HBT Human Body Model (HBM) Step Stress 918 20.38 Transmission Line Pulse (TLP) Step Stress 918 20.39 RF Testing of SiGe HBT Emitter-Base Configuration 921 20.40 Unity Current Gain Cutoff Frequency - Collector Current Plots 923 20.41 f MAX and f T 924 20.42 Electrothermal Simulation of Emitter-Base Stress 925 20.43 Field-Oxide (FOX) Isolation Defined Silicon Germanium Heterojunction Bipolar Transistor HBM Data 926 20.44 Silicon Germanium HBT Multiple-emitter Study 927 20.45 RF ESD Design Practice 927 20.46 Silicon Germanium ESD Failure Mechanisms 928 20.47 Summary and Closing Comments 928 References 928 21 ESD in Silicon Germanium Carbon 935 21.1 Heterojunctions and Silicon Germanium Carbon Technology 935 21.2 Silicon Germanium Carbon 935 21.3 Silicon Germanium Carbon Collector-Emitter ESD Measurements 937 21.4 Silicon Germanium Transistor Emitter-Base Design 940 21.5 Silicon Germanium Carbon - ESD-Induced S-Parameter Degradation 943 21.6 Silicon Germanium Carbon ESD Failure Mechanisms 945 21.7.…”

Tabla de Contenidos: “…Cover -- Impressum -- Inhaltsverzeichnis -- Einleitung -- Teil I: Einführung und Einrichtung einer Entwicklungsumgebung -- Kapitel 1: Embedded Linux -- 1.1 Desktop-Betriebssysteme -- 1.2 Bare-Metal vs. Betriebssystem -- 1.2.1 Mikroprozessoren vs. …”

Tabla de Contenidos: “…4 Example Applications -- 5 Conclusions -- References -- Controlling Single Molecule Conjugated Oligomers and Polymers with DNA -- 1 Modular Self-Assembly of Molecular Components -- 2 Conjugated Polymers on DNA Origami -- 3 Work from Other Groups -- 4 Conclusion -- References -- Organizing Charge Flow with DNA -- 1 Origami's Rise -- 2 Making DNA Nanostructures Conductive Through Metallization -- 3 Decorating Origami -- 3.1 DNA Scaffolding for Conductive Metals -- 3.2 DNA Scaffolds for Conductive Polymers -- 3.3 DNA Scaffolds for Carbon Nanotubes -- 3.4 Highly Ordered, Three-Dimensional DNA-CNT Arrays -- 4 The Future of DNA-Organized Electronics -- 4.1 Making DNA More Electronic -- 4.2 Scaffolding Biocompatible Electronic Materials -- References -- DNA Assembly of Dye Aggregates-A Possible Path to Quantum Computing -- 1 Introduction -- 2 The Mathematical Structure of Reality -- 3 Quantum Computers -- 3.1 The Controlled NOT Gate -- 3.2 Quantum Parallelism -- 4 The Frenkel Exciton Hamiltonian -- 5 Energy Eigenvalues of a Homodimer Dye Aggregate and Davydov Splitting -- 6 Coherent Exciton Hopping -- 7 Exciton Transmission Lines -- 8 Representation of an Exciton Qubit -- 9 Basis Change Gates -- 10 Phase Gates -- 11 An Exciton Interferometer -- 12 A Controlled Phase Shift -- 13 A CNOT Gate -- 14 Exciton-Based Quantum Computer Architecture -- 15 But Isn't a Quantum Computer Just an Analog Computer? …”

Tabla de Contenidos: “…Arcilla -- 4.3. Óstracon -- 4.4. Metal -- 4.5. Papiro -- 4.6. Pergamino -- 4.7. Códice -- 5. …”

“…Other chapters review other emerging battery technologies such as metal-air batteries and flow batteries. The final section of the book discuses design considerations and applications of batteries in remote locations and for grid-scale storage. …”

Tabla de Contenidos: “…Combustion Instability -- Acoustic Instabilities -- Analytical Models and Simulation of Combustion Stability -- Combustion Stability Assessment, Remedy, and Design -- Vortex-Shedding Instability -- Problems -- References -- Chapter 15: Solid Rocket Motor Components and Design -- 15.1. Rocket Motor Case -- Metal Cases -- Wound-Filament-Reinforced Plastic Cases -- 15.2. …”