Tabla de Contenidos: “…3.5.1 Experimental Validation of Micro uidic Biomolecular Transport and Sensing Models -- 3.5.2 Technological Advances in Micro uidic On-Chip Analysis -- 3.6 Summary and Conclusions -- References -- 4 Coupling Microscale Transport and Tissue Mechanics: Modeling Strategies for Arterial Multiphysics -- 4.1 Introduction -- 4.2 Brief on Arterial Tissues -- 4.2.1 Histology and Mechanics of Arterial Tissues -- 4.2.2 Molecular Transport in Arterial Tissues -- 4.2.3 Extracellular Matrix Remodeling -- 4.3 Arterial Multiphysics Modeling -- 4.3.1 Geometric Description and General Notation -- 4.3.2 Multiphysics Modeling Rationale -- 4.3.3 Arterial Mechanical Problem -- 4.3.4 Molecular Transport Problem -- 4.3.5 Remodeling Laws -- 4.3.6 Integrated Computational Strategy: Towards an Analytical Solution -- 4.4 An Axisymmetric Case Study -- 4.4.1 Arterial Geometry and Structure -- 4.4.2 Quasi-Analytical Arterial Mechanics -- 4.4.3 Analytical Arterial Molecular Transport -- 4.4.4 Analytical Arterial Remodeling Induced by MMPs, TGF-ß, and IL -- 4.4.5 Results -- 4.5 Conclusions -- Acknowledgements -- Appendix A Along-the-Chord Collagen Fiber Tangent Modulus -- Appendix B Microstructure of Aortic Media Layer -- References -- 5 Modeling Cystic Fibrosis and Mucociliary Clearance -- 5.1 Mucociliary Clearance and Cystic Fibrosis -- 5.1.1 Airway Wall Environment and Mucociliary Clearance -- 5.1.2 The Cystic Fibrosis Pathology -- 5.1.3 Mathematical Modeling of Lung Wall Environment -- 5.2 Newtonian Models -- 5.2.1 Mathematical Analysis -- 5.2.2 Numerical Analysis -- 5.2.3 Numerical Computations of the Mucus Propelled by Ciliated Epithelium -- 5.2.4 Phenomena Analysis -- 5.3 Rheology of Mucus and Non-Newtonian Models -- 5.3.1 Rheometry Data on Lung Mucus from the Literature -- 5.3.2 Mucus Sample Analysis and Rheological Results…”

Tabla de Contenidos: “…6.1.1 The Design of the Acceleration Responses Collection -- 6.1.2 The Design of the Microcontroller -- 6.1.2.1 The PWM technology -- 6.1.2.2 The microcontroller chip -- 6.1.2.3 The optical coupler -- 6.2 Experimental Study on Intelligent Controller -- 7 Dynamic Response Analysis of the Intelligent Control Structure -- 7.1 Elastic Analysis -- 7.1.1 Mathematical Model of Structures -- 7.1.2 Determination of the Control Force of the MR Damper -- 7.1.3 Numerical Analysis -- 7.2 Elasto-Plastic Analysis Method -- 7.2.1 Restoring Force Model -- 7.2.2 Processing of Turning Points -- 7.2.2.1 Determination of p for the first kind of turning point -- 7.2.2.2 Determination of p for the second kind of turning point -- 7.2.2.3 Determination of p of the third kind of turning point -- 7.2.3 Elasto-Plastic Stiffness Matrix -- 7.3 Dynamic Response Analysis by SIMULINK -- 7.3.1 Simulation of the Controlled Structure -- 7.3.2 Numerical Analysis -- 8 Example and Program Analysis -- 8.1 Dynamic Analysis on Frame Structure With MR Dampers -- 8.1.1 Structural and Damper Parameters -- 8.1.2 Semiactive Control Strategy -- 8.1.3 Results and Analysis -- 8.2 Dynamic Analysis on Long-Span Structure With MR Dampers -- 8.2.1 Parameters and Modeling -- 8.2.2 Wind Load Simulation -- 8.2.3 Semiactive Control Strategy -- 8.2.4 Results and Analysis -- 8.3 Dynamic Analysis on Platform With MRE Devices -- 8.3.1 Modeling and Parameters -- 8.3.2 Semiactive Control Strategy -- 8.3.3 Results and Analysis -- 8.4 SIMULINK Analysis Example -- 8.4.1 The SIMULINK Example of the Structure Without Dampers -- 8.4.2 The SIMULINK Example of the Controlled Structure -- 8.5 Particle Swarm Optimization Control Example -- 8.5.1 Structural and Damper Parameters -- 8.5.2 The PSO Optimization Control -- 8.5.3 Results and Analysis -- 8.6 Active Control Example -- 8.6.1 Modeling and Parameters…”

Tabla de Contenidos: “…4.5.2 RBM HTM -- 4.5.3 Pyragrid -- 4.6 Discussion -- 4.6.1 On-Chip Learning -- 4.6.2 Data Movement -- 4.6.3 Memory Requirements -- 4.6.4 Scalability -- 4.6.5 Network Lifespan -- 4.6.6 Network Latency -- 4.6.6.1 Parallelism -- 4.6.6.2 Pipelining -- 4.6.7 Power Consumption -- 4.7 Open Problems -- 4.8 Conclusion -- References -- Chapter 5 NLP-Based AI-Powered Sanskrit Voice Bot -- 5.1 Introduction -- 5.2 Literature Survey -- 5.3 Pipeline -- 5.3.1 Collect Data -- 5.3.2 Clean Data -- 5.3.3 Build Database -- 5.3.4 Install Required Libraries -- 5.3.5 Train and Validate -- 5.3.6 Test and Update -- 5.3.7 Combine All Models -- 5.3.8 Deploy the Bot -- 5.4 Methodology -- 5.4.1 Data Collection and Storage -- 5.4.1.1 Web Scrapping -- 5.4.1.2 Read Text from Image -- 5.4.1.3 MySQL Connectivity -- 5.4.1.4 Cleaning the Data -- 5.4.2 Various ML Models -- 5.4.2.1 Linear Regression and Logistic Regression -- 5.4.2.2 SVM - Support Vector Machine -- 5.4.2.3 PCA - Principal Component Analysis -- 5.4.3 Data Pre-Processing and NLP Pipeline -- 5.5 Results -- 5.5.1 Web Scrapping and MySQL Connectivity -- 5.5.2 Read Text from Image -- 5.5.3 Data Pre-Processing -- 5.5.4 Linear Regression -- 5.5.5 Linear Regression Using TensorFlow -- 5.5.6 Bias and Variance for Linear Regression -- 5.5.7 Logistic Regression -- 5.5.8 Classification Using TensorFlow -- 5.5.9 Support Vector Machines (SVM) -- 5.5.10 Principal Component Analysis (PCA) -- 5.5.11 Anomaly Detection and Speech Recognition -- 5.5.12 Text Recognition -- 5.6 Further Discussion on Classification Algorithms -- 5.6.1 Using Maximum Likelihood Estimator -- 5.6.2 Using Gradient Descent -- 5.6.3 Using Naive Bayes' Decision Theory -- 5.7 Conclusion -- Acknowledgment -- References -- Chapter 6 Automated Attendance Using Face Recognition -- 6.1 Introduction -- 6.2 All Modules Details -- 6.2.1 Face Detection Model…”

Tabla de Contenidos: “…8.3.2 Drawbacks of CMOS Power Amplifier -- 8.3.3 Design of CMOS Power Amplifier -- 8.3.3.1 Common Cascode PA Design -- 8.3.3.2 Self-Bias Cascode PA Design -- 8.3.3.3 Differential Cascode PA Design -- 8.3.3.4 Power Combining PA Design -- 8.4 Linearization Principles: Predistortion Technique, Phase-Correcting Feedback, Envelope Elimination and Restoration (EER), Cartesian Feedback -- 8.4.1 Predistortion Linearization Technique -- 8.4.2 Phase Correcting Feedback Technique -- 8.4.3 Cartesian Feedback Technique -- 8.4.4 Envelope Elimination and Restoration Technique -- Acknowledgement -- References -- Chapter 9 RF Oscillators -- 9.1 Introduction -- 9.2 Specifications -- 9.2.1 Frequency and Tuning -- 9.2.2 Tuning Constant and Linearity -- 9.2.3 Power Dissipation -- 9.2.4 Phase to Noise Ratio -- 9.2.5 Reciprocal Mixing -- 9.2.6 Signal to Noise Degradation of FM Signals Spurious Emission -- 9.2.7 Harmonics, I/Q Matching, Technology and Chip Area -- 9.3 LC Oscillators -- 9.3.1 Frequency, Tuning and Phase Noise Frequency Tuning Phase Noise to Carrier Ratio -- 9.3.2 Topologies -- 9.3.3 NMOS Only Cross-Coupled Structure -- 9.3.4 RC Oscillators -- 9.4 Design Examples -- 9.4.1 830 MHz Monolithic LC Oscillator Circuit Design Measurements -- 9.4.2 A 10 GHz I/Q RC Oscillator with Active Inductors -- 9.5 Conclusion -- Acknowledgement -- References -- Part III: RF Circuit Applications -- Chapter 10 mmWave Highly-Linear Broadband Power Amplifiers -- 10.1 Basics of PAs -- 10.1.1 Single Transistor Amplifier -- 10.1.2 Trade-Offs Among Power Amplifier Design Parameters (P0, PAE and Linearity) -- 10.1.3 Harmonic Terminations and Switching Amplifiers -- 10.1.4 Challenges at Millimeter-Wave -- 10.2 Millimeter Wave-Based AB Class PA -- 10.2.1 Efficiency at Power Back-Off -- 10.2.2 Sources of AM-PM Distortion -- 10.2.3 Distortion Cancellation Techniques…”

Tabla de Contenidos: “…Quiz -- Understanding BIOS, CMOS, and Firmware -- Configuring the System BIOS -- Accessing the BIOS Setup Program -- BIOS Settings Overview -- Main Menu -- Standard Features/Settings -- Advanced BIOS Settings/Features -- Integrated Peripherals -- Power Management -- PnP/PCI Configurations -- Hardware Monitor -- Processor and Memory Configuration -- Security Features -- Exiting the BIOS and Saving/Discarding Changes -- Power-On Self-Test and Error Reporting -- Beep Codes -- POST Error Messages -- POST Hex Codes -- BIOS Updates -- Flash BIOS Update -- BIOS Chip Replacement -- Chapter 5 Power Supplies and System Cooling -- Do I Know This Already?" …”

Tabla de Contenidos: “…4.5.1 Transcriptomic Profiling (Bulk and Single-Cell RNA-Seq) -- 4.5.2 Genetic Mutation and Variation Identification -- 4.5.3 De Novo Genome Assembly -- 4.5.4 Protein-DNA Interaction Analysis (ChIP-Seq) -- 4.5.5 Epigenomics and DNA Methylation Study (Methyl-Seq) -- 4.5.6 Metagenomics -- References -- 5 Early-Stage Next-Generation Sequencing (NGS) Data Analysis: Common Steps -- 5.1 Basecalling, FASTQ File Format, and Base Quality Score -- 5.2 NGS Data Quality Control and Preprocessing -- 5.3 Read Mapping -- 5.3.1 Mapping Approaches and Algorithms -- 5.3.2 Selection of Mapping Algorithms and Reference Genome Sequences -- 5.3.3 SAM/BAM as the Standard Mapping File Format -- 5.3.4 Mapping File Examination and Operation -- 5.4 Tertiary Analysis -- References -- 6 Computing Needs for Next-Generation Sequencing (NGS) Data Management and Analysis -- 6.1 NGS Data Storage, Transfer, and Sharing -- 6.2 Computing Power Required for NGS Data Analysis -- 6.3 Cloud Computing -- 6.4 Software Needs for NGS Data Analysis -- 6.4.1 Parallel Computing -- 6.5 Bioinformatics Skills Required for NGS Data Analysis -- References -- Part III Application-Specific NGS Data Analysis -- 7 Transcriptomics By Bulk RNA-Seq -- 7.1 Principle of RNA-Seq -- 7.2 Experimental Design -- 7.2.1 Factorial Design -- 7.2.2 Replication and Randomization -- 7.2.3 Sample Preparation and Sequencing Library Preparation -- 7.2.4 Sequencing Strategy -- 7.3 RNA-Seq Data Analysis -- 7.3.1 Read Mapping -- 7.3.2 Quantification of Reads -- 7.3.3 Normalization -- 7.3.4 Batch Effect Removal -- 7.3.5 Identification of Differentially Expressed Genes -- 7.3.6 Multiple Testing Correction -- 7.3.7 Gene Clustering -- 7.3.8 Functional Analysis of Identified Genes -- 7.3.9 Differential Splicing Analysis -- 7.4 Visualization of RNA-Seq Data -- 7.5 RNA-Seq as a Discovery Tool -- References…”

Tabla de Contenidos: “…Chapter 1 Introductory Concepts -- 1-1 Digital and Analog Quantities -- 1-2 Binary Digits, Logic Levels, and Digital Waveforms -- 1-3 Basic Logic Functions -- 1-4 Combinational and Sequential Logic Functions -- 1-5 Introduction to Programmable Logic -- 1-6 Fixed-Function Logic Devices -- 1-7 Test and Measurement Instruments -- 1-8 Introduction to Troubleshooting -- Chapter 2 Number Systems, Operations, and Codes -- 2-1 Decimal Numbers -- 2-2 Binary Numbers -- 2-3 Decimal-to-Binary Conversion -- 2-4 Binary Arithmetic -- 2-5 Complements of Binary Numbers -- 2-6 Signed Numbers -- 2-7 Arithmetic Operations with Signed Numbers -- 2-8 Hexadecimal Numbers -- 2-9 Octal Numbers -- 2-10 Binary Coded Decimal (BCD) -- 2-11 Digital Codes -- 2-12 Error Codes -- Chapter 3 Logic Gates -- 3-1 The Inverter -- 3-2 The AND Gate -- 3-3 The OR Gate -- 3-4 The NAND Gate -- 3-5 The NOR Gate -- 3-6 The Exclusive-OR and Exclusive-NOR Gates -- 3-7 Programmable Logic -- 3-8 Fixed-Function Logic Gates -- 3-9 Troubleshooting -- Chapter 4 Boolean Algebra and Logic Simplification -- 4-1 Boolean Operations and Expressions -- 4-2 Laws and Rules of Boolean Algebra -- 4-3 DeMorgan's Theorems -- 4-4 Boolean Analysis of Logic Circuits -- 4-5 Logic Simplification Using Boolean Algebra -- 4-6 Standard Forms of Boolean Expressions -- 4-7 Boolean Expressions and Truth Tables -- 4-8 The Karnaugh Map -- 4-9 Karnaugh Map SOP Minimization -- 4-10 Karnaugh Map POS Minimization -- 4-11 The Quine-McCluskey Method -- 4-12 Boolean Expressions with VHDL -- Applied Logic -- Chapter 5 Combinational Logic Analysis -- 5-1 Basic Combinational Logic Circuits -- 5-2 Implementing Combinational Logic -- 5-3 The Universal Property of NAND and NOR Gates -- 5-4 Combinational Logic Using NAND and NOR Gates -- 5-5 Pulse Waveform Operation -- 5-6 Combinational Logic with VHDL -- 5-7 Troubleshooting -- Applied Logic -- Chapter 6 Functions of Combinational Logic -- 6-1 Half and Full Adders -- 6-2 Parallel Binary Adders -- 6-3 Ripple Carry and Look-Ahead Carry Adders -- 6-4 Comparators -- 6-5 Decoders -- 6-6 Encoders -- 6-7 Code Converters -- 6-8 Multiplexers (Data Selectors) -- 6-9 Demultiplexers -- 6-10 Parity Generators/Checkers -- 6-11 Troubleshooting -- Applied Logic -- Chapter 7 Latches, Flip-Flops, and Timers -- 7-1 Latches -- 7-2 Flip-Flops -- 7-3 Flip-Flop Operating Characteristics -- 7-4 Flip-Flop Applications -- 7-5 One-Shots -- 7-6 The Astable Multivibrator -- 7-7 Troubleshooting -- Applied Logic -- Chapter 8 Shift Registers -- 8-1 Shift Register Operations -- 8-2 Types of Shift Register Data I/Os -- 8-3 Bidirectional Shift Registers -- 8-4 Shift Register Counters -- 8-5 Shift Register Applications -- 8-6 Logic Symbols with Dependency Notation -- 8-7 Troubleshooting -- Applied Logic -- Chapter 9 Counters -- 9-1 Finite State Machines -- 9-2 Asynchronous Counters -- 9-3 Synchronous Counters -- 9-4 Up/Down Synchronous Counters -- 9-5 Design of Synchronous Counters -- 9-6 Cascaded Counters -- 9-7 Counter Decoding -- 9-8 Counter Applications -- 9-9 Logic Symbols with Dependency Notation -- 9-10 Troubleshooting -- Applied Logic -- Chapter 10 Programmable Logic -- 10-1 Simple Programmable Logic Devices (SPLDs) -- 10-2 Complex Programmable Logic Devices (CPLDs) -- 10-3 Macrocell Modes -- 10-4 Field-Programmable Gate Arrays (FPGAs) -- 10-5 Programmable Logic Software -- 10-6 Boundary Scan Logic -- 10-7 Troubleshooting -- Applied Logic -- Chapter 11 Data Storage -- 11-1 Semiconductor Memory Basics -- 11-2 The Random-Access Memory (RAM) -- 11-3 The Read-Only Memory (ROM) -- 11-4 Programmable ROMs -- 11-5 The Flash Memory -- 11-6 Memory Expansion -- 11-7 Special Types of Memories -- 11-8 Magnetic and Optical Storage -- 11-9 Memory Hierarchy -- 11-10 Cloud Storage -- 11-11 Troubleshooting -- Chapter 12 Signal Conversion and Processing -- 12-1 Analog-to-Digital Conversion -- 12-2 Methods of Analog-to-Digital Conversion -- 12-3 Methods of Digital-to-Analog Conversion -- 12-4 Digital Signal Processing -- 12-5 The Digital Signal Processor (DSP) -- Chapter 13 Data transmission -- 13-1 Data Transmission Media -- 13-2 Methods and Modes of Data Transmission -- 13-3 Modulation of Analog Signals with Digital Data -- 13-4 Modulation of Digital Signals with Analog Data -- 13-5 Multiplexing and Demultiplexing -- 13-6 Bus Basics -- 13-7 Parallel Buses -- 13-8 The Universal Serial Bus (USB) -- 13-9 Other Serial Buses -- 13-10 Bus Interfacing -- Chapter 14 Data Processing and Control -- 14-1 The Computer System -- 14-2 Practical Computer System Considerations -- 14-3 The Processor: Basic Operation -- 14-4 The Processor: Addressing Modes -- 14-5 The Processor: Special Operations -- 14-6 Operating Systems and Hardware -- 14-7 Programming -- 14-8 Microcontrollers and Embedded Systems -- 14-9 System on Chip (SoC) -- Chapter 15 Integrated Circuit Technologies -- 15-1 Basic Operational Characteristics and Parameters -- 15-2 CMOS Circuits -- 15-3 TTL (Bipolar) Circuits -- 15-4 Practical Considerations in the Use of TTL -- 15-5 Comparison of CMOS and TTL Performance -- 15-6 Emitter-Coupled Logic (ECL) Circuits -- 15-7 PMOS, NMOS, and E2CMOS…”

Tabla de Contenidos:

Tabla de Contenidos: “…6.6 Programmable Gain Amplifier -- 6.6.1 Timing -- 6.6.2 Common Mode Feedback -- 6.6.2.1 AMP and CMFB -- 6.7 Chopper Amplifier -- 6.8 Dynamic Element Matching Technique -- 6.9 Resistor-Less Current Reference -- 6.10 Switch Mode Converter -- 6.11 SPICE Example -- 6.12 Layout Issue -- 6.13 Summary -- References -- Chapter 7: Data Converter -- 7.1 Introduction -- 7.2 Digital-to-Analog Converter -- 7.2.1 Resistor String Topology -- 7.2.2 Current Steering -- 7.2.3 Hybrid Topology -- 7.2.4 DAC Trimming or Calibration -- 7.2.5 Glitch -- 7.3 Analog-to-Digital Converter -- 7.3.1 Slope ADC -- 7.3.2 SAR ADC -- 7.3.3 Flash ADC -- 7.3.4 Pipelined ADC -- 7.3.5 Delta Sigma ADC -- 7.4 SPICE Example -- 7.4.1 DAC Example -- 7.4.2 ADC Example -- 7.5 Layout Examples -- 7.6 Summary -- References -- Chapter 8: CMOS Color and Image Sensor Circuit Design -- 8.1 Introduction -- 8.2 Technology and Methodology -- 8.2.1 General Comments on Technology or Process for CMOS Image Sensor -- 8.2.2 Backside Illumination -- 8.2.3 Photo Devices -- 8.2.4 Design Methodology -- 8.3 CMOS Color Sensor -- 8.3.1 Transimpedance Amplifier Topology -- 8.3.2 Current to Frequency Topology -- 8.3.3 Current Integration Topology -- 8.4 CMOS Image Sensor -- 8.4.1 CMOS Image Sensor Architecture -- 8.4.1.1 Pixel-Level ADC -- 8.4.1.2 Column-Level ADC -- 8.4.1.3 Chip-Level ADC -- 8.4.2 Analog Pixel Sensor -- 8.4.3 Digital Pixel Sensor -- 8.4.4 Low Power and Low Noise Technique -- 8.4.4.1 Low Power Techniques -- 8.4.4.2 Low Noise Techniques -- 8.5 SPICE Example -- 8.6 Layout -- 8.7 Summary -- References -- Chapter 9: Peripheral Circuits -- 9.1 Introduction -- 9.2 Oscillator -- 9.2.1 Ring Oscillator -- 9.2.2 RC Oscillator -- 9.2.2.1 Ramp Oscillator -- 9.3 Non-overlapping Generator -- 9.4 Interface Circuitry -- 9.4.1 Basic Interface Circuit -- 9.4.2 I2C -- 9.5 I/O Pad -- 9.6 Schmitt Trigger Circuit…”

Tabla de Contenidos: “…-- 2.1.2 Streaming -- 2.1.3 Related Network Models -- 2.1.4 Physical Network Considerations -- 2.1.5 Internet Layer Considerations -- 2.1.6 Transport Layer Considerations -- 2.1.7 Applications -- Transport Protocols -- 2.1.8 Protocol Evolution -- 2.1.9 Format Evolution -- 2.2 Industry Evolution -- 2.2.1 "Stack Creep" -- 2.2.2 Real World -- Blue Chips and Video Delivery Networks -- 2.3 Consumer Adoption -- 2.3.1 The Audience -- 2.3.2 Traditional Ratings Companies and Audience Measurement -- 2.3.3 Streaming Media and Measurement -- 2.3.4 Predictions of Others -- 2.3.5 The Pending Collapse of the Value of Broadcasting to Advertisers -- 2.3.6 "Device Effect" and Formats -- 2.3.7 Video Formats (in Particular, Multicast and UDP) and Network Architecture -- 2.3.8 Discovery, Curation, and Social Media -- 2.4 Encode> Serve> Play -- 2.4.1 The Basic Building Blocks -- 2.4.2 The Acacia Patent -- 2.4.3 Akamai vs. …”

Tabla de Contenidos: “…The Hardware of Edge AI -- Sensors, Signals, and Sources of Data -- Types of Sensors and Signals -- Acoustic and Vibration -- Visual and Scene -- Motion and Position -- Force and Tactile -- Optical, Electromagnetic, and Radiation -- Environmental, Biological, and Chemical -- Other Signals -- Processors for Edge AI -- Edge AI Hardware Architecture -- Microcontrollers and Digital Signal Processors -- System-on-Chip -- Deep Learning Accelerators -- FPGAs and ASICs -- Edge Servers -- Multi-Device Architectures -- Devices and Workloads -- Summary -- Chapter 4. …”

Tabla de Contenidos: “…10.6.2 Data Flow Diagrams -- 10.6.2.1 Doctors -- 10.6.2.2 Patient -- 10.6.2.3 Transaction Flow -- 10.7 Performance Evaluation -- 10.7.1 Performance of the Proposed Model -- 10.7.2 Performance Comparison -- 10.8 Conclusions and Future Caveats -- References -- Chapter 11: AI-Aided Secured ECG Live Edge Monitoring System with a Practical Use-Case -- 11.1 Introduction -- 11.1.1 Background -- 11.1.2 Problem Statement -- 11.1.3 Objective and Scope -- 11.2 Related Work -- 11.3 Proposed AI-Based System Architecture -- 11.3.1 Block Diagram -- 11.3.2 Data Collection and Pre-Processing Steps -- 11.3.3 Detecting Heart Abnormalities Using AI-Aided Techniques -- 11.4 Considered Smart ECG Monitoring System -- 11.4.1 Edge Hardware Components -- 11.4.1.1 System-on-a-Chip (SoC) Model -- 11.4.1.2 IoT Sensor for Heart Rate Data Acquisition -- 11.4.1.3 Microprocessor and Analog to Digital Converter -- 11.4.2 AI-Logic Component -- 11.4.2.1 Decision Tree -- 11.4.2.2 Random Forest -- 11.4.2.3 ANN -- 11.4.2.4 CNN -- 11.5 Bio-Authentication Application of the Considered ECG Monitoring System for Specific Use-Cases -- 11.6 Performance Evaluation -- 11.6.1 Supraventricular Arrhythmia Classification -- 11.6.2 Authorized User Classification for Bio-Authentication System -- 11.7 Challenges Involved with the Proposed System -- Limitations -- 11.8 Conclusion and Future Scope -- References -- Section III -- Chapter 12: Application of Unmanned Aerial Vehicles in Wireless Networks: Mobile Edge Computing and Caching -- 12.1 Introduction -- 12.1.1 Chapter Roadmap -- 12.2 Literature Review -- 12.3 Description of Caching and Mobile Edge Computing -- 12.3.1 Overview of Caching -- 12.3.1.1 Advantages -- 12.3.1.2 Disadvantages -- 12.3.2 Overview of Mobile Edge Computing -- 12.3.2.1 Advantages -- 12.3.2.2 Disadvantages -- 12.4 Layering of UAV-Based MEC Architecture…”

Tabla de Contenidos: “….) -- PÁGINA LEGAL -- SOBRE LOS AUTORES -- ÍNDICE GENERAL -- LOS MICROPROCESADORES -- 1 CONCEPTOS BÁSICOS -- 1.1 ESTRUCTURA DE LA MEMORIA DE LA COMPUTADORA -- 1.2 TIPOS DE DATOS EN MEMORIA -- 1.2.1 NÚMEROS BINARIOS -- 1.2.2 NÚMEROS DECIMALES DESEMPAQUETADOS -- 1.2.3 NÚMEROS DECIMALES EMPAQUETADOS -- 1.2.4 CARACTERES ASCII -- 1.3 EL CONCEPTO DE COMPUTADORA -- 1.4 COMPONENTES DE UNA COMPUTADORA -- 1.4.1 EL MICROPROCESADOR -- 1.4.2 EL BUS -- 1.4.3 PUERTOS DE ENTRADA/SALIDA -- 1.4.4 COPROCESADOR MATEMÁTICO -- 1.4.5 ¿CÓMO SE COMUNICA UN MICROPROCESADOR? -- 1.4.6 LOS CHIPS DE APOYO -- 1.4.6.1 EL CONTROLADOR PROGRAMABLE DE (...) -- 1.4.6.2 EL CONTROLADOR DMA -- 1.4.6.3 CONTROLADORES DE ENTRADA/SALIDA -- 1.4.7 LA MEMORIA -- 1.4.8 FILOSOFÍA DE DISEÑO -- 2 EL MICROPROCESADOR 8086 -- 2.1 DIRECCIONAMIENTO DE LA MEMORIA EN EL (...) -- 2.2 ALMACENAMIENTO INVERSO DE PALABRAS -- 2.3 RECUPERACIÓN Y EJECUCIÓN DE INSTRUCCIONES (...) -- 2.4 LOS REGISTROS INTERNOS DEL MICROPROCESADOR (...) -- 2.4.1 CUATRO REGISTROS DE DATOS O (...) -- 2.4.2 CUATRO REGISTROS DE SEGMENTO -- 2.4.3 DOS REGISTROS PUNTEROS DE PILA -- 2.4.4 DOS REGISTROS ÍNDICES -- 2.4.5 UN REGISTRO PUNTERO DE INSTRUCCIONES -- 2.4.6 UN REGISTRO DE BANDERAS (FLAGS) -- 2.4.7 SEIS BANDERAS DE ESTADO -- 2.4.8 TRES BANDERAS DE CONTROL -- 2.5 LA UNIDAD DE CONTROL -- 2.5.1 LA COLA DE INSTRUCCIONES -- 3 OTROS MICROPROCESADORES -- 3.1 DIRECCIONAMIENTO DE LA MEMORIA EN EL (...) -- 3.2 DIRECCIONAMIENTO DE LA MEMORIA EN EL (...) -- 3.3 LOS REGISTROS INTERNOS DEL MICROPROCESADOR (...) -- 3.3.1 OCHO REGISTROS DE PROPÓSITO GENERAL -- 3.3.2 SEIS REGISTROS SEGMENTOS -- 3.3.3 UN REGISTRO PUNTERO DE INSTRUCCIÓN -- 3.3.4 UN REGISTRO DE BANDERAS (FLAGS) -- 3.3.5 CUATRO REGISTROS DE CONTROL. …”

Tabla de Contenidos: “…5.2.6 Company Activity -- 5.2.7 Future Projections -- References -- Further reading -- 6 Nanotechnology for Health, Food, and Hygiene -- 6.1 In Vivo Nanoparticles -- 6.2 In Vivo Devices -- 6.3 In Vivo Nanostructured Materials -- 6.4 In Vitro Nanostructured Materials -- 6.5 Labs-on-Chips -- 6.6 Information Technology -- 6.7 Paramedicine -- 6.8 Food -- 6.8.1 Packaging -- 6.8.2 Sensors -- 6.8.3 Nano-Additives -- 6.8.4 Consumer Choice -- 6.9 Hygiene -- 6.10 Expected Market Size -- References -- Further Reading -- 7 Nanotechnology for Energy -- 7.1 Energy Harvesting -- 7.2 Production and Storage -- 7.2.1 Energy Production -- 7.2.2 Energy Storage -- Electrical Storage Devices -- Hydrogen Storage -- 7.3 Energy Ef ciency -- 7.3.1 Lighting -- 7.3.2 Computation -- 7.3.3 Electrical Cabling -- 7.4 Localized Manufacture -- References -- Further Reading -- 8 Information Technologies -- 8.1 Silicon Microelectronics -- 8.2 Flexible Electronics -- 8.3 Heat Management -- 8.4 Data Storage Technologies -- 8.5 Display Technologies -- 8.6 Molecule or Particle Sensing Technologies -- 8.7 The Internet of Things -- References -- Further Reading -- 9 Miscellaneous Applications -- 9.1 Aerospace and Automotive Industries -- 9.2 Agriculture -- 9.3 Architecture and Construction -- 9.4 Catalysis -- 9.5 Environment and Air Quality -- 9.6 Lubricants -- 9.7 Minerals and Metal Extraction -- 9.8 Paper -- 9.9 Security and Military -- 9.10 Textiles -- 9.11 Transport -- References -- Further Reading -- 10 The Design of Nanotechnology Products -- 10.1 The Challenge of Vasti cation -- 10.2 Enhancing Traditional Design Routes -- 10.3 Crowdsourcing -- 10.4 Materials Selection -- 10.5 Formulation -- 10.6 Quality Control -- 10.7 Biomimicry -- 10.8 Nanodevices Moving in Viscous Media -- References -- Further Reading -- Part 3 Organizing Nanotechnology Business…”

Tabla de Contenidos: “…Scale-Out -- Rack-Optimized Servers -- Blade Servers -- Server Sprawl -- Virtualization -- Server Deployment Today -- Unified Computing System (UCS) -- Chapter 2 Server Architectures -- The Processor Evolution -- Sockets -- Cores -- Threads -- Intel® Hyper-Threading Technology -- Front-Side Bus -- Dual Independent Buses -- Dedicated High-Speed Interconnect -- Intel® QuickPath Interconnect -- The Memory Subsystem -- SRAMs -- DRAMs -- SDRAMs -- DIMMs -- ECC and Chipkill® -- Memory Ranks -- UDIMMs and RDIMMs -- DDR2 and DDR3 -- The I/O Subsystem -- PCI Express® -- Intel Microarchitectures -- Platform Architecture -- CPU Architecture -- Virtualization Support -- Advanced Reliability -- Advanced Encryption Standard -- Trusted Execution Technology -- Chip Design -- Chipset Virtualization Support -- Intel® VT-d for Direct I/O -- Intel® VT-c for Connectivity -- VMDirectPath® -- Chapter 3 UCS Enabling Technologies -- Unified Fabric -- 10 Gigabit Ethernet -- Lossless Ethernet -- Terminology -- PFC (Priority-Based Flow Control) -- DCBX: Data Center Bridging eXchange -- Bandwidth Management -- FCoE (Fibre Channel over Ethernet) -- Virtualization -- Server Virtualization -- SR-IOV -- The IEEE Standard Effort -- Port Extenders and Virtualization -- VNTag -- Fabric Extenders -- VN-Link -- Memory Expansion -- Speed vs. …”

Tabla de Contenidos: “…14.1 Processor Organization -- 14.2 Register Organization -- 14.3 Instruction Cycle -- 14.4 Instruction Pipelining -- 14.5 The x86 Processor Family -- 14.6 The ARM Processor -- 14.7 Key Terms, Review Questions, and Problems -- Chapter 15 Reduced Instruction Set Computers -- 15.1 Instruction Execution Characteristics -- 15.2 The Use of a Large Register File -- 15.3 Compiler-Based Register Optimization -- 15.4 Reduced Instruction Set Architecture -- 15.5 RISC Pipelining -- 15.6 MIPS R4000 -- 15.7 SPARC -- 15.8 RISC versus CISC Controversy -- 15.9 Key Terms, Review Questions, and Problems -- Chapter 16 Instruction-Level Parallelism and Superscalar Processors -- 16.1 Overview -- 16.2 Design Issues -- 16.3 Intel Core Microarchitecture -- 16.4 ARM Cortex-A8 -- 16.5 ARM Cortex-M3 -- 16.6 Key Terms, Review Questions, and Problems -- Part Five Parallel Organization -- Chapter 17 Parallel Processing -- 17.1 Multiple Processor Organizations -- 17.2 Symmetric Multiprocessors -- 17.3 Cache Coherence and the MESI Protocol -- 17.4 Multithreading and Chip Multiprocessors -- 17.5 Clusters -- 17.6 Nonuniform Memory Access -- 17.7 Cloud Computing -- 17.8 Key Terms, Review Questions, and Problems -- Chapter 18 Multicore Computers -- 18.1 Hardware Performance Issues -- 18.2 Software Performance Issues -- 18.3 Multicore Organization -- 18.4 Heterogeneous Multicore Organization -- 18.5 Intel Core i7-990X -- 18.6 ARM Cortex-A15 MPCore -- 18.7 IBM zEnterprise EC12 Mainframe -- 18.8 Key Terms, Review Questions, and Problems -- Chapter 19 General-Purpose Graphic Processing Units -- 19.1 Cuda Basics -- 19.2 GPU versus CPU -- 19.3 GPU Architecture Overview -- 19.4 Intel's Gen8 GPU -- 19.5 When to Use a GPU as a Coprocessor -- 19.6 Key Terms and Review Questions -- Part Six T he Control Unit -- Chapter 20 Control Unit Operation -- 20.1 Micro-Operations…”

Tabla de Contenidos: “…Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team that wrote the second edition -- The team that wrote the first edition -- Notice -- Comments welcome -- Chapter 1. zSeries 900 overview -- 1.1 Introduction -- 1.2 z900 family models -- 1.3 System functions and features -- 1.3.1 Processor -- 1.3.2 Memory -- 1.3.3 I/O connectivity -- 1.3.4 Cryptographic coprocessors -- 1.3.5 Parallel Sysplex support -- 1.3.6 Intelligent Resource Director -- 1.3.7 Workload License Charge -- 1.3.8 Hardware consoles -- 1.4 Concurrent upgrades -- 1.5 64-bit z/Architecture -- 1.6 z900 Support for Linux -- 1.7 Autonomic Computing -- Chapter 2. zSeries 900 system structure -- 2.1 Design highlights -- 2.2 System design -- 2.2.1 20-PU system structure -- 2.2.2 12-PU system structure -- 2.2.3 Processing units -- 2.2.4 Reserved Processors -- 2.2.5 Processing Unit assignments -- 2.2.6 Processing Unit sparing -- 2.3 Modes of operation -- 2.3.1 Basic Mode -- 2.3.2 Logically Partitioned Mode -- 2.4 Model configurations -- 2.4.1 General purpose models -- 2.4.2 Capacity models -- 2.4.3 Coupling Facility model -- 2.4.4 Hardware Management Console -- 2.4.5 Frames -- 2.4.6 CPC cage -- 2.4.7 MultiChip Module design -- 2.4.8 PU design -- 2.5 Memory -- 2.5.1 Memory configurations -- 2.5.2 Storage operations -- 2.5.3 Reserved storage -- 2.5.4 LPAR storage granularity -- 2.5.5 LPAR Dynamic Storage Reconfiguration -- 2.6 Channel Subsystem -- 2.6.1 Channel Subsystem overview -- 2.6.2 Channel Subsystem operations -- 2.6.3 Channel Subsystem structure -- 2.6.4 Self Timed Interfaces -- 2.6.5 I/O cages -- 2.6.6 Channels to SAP assignment -- 2.6.7 Channel feature cards -- Chapter 3. …”

Tabla de Contenidos: “…Developing code for our application -- Calibrating the needle -- Creating the WeatherData class -- Creating the WeatherDashboard class -- Adding the updateDashboard() function and main methods -- Summary -- Chapter 4: Building an IoT Information Display -- Technical requirements -- Investigating displays compatible with our Raspberry Pi and exploring screen types -- Creating an IoT information display -- Setting up our development environment -- Creating a WeatherData class -- Creating a TrafficMap class -- Adding Dashboard and MyApp classes -- Running the IoT information display application -- Summary -- Part 2: Building an IoT Home Security Dashboard -- Chapter 5: Exploring the GPIO -- Technical requirements -- Introducing the GPIO on Raspberry Pi -- Exploring the Raspberry Pi GPIO pinout diagram -- Understanding GPIO pin communication protocols -- Understanding sensors, actuators, and indicators -- Setting up our development environment -- Exploring the PIR sensor -- Building a simple alarm system -- Summary -- Chapter 6: Building an IoT Alarm Module -- Technical requirements -- Investigating MQTT -- Understanding the publish-subscribe model in MQTT -- Understanding QoS in MQTT -- Exploring MQTT fundamentals with the MQTTHQ web client -- Using a Raspberry Pi Pico W with MQTT -- Introducing the RP2040 chip -- Configuring our alarm circuit -- Setting up our development environment -- Writing the alarm module client code -- Building an IoT alarm module case -- Identifying the parts of the custom case -- Building the alarm module case -- Summary -- Chapter 7: Building an IoT Button -- Technical requirements -- Introducing IoT buttons -- Utilizing IoT buttons -- Exploring various technologies in IoT button development -- Creating our IoT button using the M5Stack ATOM Matrix -- Exploring M5Stack devices -- Flashing the firmware to our ATOM Matrix…”

Tabla de Contenidos: “…. -- B The Steele Progeny: A Motley Crew of Circuit Court Tests -- III Doctrinal Analysis: Use-Based Rights and Commercial Effects -- A The Common Law Roots of Lanham Act Subject-Matter Jurisdiction -- B An Element of Modernity: The Effects-on-Commerce Factor -- IV A Bird's-Eye View: Taking Stock of Lanham Act Extraterritoriality -- A The Antitrust Gene: A Dominance of Effects -- B Common Law Goodwill Protection: Tea Rose/Rectanus Goes Global -- V Summary: An Era of International Trademark Propertization -- Conclusions -- 3 A Ragged Landscape of Theories -- Introduction -- Section 1 Traditional Civil Law Trademark Conflicts -- I The Principle of Territoriality -- II Analysis: The Curse of Formal Reasoning and Conduct Orientation -- Section 2 Modern Civil Law Unfair Competition Conflicts -- I The Marketplace Principle, Determination of Effects, and the De Minimis Rule -- A Collision-of-Interests and Substantive-Purpose Analysis -- B Multistate Scenarios: Determination of Marketplace Effects and De Minimis Limitations -- II Analysis: The Obsolescence of Tort Foundations -- Section 3 The New Paradigm-A Law of Market Regulation -- I Antitrust Conflicts Reloaded: The Effects Principle -- II Analysis: The Unboundedness of Unqualified Effects -- Section 4 Modern Soft Law-WIPO Recommendation, ALI Principles, and Others -- I Nonbinding Suggestions of Substantive Law and Conflicts Resolution -- A The Joint Recommendation Concerning Provisions on the Protection of Marks, and Other Industrial Property Rights in Signs, on the Internet -- B ALI Principles, CLIP Principles, and the Japanese Transparency Proposal -- II Analysis: "Chips off the Old Block" -- A The Joint Recommendation…”

Tabla de Contenidos: “…Acquiring data using hardware communication techniques -- Software exploitation using hardware exploitation methods -- Hardware reconnaissance techniques -- Opening the device -- Looking at various chips present -- Electronics 101 -- Resistor -- Voltage -- Current -- Capacitor -- Transistor -- Memory types -- Serial and parallel communication -- There's more... -- Identifying buses and interfaces -- UART identification -- SPI and I2C identification -- JTAG identification -- There's more... -- Serial interfacing for embedded devices -- Getting ready -- How to do it... -- See also -- NAND glitching -- Getting ready -- How to do it... -- See also -- JTAG debugging and exploitation -- Getting ready -- How to do it... -- See also -- Chapter 7: Radio Hacking -- Introduction -- Getting familiar with SDR -- Key terminologies in radio -- Hands-on with SDR tools -- Getting ready -- How to do it... -- Analyzing FM -- RTL-SDR for GSM analysis -- Working with GNU Radio -- There's more... -- Understanding and exploiting ZigBee -- Getting ready -- How to do it... -- There's more... -- Gaining insight into Z-Wave -- How to do it... -- Understanding and exploiting BLE -- Getting ready -- How to do it... -- There's more... -- Chapter 8: Firmware Security Best Practices -- Introduction -- Preventing memory-corruption vulnerabilities -- Getting ready -- How to do it... -- See also -- Preventing injection attacks -- How to do it... -- See also -- Securing firmware updates -- How to do it... -- Securing sensitive information -- How to do it... -- See also -- Hardening embedded frameworks -- Getting ready -- How to do it... -- Securing third-party code and components -- Getting ready -- How to do it... -- Chapter 9: Mobile Security Best Practices -- Introduction -- Storing data securely -- Getting ready -- How to do it... -- See also -- Implementing authentication controls…”