“…Finally, the design of organ chips for cartilage scaffolds and integration of sensors are covered in separate chapters. …”

“…The first part, 'Siliceous rocks: procurement and distribution systems', looks at production systems and the diffusion of mining products, while the second, 'Flint mines and chipping floors', focuses on knapping activities…”

Tabla de Contenidos: “…Manufacturing Process -- 6.4.1. Semiconductor Chips -- 6.4.2. Die Attach -- 6.4.3. Wire Bonds -- 6.4.4. …”

Tabla de Contenidos: “…2.3.5 Mobile Device Classes -- 2.3.6 Network Mode of Operation -- 2.3.7 GPRS Logical Channels on the Air Interface -- 2.4 The GPRS State Model -- 2.5 GPRS Network Elements -- 2.5.1 The Packet Control Unit (PCU) -- 2.5.2 The Serving GPRS Support Node (SGSN) -- 2.5.3 The Gateway GPRS Support Node (GGSN) -- 2.6 GPRS Radio Resource Management -- 2.7 GPRS Interfaces -- 2.8 GPRS Mobility Management and Session Management (GMM/SM) -- 2.8.1 Mobility Management Tasks -- 2.8.2 GPRS Session Management -- Questions -- References -- Chapter 3 Universal Mobile Telecommunications System (UMTS) and High-Speed Packet Access (HSPA) -- 3.1 Overview, History and Future -- 3.1.1 3GPP Release 99: The First UMTS Access Network Implementation -- 3.1.2 3GPP Release 4: Enhancements for the Circuit-Switched Core Network -- 3.1.3 3GPP Release 5: High-Speed Downlink Packet Access -- 3.1.4 3GPP Release 6: High-Speed Uplink Packet Access (HSUPA) -- 3.1.5 3GPP Release 7: Even Faster HSPA and Continued Packet Connectivity -- 3.1.6 3GPP Release 8: LTE, Further HSPA Enhancements and Femtocells -- 3.1.7 3GPP Release 9: Digital Dividend and Dual-Cell Improvements -- 3.1.8 3GPP Releases 10 and Beyond -- 3.2 Important New Concepts of UMTS -- 3.2.1 The Radio Access Bearer (RAB) -- 3.2.2 The Access Stratum and Non-Access Stratum -- 3.2.3 Common Transport Protocols for CS and PS -- 3.3 Code Division Multiple Access (CDMA) -- 3.3.1 Spreading Factor, Chip Rate and Process Gain -- 3.3.2 The OVSF Code Tree -- 3.3.3 Scrambling in Uplink and Downlink Direction -- 3.3.4 UMTS Frequency and Cell Planning -- 3.3.5 The Near-Far Effect and Cell Breathing -- 3.3.6 Advantages of the UMTS Radio Network Compared to GSM -- 3.4 UMTS Channel Structure on the Air Interface -- 3.4.1 User Plane and Control Plane -- 3.4.2 Common and Dedicated Channels -- 3.4.3 Logical, Transport and Physical Channels…”

Tabla de Contenidos: “…4.4.2 Explosion protection -- 4.4.3 Special care in relation to large vessels -- 4.4.4 Dust control, ATEX and DSEAR -- 4.4.5 Other tests always required to check compatibility -- 4.5 Conclusions -- 4.5.1 Choosing the right solutions -- 4.5.2 The need to 'know your enemy' -- 4.5.3 Future trends -- References -- 5 - Fuel pre-processing, pre-treatment and storage for co-firing of biomass and coal -- 5.1 Handling and storage of biomass at coal-fired power plants -- 5.1.1 General considerations -- 5.1.2 Unloading/discharge -- 5.1.3 Conveying -- 5.1.4 Silos/storage -- 5.1.5 Hardware modifications to convert existing dedicated coal-handling infrastructure -- 5.2 Biomass pre-treatment technologies -- 5.2.1 Torrefaction -- 5.2.2 Steam explosion -- 5.3 Industrial-scale experience with pre-treated biomass -- 5.4 Biological degradation -- 5.5 Pneumatic conveying -- 5.6 Mechanical durability and storage -- 5.7 Explosivity -- 5.7.1 Native dust and dust formation upon handling -- 5.7.2 Explosivity of raw biomass chips versus torrefied biomass pellets -- 5.7.3 Moisture content -- 5.7.4 Minimum explosible concentration (MEC) -- 5.7.5 Flame-front velocity -- 5.8 Conclusions and future trends -- Nomenclature -- Acknowledgement -- References -- 6 - Production of syngas, synfuel, bio-oils, and biogas from coal, biomass, and opportunity fuels -- 6.1 Introduction -- 6.2 Gasification -- 6.2.1 Coal -- 6.2.1.1 Technologies -- 6.2.1.2 Product properties -- 6.2.2 Biomass -- 6.2.2.1 Technologies -- 6.2.2.2 Fuel properties -- 6.2.3 Opportunity fuels -- 6.2.3.1 Technologies -- 6.2.3.2 Product properties -- 6.3 Biogas -- 6.3.1 Technologies -- 6.3.2 Fuel analysis -- 6.3.3 Quality control -- 6.4 Other methods for producing synthesis gas -- 6.4.1 Liquefaction -- 6.4.2 Carbonization -- 6.5 Syngas conversion to products -- 6.5.1 Technologies…”

Tabla de Contenidos: “…Mobile MIMO WiMAX System-on-Chip Design 321 -- 11.1 Introduction of WiMAX Standard 321 -- 11.2 Mobile WiMAX OFDMA and Frame Structure 322 -- 11.3 WiMAX Baseband Receiver Design 325 -- 11.3.1 Automatic Gain Control (AGC) 325 -- 11.3.2 Packet Detection (PKD) 326 -- 11.3.3 Symbol Timing Recovery (STR) 328 -- 11.3.4 Carrier Frequency Offset (CFO) Compensation 328 -- 11.3.5 Channel Estimation 330 -- 11.3.6 MIMO Detection 330 -- 11.3.7 Outer Receiver 333 -- 11.4 WiMAX Media Access Control (MAC) Design 333 -- 11.5 Implementation and Field Trial of the WiMAX SoC 336 -- 11.5.1 Laboratory Testing and Performance Evaluation 338.…”

Tabla de Contenidos: “…Cover -- Copyright -- Roadmap to the Syllabus -- Brief Contents -- Contents -- Preface -- Why and How I Wrote this Book -- C Programming Language -- About the Book -- Structure of the Book -- Salient Features and Strengths of the Book -- Typographical Conventions -- Web Resources -- Acknowledgements -- Part - I: Computer Fundamentals -- 1: Basics of Computer -- 1.1 Introduction -- 1.2 Digital and Analog Computers -- 1.3 Characteristics of Computer -- 1.4 History of Computer -- 1.5 Generations of Computer -- 1.5.1 First Generation (1940 to 1956): Using Vacuum Tubes -- 1.5.2 Second Generation (1956 to 1963): Using Transistors -- 1.5.3 Third Generation (1964 to 1971): Using Integrated Circuits -- 1.5.4 Fourth Generation (1971 to present): Using Microprocessors -- 1.5.5 Fifth Generation (Present and Next): Using Artificial Intelligence -- 1.6 Classification of Computer -- 1.6.1 Microcomputers -- 1.6.2 Minicomputers -- 1.6.3 Mainframe Computers -- 1.6.4 Supercomputers -- 1.7 The Computer System -- 1.7.1 The Input-Process-Output Concept -- 1.7.2 Components of Computer Hardware -- 1.8 Central Processing Unit -- 1.8.1 Arithmetic Logic Unit -- 1.8.2 Registers -- 1.8.3 Control Unit -- 1.9 Memory Unit -- 1.9.1 Cache Memory -- 1.9.2 Primary Memory -- 1.9.3 Secondary Memory -- 1.10 Instruction Format -- 1.11 Instruction Set -- 1.12 Instruction Cycle -- 1.13 Microprocessor -- 1.14 Interconnecting the Units of a Computer -- 1.14.1 System Bus -- 1.14.2 Expansion Bus -- 1.14.3 External Ports -- 1.15 Performance of a Computer -- 1.16 Inside a Computer Cabinet -- 1.16.1 Motherboard -- 1.16.2 Ports and Interfaces -- 1.16.3 Expansion Slots -- 1.16.4 Ribbon Cables -- 1.16.5 Memory Chips -- 1.16.6 Storage Devices -- 1.16.7 Processor -- 1.17 Application of Computers -- 1.18 Summary -- Exercise Questions -- Additional Questions…”

“…The book is also useful as a reference for professionals who deal with programming on multicore or designing multicore chips…”

“…The present work shows the development, optimization and application of biomicrofluidic chips. The developed microfluidic chios are used to (1) analyze the stem cell differentiation, (2) produce valuable substances via metabolic engineering and (3) the fabrication of polymeric films possessing a gradient of morphology. …”

“…New world leading material on customer experience management drawing on several years research with experience leading blue-chips in Cranfield and Warwick. The authors are publishing on that in the world's top marketing journals, so aiding adoption"--…”

“…As firms shift to more open models of innovation based on collaboration and external sourcing of knowledge, they are exploiting their intellectual property, notably patents, not only by incorporating protected inventions into new products, processes and services, but also by licensing them to other firms or public research organisations (PROs), using them as bargaining chips in negotiations with other firms, and as a means of attracting external financing from banks, venture capitalists and other sources..…”

“…Today, electronics shape our everyday objects, integrating chips everywhere: computers, phones, keys, games, household appliances, etc. …”

“…Simply and clearly, veteran industry leader Mark Birnbaum introduces the design problems EDA is intended to solve, the tools that exist to solve them, the designers who use them, and what makes EDA crucial to electronic product and chip design. Explains how EDA fits into the electronic product and semiconductor industries Examines the EDA industry from both the tool user and EDA software vendor perspectives, including business models, return on investment, and tool evaluation Includes electronic system-level tools for defining what ICs will do, front-end functional chip-level tools for design how the IC will behave, and back-end design tools for implementing the IC physical layout Discusses EDA industry trends and IC design issues, including deep submicron challenges, intellectual property (IP), and system-on-chip (SoC) Includes EDA standards organizations and publications Industry newcomers will appreciate the book's extensive set of appendices, including primers on electricity, semiconductor manufacturing, computing, and common dimensions, reference sources and a complete glossary with acronym pronunciation…”

“…It is no longer possible to avoid cameras, DNA tests, identity chips, border crossing cameras, highway monitors, ATMs, radio-chipped goods and ID cards, and other devices that record our movements, finances, and even our health"--…”
Enlace del recurso

“…Descripción del editor:"Hoy en día se pueden construir chips que contienen en su interior miles de millones de componentes de dimensiones cercanas al nanómetro. …”

“…Moreover, integrating GNSS chips into all devices might have a negative impact on the battery life of future IoT applications. …”

“…Key technologies used in modern circuits are also described, including Bipolar, MOS, ROM/RAM, and CPLD/FPGA chips, as well as codes and techniques used in data storage and transmission. …”

Tabla de Contenidos: “…8.2.3 Characterization of the Amplifier in AC 313 -- 8.2.4 Characterization of the Amplifier in DC 313 -- 8.2.5 Characterization of the Amplifier Gain Nonlinearity 316 -- 8.3 Design Considerations of Transconductors 317 -- 8.3.1 Highly Linear Front-end Transconductor 318 -- 8.3.2 Loop-filter Transconductors 320 -- 8.3.3 Widely Programmable Transconductors 323 -- 8.4 Design Considerations of Comparators 324 -- 8.4.1 Regenerative Latch-based Comparators 325 -- 8.4.2 Design Guidelines of Comparators 327 -- 8.4.3 Characterization of Offset and Hysteresis Based on the Input-ramp Method 328 -- 8.4.4 Characterization of Offset and Hysteresis Based on the Bisectional Method 328 -- 8.4.5 Characterizing the Comparison Time 330 -- 8.5 Design Considerations of Current-Steering DACs 332 -- 8.5.1 Fundamentals and Basic Concepts of CS DACs 333 -- 8.5.2 Practical Realization of CS DACs 333 -- 8.5.3 Current Cell Circuits, Error Limitations, and Design Criteria 336 -- 8.5.4 CS 4-bit DAC Example 336 -- 8.6 Summary 338 -- References 338 -- 9 Practical Realization of 𝚺𝚫Ms: From Circuits to Chips 341 -- 9.1 Auxiliary ΣΔM Building Blocks 341 -- 9.1.1 Clock-phase Generators 342 -- 9.1.1.1 Phase Generation 342 -- 9.1.1.2 Phase Buffering 342 -- 9.1.1.3 Phase Distribution 344 -- 9.1.2 Generation of Common-mode Voltage, Reference Voltage, and Bias Currents 345 -- 9.1.2.1 Bandgap Circuit 345 -- 9.1.2.2 Reference Voltage Generator 345 -- 9.1.2.3 Master Bias Current Generator 346 -- 9.1.2.4 Common-mode Voltage Generator 346 -- 9.1.3 Additional Digital Logic 347 -- 9.2 Layout Design, Floorplanning, and Practical Issues 348 -- 9.2.1 Layout Floorplanning 348 -- 9.2.1.1 Divide Layout into Different Parts or Regions 348 -- 9.2.1.2 Shield Sensitive ΣΔM Analog Subcircuits from Switching Noise 349 -- 9.2.1.3 Buses to Distribute Signals Shared by Different ΣΔM Parts 349 -- 9.2.1.4 Be Obsessive about Layout Symmetry and Details of Analog Parts 349 -- 9.2.2 I/O Pad Ring 350.…”