Tabla de Contenidos: “…Average Value; D. The Inductor; E. The Capacitor; F. Phase Relationships; G. …”

Tabla de Contenidos: “….) -- 3-13* SELECCIÓN DE SUBSTRATOS -- 3-14* EFECTOS DEL BLINDAJE -- CAPÍTULO 4 COMPONENTES EN MICROONDAS -- 4-1 * COMPONENTES DE MICROONDAS -- 4-2* CAPACITORES -- 4-3* PROPIEDADES ELÉCTRICAS -- 4-4* RESONANCIA SERIE -- 4-5* PÉRDIDAS DE INSERCIÓN -- 4-6* CRITERIO DE SELECCIÓN Y MONTAJE -- 4-7* RESISTORES CHIP -- 4-8* ALGUNAS CARACTERÍSTICAS ELÉCTRICAS -- 4-9* INDUCTORES CHIP -- CAPÍTULO 5 DISEÑO DE AMPLIFICADORES -- 5-1 * PARÁMETROS DE DISPERSIÓN -- 5-2* COEFICIENTES DE REFLEXIÓN DE UN CUADRIPOLO -- 5-3* ESTABILIDAD -- 5-4* CIRCUIOS DE ESTABILIDAD -- 5-5* GANANCIA DE POTENCIA -- 5-6* CÍRCULOS DE GANANCIA CONSTANTE -- 5-7* RUIDO…”

Tabla de Contenidos: “…Waveshaping Techniques to Improve Switching Power Supply Efficiency; 4.1 Major Losses within the PWM Switching Power Supply; 4.2 Techniques for Reducing the Major Losses; 4.3 Snubbers; 4.4 The Active Clamp; 4.5 Saturable Inductors to Limit Rectifier Reverse Recovery Current; 4.6 Quasi-resonant Converters…”

Tabla de Contenidos: “…Chapter 108.Resistor and capacitor letter and digit codeChapter 102.RC time constants; Chapter 106.RL time constants; Chapter 103.Reactance of capacitors at spot frequencies; Chapter 104.Reactance of inductors at spot frequencies; Chapter 139.Transistor letter symbols; Chapter 30.Common transistor and diode data; Chapter 117.Pro Electron system of Semiconductor type labelling,; Chapter 136.Thyristors; Chapter 18. …”

Tabla de Contenidos: “…Shunt Failure 450 10.20 ESD Clamp Element - Width Scaling 450 10.21 ESD Clamp Element - On-resistance 450 10.22 ESD Clamp Element - Safe Operating Area (SOA) 451 10.23 ESD Power Clamp Issues 451 10.24 ESD Power Clamp Issues - Power-up and Power-down 451 10.25 ESD Power Clamp Issues - False Triggering 452 10.26 ESD Power Clamp Issues - Pre-charging 452 10.27 ESD Power Clamp Issues - Post-charging 452 10.28 ESD Power Clamp Design 453 10.29 ESD Power Clamp Design Synthesis - Forward Bias Triggered ESD Power Clamps 456 10.30 Series Stacked RC-triggered ESD Power Clamps 459 10.31 Triple Well Diode String ESD Power Clamp 463 10.32 Bipolar ESD Power Clamps 464 10.33 ESD Power Clamp Design Synthesis - Bipolar ESD Power Clamps 469 10.34 Bipolar ESD Power Clamps with Frequency Trigger Elements: Capacitance-triggered 480 10.35 Silicon Controlled Rectifier Power Clamps 481 References 486 11 ESD Architecture and Floor Planning 491 11.1 ESD Design Floor Plan 491 11.2 Peripheral I/O Design 492 11.3 Pad Limited Peripheral I/O Design Architecture 493 11.4 Pad Limited Peripheral I/O Design Architecture - Staggered I/O 493 11.5 Core Limited Peripheral I/O Design Architecture 495 11.6 Lumped ESD Power Clamp in Peripheral I/O Design Architecture 496 11.7 Lumped ESD Power Clamp in Peripheral I/O Design Architecture in the Semiconductor Chip Corners 496 11.8 Lumped ESD Power Clamp in Peripheral I/O Design Architecture - Power Pads 497 11.9 Lumped ESD Power Clamp in Peripheral I/O Design Architecture - Master/Slave ESD Power Clamp System 498 11.10 Array I/O 498 11.11 Array I/O Nibble Architecture 501 11.12 Array I/O Pair Architecture 503 11.13 Array I/O - Fully Distributed 504 11.14 ESD Architecture - Dummy Bus Architecture 507 11.15 ESD Architecture - Dummy VDD Bus 507 11.16 ESD Architecture - Dummy Ground (VSS) Bus 508 11.17 Native Voltage Power Supply Architecture 508 11.18 Single Power Supply Architecture 509 11.19 Mixed Voltage Architecture 509 11.20 Mixed Voltage Architecture - Single Power Supply 509 11.21 Mixed Voltage Architecture - Dual Power Supply 511 11.22 Mixed Signal Architecture 514 11.23 Digital and Analog Floor Plan - Placement of Analog Circuits 515 11.24 Mixed Signal Architecture - Digital, Analog, and RF Architecture 518 11.25 ESD Power Grid Design 519 11.26 I/O to Core Guard Rings 525 11.27 Within I/O Guard Rings 527 11.28 ESD-to-I/O Off-Chip Driver (OCD) Guard Ring 527 11.29 Guard Rings and Computer Aided Design (CAD) Methods 539 11.30 Summary and Closing Comments 541 References 541 12 ESD Digital Design 551 12.1 Fundamental Concepts of ESD Design 551 12.2 Concepts of ESD Digital Design 551 12.3 Device Response to External Events 552 12.4 Alternative Current Loops 553 12.5 Decoupling of Feedback Loops 554 12.6 Decoupling of Power Rails 554 12.7 Local and Global Distribution 554 12.8 Usage of Parasitic Elements 555 12.9 Unused Section of a Semiconductor Device, Circuit, or Chip Function 556 12.10 Unused Corners 556 12.11 Unused White Space 556 12.12 Impedance Matching Between Floating and Non-floating Networks 556 12.13 Unconnected Structures 557 12.14 Symmetry 557 12.15 Design Synthesis 557 12.16 ESD, Latchup, and Noise 559 12.17 Structures Under Bond Pads 574 12.18 Summary and Closing Comments 575 References 576 13 ESD Analog Design 583 13.1 Analog Design: Local Matching 583 13.2 Analog Design: Global Matching 583 13.3 Symmetry 584 13.4 Analog Design - Local Matching 584 13.5 Analog Design - Global Matching 584 13.6 Common Centroid Design 586 13.7 Common Centroid Arrays 586 13.8 Interdigitation Design 586 13.9 Common Centroid and Interdigitation Design 587 13.10 Dummy Resistor Layout 593 13.11 Thermoelectric Cancelation Layout 593 13.12 Electrostatic Shield 593 13.13 Interdigitated Resistors and ESD Parasitics 594 13.14 Capacitor Element Design 595 13.15 Inductor Element Design 596 13.16 ESD Failure in Inductors 597 13.17 Inductor Physical Variables 598 13.18 Inductor Element Design 599 13.19 Diode Design 599 13.20 Analog ESD Circuits 602 13.21 ESD MOSFETs 607 13.24 Analog Differential Pair Common Centroid Design Layout - Signal-pin to Signal-pin and Parasitic ESD Elements 620 13.25 Summary and Closing Comments 624 References 624 14 ESD RF Design 629 14.1 Fundamental Concepts of ESD Design 629 14.2 Fundamental Concepts of RF ESD Design 632 14.3 RF CMOS Input Circuits 637 14.4 RF CMOS Impedance Isolation LC Resonator ESD Networks 647 14.5 RF CMOS LC-diode Networks Experimental Results 648 14.6 RF CMOS LNA ESD Design - Low Resistance ESD Inductor and ESD Diode Clamping Elements in Π-configuration 650 14.7 RF CMOS T-coil Inductor ESD Input Network 653 14.8 RF CMOS Distributed ESD Networks 655 14.9 RF CMOS Distributed ESD-RF Networks 656 14.10 RF CMOS Distributed RF-ESD Networks Using Series Inductors and Dual-diode Shunts 656 14.11 RF CMOS Distributed RF-ESD Networks Using Series Inductors and MOSFET Parallel Shunts 659 14.12 RF CMOS Distributed ESD Networks - Transmission Lines and Co-planar Waveguides 661 14.13 RF CMOS - ESD and RF LDMOS Power Technology 663 14.14 Summary and Closing Comments 666 References 666 15 ESD Power Electronics Design 681 15.1 Reliability Technology Scaling and the Reliability Bathtub Curve 681 15.2 Input Circuitry 686 15.3 Summary and Closing Comments 702 References 702 16 ESD in Advanced CMOS 709 16.1 Interconnects and ESD 709 16.2 Aluminum Interconnects 710 16.3 Interconnects - Vias 714 16.4 Interconnects - Wiring 715 16.5 Junctions 719 16.6 Titanium Silicide 725 16.7 Shallow Trench Isolation 731 16.8 LOCOS-bound ESD Structures 734 16.9 LOCOS-bound p+/n-well Junction Diodes 734 16.10 LOCOS-bound n+ Junction Diodes 736 16.11 LOCOS-bound n-well/Substrate Diodes 737 16.12.…”

Tabla de Contenidos: “…Chapter 11: Selecting Components for LED Drivers11.1 Discrete Semiconductors; 11.2 Passive Components; 11.3 The Printed Circuit Board (PCB); 11.4 Operational Amplifiers and Comparators; Chapter 12: Magnetic Materials for Inductors and Transformers; 12.1 Ferrite Cores; 12.2 Iron Dust Cores; 12.3 Special Cores; 12.4 Core Shapes and Sizes; 12.5 Magnetic Saturation; 12.6 Copper Losses; Chapter 13: EMI and EMC Issues; 13.1 EMI Standards; 13.2 Good EMI Design Techniques; 13.3 EMC Standards; 13.4 EMC Practices; Chapter 14: Thermal Considerations; 14.1 Efficiency and Power Loss…”

Tabla de Contenidos: “…8.3 Valoración por flujo de caja descontado -- 8.3.1 Horizonte de planeación (n) -- 8.3.2 Flujo de caja libre operacional (FCLO) -- 8.3.3 Costo de capital (WACC) -- 8.3.4 Valor terminal (VT) -- 8.3.5 Cálculo del valor de mercado de la empresa (VME) -- 8.3.6 Cálculo del valor de mercado del patrimonio (VMK) -- 8.4 Impacto de las variables en el VMK -- 8.4.1 Impacto del endeudamiento -- 8.4.2 Impacto del modelo de valor terminal -- 8.5 Otros métodos de valoración por descuento de flujos -- 8.5.1 Valoración por descuento de dividendos -- 8.5.2 Valoración por descuento de ingreso residual -- cuarta parte: -- Evaluar el valor creado -- Evaluación del valor creado -- 9.1.1 Impacto de las variables en la valorización del patrimonio -- 9.2 EVA -- 9.2.1 Usos del EVA -- 9.2.2 Impacto de las variables en el EVA -- 9.2.3 Valoración por EVA -- 9.3 Otras formas de evaluar la creación de valor -- 9.3.1 Market Value Added (MVA) -- 9.3.2 Comprobación por múltiplos -- 9.3.3 Rentabilidad del propietario -- Diagnóstico de la planeación financiera -- 10.1 Inductores de valor -- 10.1.1 Indicadores inductores -- 10.1.2 La pirámide del valor -- 10.1.3 Actividades inductoras -- 10.2 Análisis de sensibilidad -- 10.3 Tablero de control -- 10.4 Análisis de escenarios -- 10.5 Simulación -- Herramientas del Excel -- Modelaje financiero -- Tablas de datos -- Buscar objetivo -- Escenarios -- Bibliografía…”

Tabla de Contenidos: “…-- 1.5 SUMMARY -- 1.6 PROBLEMS -- Chapter 2 Semiconductor Devices from a Circuit-Theoretic Standpoint -- 2.1 LINEAR CIRCUIT ELEMENTS -- 2.1.1 Linear Resistors -- 2.1.2 Linear Capacitors -- 2.1.3 Linear Inductors -- 2.2 NONLINEAR CIRCUIT ELEMENTS -- 2.2.1 Nonlinear Resistors -- 2.2.2 Nonlinear Capacitors and Inductors -- 2.3 TIME-INVARIANT AND TIME-VARYING CIRCUIT ELEMENTS -- 2.4 MULTITERMINAL ELEMENTS AND CONTROLLED SOURCES -- 2.5 TRANSISTORS -- 2.6 CIRCUIT-THEORETIC POSITIONING OF SEMICONDUCTOR DEVICES -- 2.7 SUMMARY -- 2.8 PROBLEMS -- Chapter 3 Waves in Periodic Structures -- 3.1 ANALOGIES IN PHYSICS -- 3.1.1 Commonality of Mathematical Structures -- 3.1.2 Overview of the Chapter -- 3.2 PROPERTIES OF PERIODIC NETWORKS -- 3.2.1 Infinitely Long Ladder Networks -- 3.2.2 Infinitely Long LC Ladders -- 3.2.3 Lossless Transmission Lines -- 3.2.4 Periodic Networks with a Finite Number of Repetitions -- 3.2.5 Kronig-Penney Model -- 3.3 DISPERSION RELATION AND PHASE AND GROUP VELOCITIES -- 3.3.1 Dispersion Relation -- 3.3.2 Phase Velocity and Group Velocity -- 3.3.3 Calculation of the Dispersion Relation -- 3.4 DISPERSION RELATION AND PROPERTIES OF SEMICONDUCTORS -- 3.5 BRAGG REFLECTION -- 3.6 SUMMARY -- 3.7 PROBLEMS -- Chapter 4 Physics of Semiconductors in Equilibrium…”

Tabla de Contenidos: “…Reparto de los costos a través de los inductores -- 5.5. Clases de inductores -- 5.6. Sistema de costeo ABC orientado al análisis -- 4. …”

Tabla de Contenidos: “…10.6 Transients in Capacitive Networks: The Discharging Phase -- 10.7 Initial Conditions -- 10.8 Instantaneous Values -- 10.9 Thévenin Equivalent: T = RThC -- 10.10 The Current iC -- 10.11 Capacitors in Series and in Parallel -- 10.12 Energy Stored by a Capacitor -- 10.13 Stray Capacitances -- 10.14 Applications -- 10.15 Computer Analysis -- 11 Inductors -- 11.1 Introduction -- 11.2 Magnetic Field -- 11.3 Inductance -- 11.4 Induced Voltage vL -- 11.5 R-L Transients: The Storage Phase -- 11.6 Initial Conditions -- 11.7 R-L Transients: The Release Phase -- 11.8 Thévenin Equivalent: T = L/RTh -- 11.9 Instantaneous Values -- 11.10 Average Induced Voltage: vLav -- 11.11 Inductors in Series and in Parallel -- 11.12 Steady-State Conditions -- 11.13 Energy Stored by an Inductor -- 11.14 Applications -- 11.15 Computer Analysis -- 12 Magnetic Circuits -- 12.1 Introduction -- 12.2 Magnetic Field -- 12.3 Reluctance -- 12.4 Ohm's Law for Magnetic Circuits -- 12.5 Magnetizing Force -- 12.6 Hysteresis -- 12.7 Ampère's Circuital Law -- 12.8 Flux φ -- 12.9 Series Magnetic Circuits: Determining NI -- 12.10 Air Gaps -- 12.11 Series-Parallel Magnetic Circuits -- 12.12 Determining φ -- 12.13 Applications -- 13 Sinusoidal Alternating Waveforms -- 13.1 Introduction -- 13.2 Sinusoidal ac Voltage Characteristics and Definitions -- 13.3 Frequency Spectrum -- 13.4 The Sinusoidal Waveform -- 13.5 General Format for the Sinusoidal Voltage or Current -- 13.6 Phase Relations -- 13.7 Average Value -- 13.8 Effective (rms) Values -- 13.9 Converters and Inverters -- 13.10 ac Meters and Instruments -- 13.11 Applications -- 13.12 Computer Analysis -- 14 The Basic Elements and Phasors -- 14.1 Introduction -- 14.2 Response of Basic R, L, and C Elements to a Sinusoidal Voltage or Current -- 14.3 Frequency Response of the Basic Elements -- 14.4 Average Power and Power Factor…”

Tabla de Contenidos:

Tabla de Contenidos: “…Section 9-3: Switched Capacitor Voltage ConvertersChapter 10: Passive Components; Section 10-1: Capacitors; Section 10-2: Resistors and Potentiometers; Section 10-3: Inductors; Chapter 11: Overvoltage Effects on Analog Integrated Circuits; Section 11-1: Overvoltage Effects; Section 11-2: Electrostatic Discharge; Section 11-3: EMI/RFI Considerations; Chapter 12: Printed Circuit-Board Design Issues; Section 12-1: Partitioning; Section 12-2: Traces; Section 12-3: Grounding; Section 12-4: Decoupling; Section 12-5: Thermal Management; Index; Subject Index; A; B; C; D; E; F; G; H; I; J; K; L; M; N…”

Tabla de Contenidos: “…3.6.3 Physical Properties of Microstrip Lines -- 3.7 Supplementary Problems -- References -- Chapter 4 Planar Circuit Design II -- 4.1 Introduction -- 4.2 Discontinuities in Microstrip -- 4.2.1 Open‐End Effect -- 4.2.2 Step‐Width -- 4.2.3 Corners -- 4.2.4 Gaps -- 4.2.5 T‐Junctions -- 4.3 Microstrip Enclosures -- 4.4 Packaged Lumped‐Element Passive Components -- 4.4.1 Typical Packages for RF Passive Components -- 4.4.2 Lumped‐Element Resistors -- 4.4.3 Lumped‐Element Capacitors -- 4.4.4 Lumped‐Element Inductors -- 4.5 Miniature Planar Components -- 4.5.1 Spiral Inductors -- 4.5.2 Loop Inductors -- 4.5.3 Interdigitated Capacitors -- 4.5.4 Metal-Insulator-Metal Capacitor -- References -- Chapter 5 S‐Parameters -- 5.1 Introduction -- 5.2 S‐Parameter Definitions -- 5.3 Signal Flow Graphs -- 5.4 Mason's Non‐touching Loop Rule -- 5.5 Reflection Coefficient of a Two‐Port Network -- 5.6 Power Gains of Two‐Port Networks -- 5.7 Stability -- 5.8 Supplementary Problems -- {5.A.1} Transmission Parameters (ABCD Parameters) -- {5.A.2} Admittance Parameters (Y‐Parameters) -- {5.A.3} Impedance Parameters (Z‐Parameters) -- References -- Chapter 6 Microwave Ferrites -- 6.1 Introduction -- 6.2 Basic Properties of Ferrite Materials -- 6.2.1 Ferrite Materials -- 6.2.2 Precession in Ferrite Materials -- 6.2.3 Permeability Tensor -- 6.2.4 Faraday Rotation -- 6.3 Ferrites in Metallic Waveguide -- 6.3.1 Resonance Isolator -- 6.3.2 Field Displacement Isolator -- 6.3.3 Waveguide Circulator -- 6.4 Ferrites in Planar Circuits -- 6.4.1 Planar Circulators -- 6.4.2 Edge‐Guided‐Mode Propagation -- 6.4.3 Edge‐Guided‐Mode Isolator -- 6.4.4 Phase Shifters -- 6.5 Self‐Biased Ferrites -- 6.6 Supplementary Problems -- References -- Chapter 7 Measurements -- 7.1 Introduction -- 7.2 RF and Microwave Connectors -- 7.2.1 Maintenance of Connectors -- 7.2.2 Connecting to Planar Circuits…”

Tabla de Contenidos: “…20.3 Fem de movimiento20.4 Generadores; 20.5 Autoinductancia; 20.6 Circuitos RL; 20.7 Energía almacenada en un campo magnético; Resumen; 21 CIRCUITOS DE CORRIENTE ALTERNA Y ONDAS ELECTROMAGNÉTICAS ; 21.1 Resistores en un circuito CA; 21.2 Capacitores en un circuito CA; 21.3 Inductores en un circuito CA; 21.4 El circuito RLC en serie; 21.5 Potencia en un circuito CA; 21.6 Resonancia en un circuito RLC en serie; 21.7 El transformador; 21.8 Predicciones de Maxwell; 21.9 Confirmación de Hertz de las predicciones de Maxwell; 21.10 Producción de ondas electromagnéticas mediante una antena…”

Tabla de Contenidos: “…4.7.2 Historia de la Maquila4.7.3 Clasificación de la Maquila; 4.7.4 Maquila Exportadora; 4.8 OUTSOURCING; 4.8.1 Definición; CAPÍTULO 5 COSTOS INDIRECTOS DE FABRICACIÓN; 5.1 COSTOS INDIRECTOS DE FABRICACIÓN; 5.1.1 Asignación de los Costos Indirectos de Fabricación; 5.2 PRESUPUESTO OPERACIÓN DEL INDUCTOR POI:; 5.3 CONTABILIZACIÓN DE LOS COSTOS INDIRECTOS DE FABRICACIÓN; 5.4 COSTOS INDIRECTOS DE FABRICACIÓN REALES; 5.5 COSTOS INDIRECTOS DE FABRICACION PRESUPUESTADOS O APLICADOS; 5.6 COSTOS INDIRECTOS DE FABRICACIÓN SUB APLICADOS; 5.7 COSTOS INDIRECTOS DE FABRICACIÓN SOBRE APLICADOS…”

Tabla de Contenidos: “…3.2 TRANSFORMADORES MONOFÁSICOS: CONSTITUCIÓN Y FUNCIONAMMIENTO3.3 FUERZA ELECTROMOTRIZ EN EL PRIMARIO Y EN EL SECUNDARIO; 3.4 RELACIONES FUNDAMENTALES EN UN TRANSFORMADOR IDEAL; 3.5 EL TRANSFORMADOR REAL; 3.6 RENDIMIENTO DE UN TRANSFORMADOR; 3.7 TRANSFORMADORES TRIFÁSICOS; 3.8 USO DE TRANSFORMADORES A BORDO; CAPÍTULO IV MÁQUINAS ELÉCTRICAS DE CORRIENTE CONTINUA; 4.1 MÁQUINAS ELÉCTRICAS; 4.2 DINAMOS; 4.3 DEVANADOS DEL INDUCIDO; 4.4 EXCITACIÓN DE LAS DINAMOS. DEVANADOS INDUCTORES; 4.5 DINAMO DE EXCITACIÓN INDEPENDIENTE; 4.6 DINAMO CON EXCITACIÓN EN SERIE…”

Tabla de Contenidos: “…2.6.4 Thermoelectric Cancellation Layout 2.6.5 Electrostatic Shield; 2.6.6 Interdigitated Resistors and ESD Parasitics; 2.7 Capacitor Element Design; 2.8 Inductor Element Design; 2.9 Diode Design; 2.10 MOSFET Design; 2.11 Bipolar Transistor Design; 2.12 Closing Comments and Summary; References; Chapter 3 3 Analog Design Circuits; 3.1 Analog Circuits; 3.2 Single-Ended Receivers; 3.2.1 Single-Ended Receivers; 3.2.2 Schmitt Trigger Receivers; 3.3 Differential Receivers; 3.4 Comparators; 3.5 Current Sources; 3.6 Current Mirrors; 3.6.1 Widlar Current Mirror; 3.6.2 Wilson Current Mirror…”

Tabla de Contenidos: “…-- I Fix, Therefore I am: The Philosophy Of Troubleshooting: -- Why things work in the first place -- Products as art -- If it only had a brain -- Good, the bad and the sloppy -- Mistakes beginners make -- That's how it goes -- History lessons -- Initial evaluation -- Use your noodle: case histories -- Naming Names: Important Terms, Concepts And Building Blocks: -- Electrical concepts -- Circuit concepts -- Signal concepts -- Building blocks -- Working Your Weapons: Using Test Equipment: -- Digital multimeter -- ESR meter -- Oscilloscope -- Soldering iron -- Desoldering tools -- Power supply -- Transistor tester -- Capacitance meter -- Signal generator -- Frequency counter -- Analog meter -- Contact cleaner spray -- Component cooler spray -- What Little Gizmos Are Made Of: Components: -- Capacitors -- Crystals and resonators -- Crystal clock oscillators -- Diodes and rectifiers -- Fuses -- Inductors and transformers -- Integrated circuits -- Op amps -- Resistors -- Potentiometers -- Relays -- Switches -- Transistors -- Voltage regulators -- Zener diodes -- Road Maps And Street Signs: Diagrams: -- Hooked On Tronics: -- Call numbers -- Good, not bad and miserable schematics -- Once Upon A Time: -- Amplifier stage -- Switching power supply -- Push-pull audio amplifier -- Mega maps -- Give It A Try: -- Radios -- CD and DVD players -- Keep reading -- But I ain't got one! …”

Tabla de Contenidos: “…RF AND MICROWAVETRANSMITTER DESIGN; Contents; Preface; Introduction; References; 1 Passive Elements and Circuit Theory; 1.1 Immittance Two-Port Network Parameters; 1.2 Scattering Parameters; 1.3 Interconnections of Two-Port Networks; 1.4 Practical Two-Port Networks; 1.4.1 Single-Element Networks; 1.4.2 - and T -Type Networks; 1.5 Three-Port Network with Common Terminal; 1.6 Lumped Elements; 1.6.1 Inductors; 1.6.2 Capacitors; 1.7 Transmission Line; 1.8 Types of Transmission Lines; 1.8.1 Coaxial Line; 1.8.2 Stripline; 1.8.3 Microstrip Line; 1.8.4 Slotline; 1.8.5 Coplanar Waveguide; 1.9 Noise…”

Tabla de Contenidos: “…10.1.1 Calculation of the maximum power conversion efficiency -- 10.2 Low-voltage starter -- 10.2.1 Enhanced swing ring oscillator -- 10.2.2 Dickson charge pump -- 10.2.3 AC model of ESRO -- 10.2.4 Important formulas for the LVS block -- 10.3 Power equations for convertor operating in DCM -- 10.3.1 Boost convertor -- 10.3.2 Maximum extraction of power from a low-voltage source V TEG -- 10.3.3 Sizing auxiliary and main stage inductors -- 10.4 Peripheral circuits -- 10.4.1 Current starved ring oscillator -- 10.4.2 Reference generator and node sensing network -- 10.4.3 Zero current switching network -- 10.4.4 Control logic -- 10.5 Test and measurement -- 10.5.1 Inductors for ESRO coupled with DCP -- 10.6 Conclusion -- Acknowledgments -- References -- Chapter 11: Managing concept drift in IoT health data streams: A dynamic adaptive weighted ensemble approach -- 11.1 Introduction -- 11.1.1 Concept of drift -- 11.1.2 Significance of adaptive learning in IoT with machine learning for health data -- 11.2 Literature survey -- 11.2.1 Drift phenomenon -- 11.2.2 Adaptive learning models towards IoT -- 11.3 Methodology -- 11.3.1 Dataset description -- 11.3.2 Data preprocessing -- 11.3.3 Implementation of DAWE -- 11.3.3.1 Base learners -- 11.3.3.2 Proposed ensemble strategy for DAWE -- 11.4 Experimental results -- 11.5 Discussion and future scope -- 11.6 Conclusions -- Acknowledgments -- References -- Chapter 12: GraLSTM: A distributed learning model for efficient IoT resource allocation in healthcare -- 12.1 Introduction -- 12.1.1 How is IoT useful for the healthcare sector? …”