Tabla de Contenidos: “…Front Cover; Advances in Computers; Copyright; Contents; Preface; Chapter One: Register-Level Communication in Speculative Chip Multiprocessors; 1. Introduction; 2. TLS in CMPs; 3. …”

Tabla de Contenidos: “…Innovation, Outplacement, and Potato Chips -- Bullwhipped -- People Leaders' CTAs -- Executives' and HR's CTAs -- Notes -- CHAPTER 10: Sustainability Starts with People -- A Future That Works -- We Have the Power to Make Brighter Days -- Good Work If You Can Get It -- Sustaining Transformation Efforts -- Future‐Proofing Your Talent Pipeline -- Let Your Contributors Contribute -- Embed Sustainability into Your DNA -- The Future Is Now -- People Leaders' CTAs -- Executives' and HR's CTAs -- Notes -- Epilogue: The End and The Beginning -- Say Goodbye to Yesterday -- Are You Ready for a Brand‐New Beat? …”

Tabla de Contenidos: “…Understanding the Transmission Line Impedance Graphically -- 2 - Printed Circuits -- 2.1 BOARD TYPES -- 2.1.1 MATERIALS -- Epoxy Glass -- 2.1.2 TYPE OF CONSTRUCTION -- 2.1.3 CHOICE OF TYPE -- 2.1.4 CHOICE OF SIZE -- Subdivision Boundaries -- Panelization -- 2.1.5 HOW A MULTILAYER BOARD IS MADE -- 2.2 DESIGN RULES -- 2.2.1 TRACK WIDTH AND SPACING -- Conductor Resistance -- Voltage Breakdown and Cross Talk -- Constant Impedance -- 2.2.2 HOLE AND PAD SIZE -- Vias -- Through Hole Pads -- Surface Mount Pads -- 2.2.3 TRACK ROUTING -- 2.2.4 GROUND AND POWER DISTRIBUTION -- Ground Rail Inductance -- Gridded Ground Layout -- The Ground Plane -- Inside or Outside Layers -- Multiple Ground Planes -- 2.2.5 COPPER PLATING AND FINISHING -- 2.2.6 SOLDER RESIST -- Screen-Printed Resists -- Photo-Imaged Film -- 2.2.7 TERMINATIONS AND CONNECTIONS -- Two-Part Connectors -- Edge Connectors -- 2.3 BOARD ASSEMBLY: SURFACE MOUNT AND THROUGH HOLE -- 2.3.1 SURFACE MOUNT DESIGN RULES -- Solder Process -- Printed Circuit Board Quality -- Thermal Stresses -- Cleaning and Testing -- 2.3.2 PACKAGE PLACEMENT -- 2.3.3 COMPONENT IDENTIFICATION -- Polarity Indication -- Guarding -- 2.3.4 UNDERSTANDING THERMAL BEHAVIOR -- Thermal Conduction -- Thermal Convection -- Thermal Radiation -- Thermal Capacity -- Thermal Expansion -- Thermal Shock -- Thermal Cycling -- Solder Cracking -- The Impact of Thermal Stress on Reliability -- 2.4 SURFACE PROTECTION -- Variations in Surface Resistance -- Circuit Design Versus Surface Resistance -- 2.4.1 CONFORMAL COATING -- Coating Versus Encapsulation -- Steps to Take Before Coating -- Application -- Test and Rework -- 2.5 SOURCING BOARDS AND ARTWORK -- 2.5.1 ARTWORK -- Using a Bureau -- Disadvantages of a Bureau -- 2.5.2 BOARDS -- 3 - Passive Components -- 3.1 RESISTORS -- 3.1.1 RESISTOR TYPES -- Surface Mount Chip -- Metal Film -- Carbon…”

“…Signal and propagation theory is presented for the various circuit levels, from the chip to the PCB. The co-existence of high-speed wideband signals of radiofrequency signals and supply circuits is developed in order to provide design rules for engineers and Masters-level students. …”

“…The semiconductor industry is a fundamental building block of the new economy, there is no area of modern life untouched by the progress of nanoelectronics. The electronic chip is becomingan ever-increasing portion of system solutions, starting initially from less than 5% in the 1970 microcomputer era, to more than 60% of the final cost of a mobile telephone, 50% of the price of a personal computer (representing nearly 100% of the functionalities) and 30% of the price of a monitor in the early 2000’s.Interest in utilizing the (sub-)mm-wave frequency spectrum for commercial and research applications has also been steadily increasing. …”

“…These include vision and auditory sensors as well as neuronal processing and learning circuits that implement models of nervous systems.Techniques for building multi-chip scalable systems are considered throughout the book, including methods for dealing with transistor mismatch, extensive discussions of communication and interfacing, and making systems that operate in the real world. …”

Tabla de Contenidos: “…Cover -- 8051 Microcontroller -- Copyright -- Contents -- Preface -- Acknowledgements -- Introduction -- Chapter Objectives -- Introduction -- Microprocessor -- Microprocessor-Based System -- Microcontroller -- General Architecture -- Software Protection in Microcontrollers -- Brief History of Intel Microcontrollers -- MCS-51 Family -- Princeton and Harvard Architectures -- Comparison Between 8085 and MCS-51 -- Power Management -- Microcontroller Packaging -- Plastic Dual-Inline Package -- Quad Flat Package -- Plastic-Leaded Chip Carrier -- Plastic Quad Flat Pack -- Thin Quad Flat Pack -- Future Trend -- Summary -- Points to Remember -- Review Questions -- Evaluate Yourself -- Search for Answers -- Think and Solve -- General Architecture -- External Features -- Pins and Signals -- Internal Architecture -- Program Memory Organization -- Pipeline Architecture -- Program Lock Bits -- Data Memory Organization -- Register Banks -- Bit-Addressable Area -- Scratch-Pad Area -- System Clock -- Reset -- Summary -- Points to Remember -- Review Questions -- Evaluate Yourself -- Search for Answers -- Think and Solve -- I/o Ports and Special Function Registers -- Introduction -- Sfr Map -- Sfr Functions -- Processor Status Word -- Comparison with 8085 Flags -- Accumulator -- Register B -- Stack Pointer -- Port Registers -- Comparing 8255 Ppi with MCS-51 Ports -- Architecture of Mcs-51 Ports -- Dc Characteristics of Mcs-51 Ports -- Power Management -- Solved Examples -- Summary -- Points to Remember -- Review Questions -- Evaluate Yourself -- Search for Answers -- Think and Solve -- Addressing Modes and Data Move Operations -- Instructions and Instruction Groups of Mcs-51 -- Addressing Modes -- Immediate Addressing Mode -- Direct Addressing Mode -- Register Direct Addressing Mode -- Register Indirect Addressing Mode -- Data Transfer Mnemonics…”

“…It is a valuable resource for any designer who simulates multi-chip digital designs.<br…”

Tabla de Contenidos: “…Cover -- Title -- Copyright -- Contents -- Preface -- About the Author -- 1 Materials for Engineering -- 1.1 The Material World -- 1.2 Materials Science and Engineering -- 1.3 Six Materials That Changed Your World -- STEEL BRIDGES-INTRODUCING METALS -- LUCALOX LAMPS-INTRODUCING CERAMICS -- OPTICAL FIBERS-INTRODUCING GLASSES -- NYLON PARACHUTES-INTRODUCING POLYMERS -- KEVLAR®-REINFORCED TIRES-INTRODUCING COMPOSITES -- SILICON CHIPS-INTRODUCING SEMICONDUCTORS -- 1.4 Processing and Selecting Materials -- 1.5 Looking at Materials by Powers of Ten -- PART I The Fundamentals -- 2 Atomic Bonding -- 2.1 A tomic Structure -- 2.2 The Ionic Bond -- COORDINATION NUMBER -- 2.3 The Covalent Bond -- 2.4 The Metallic Bond -- 2.5 The Secondary, or van der Waals, Bond -- 2.6 Materials-The Bonding Classification -- 3 Crystalline Structure-Perfection -- 3.1 Seven Systems and Fourteen Lattices -- 3.2 Metal Structures -- 3.3 Ceramic Structures -- 3.4 Polymeric Structures -- 3.5 Semiconductor Structures -- 3.6 Lattice Positions, Directions, and Planes -- 3.7 X-Ray Diffraction -- 4 Crystal Defects and Noncrystalline Structure-Imperfection -- 4.1 The Solid Solution-Chemical Imperfection -- 4.2 Point Defects-Zero-Dimensional Imperfections -- 4.3 Linear Defects, or Dislocations-One-Dimensional Imperfections -- 4.4 Planar Defects-Two-Dimensional Imperfections -- 4.5 Noncrystalline Solids-Three-Dimensional Imperfections -- 5 Diffusion -- 5.1 Thermally Activated Processes -- 5.2 Thermal Production of Point Defects -- 5.3 Point Defects and Solid-State Diffusion -- 5.4 Steady-State Diffusion -- 5.5 Alternate Diffusion Paths -- 6 Mechanical Behavior -- 6.1 Stress Versus Strain -- METALS -- CERAMICS AND GLASSES -- POLYMERS -- 6.2 Elastic Deformation -- 6.3 Plastic Deformation -- 6.4 Hardness -- 6.5 Creep and Stress Relaxation -- 6.6 Viscoelastic Deformation -- INORGANIC GLASSES…”

Tabla de Contenidos: “…. -- 3:4 Netwatch for SMM -- 3:5 Packet-in-Packet Mitigation Bypass -- 3:6 An RDRAND Backdoor in Bochs -- 3:7 Kosher Firmware for the Nokia 2720 -- 3:8 Tetranglix Boot Sector -- 3:9 Defusing the Qualcomm Dragon -- 3:10 Tales of Python's Encoding -- 3:11 Angecryption -- Chapter 4: Tract de la Société Secrète -- 4:1 Let me tell you a story -- 4:2 Epistle on the Bountiful Seeds of 0Day -- 4:3 This OS is a Boot Sector -- 4:4 Prince of PoC -- 4:5 New Facedancer Framework -- 4:6 Power Glitching Tamagotchi -- 4:7 A Plausibly Deniable Cryptosystem -- 4:8 Hardening Pin Tumbler Locks -- 4:9 Intro to Chip Decapsulation -- 4:10 Forget Not the Humble Timing Attack -- 4:11 This Truecrypt is a PDF -- 4:12 How to Manually Attach a File to a PDF -- 4:13 Ode to ECB -- Chapter 5: Address to the Inhabitants of Earth…”

Tabla de Contenidos: “…Materials for Engineering -- 1.1 The Material World -- 1.2 Materials Science and Engineering -- 1.3 Six Materials That Changed Your World -- Steel Bridges-Introducing Metals -- Transparent Oxides-Introducing Ceramics -- Smartphones And Tablets-Introducing Glasses -- Nylon Parachutes-Introducing Polymers -- Kevlar®-Reinforced Tires-Introducing Composites -- Silicon Chips-Introducing Semiconductors -- 1.4 Processing and Selecting Materials -- 1.5 Looking at Materials by Powers of Ten -- Part I: The Fundamentals -- Chapter 2. …”

Tabla de Contenidos: “…-- 11.1.3 Lookup model -- 11.2 Finessing lookups -- 11.2.1 Threaded indices and tag switching -- 11.2.2 Flow switching -- 11.2.3 Status of tag switching, flow switching, and multiprotocol label switching -- 11.3 Non-algorithmic techniques for prefix matching -- 11.3.1 Caching -- 11.3.2 Ternary content-addressable memories -- 11.4 Unibit tries -- 11.5 Multibit tries -- 11.5.1 Fixed-stride tries -- 11.5.2 Variable-stride tries -- 11.5.3 Incremental update -- 11.6 Level-compressed (LC) tries -- 11.7 Lulea-compressed tries -- 11.8 Tree bitmap -- 11.8.1 Tree bitmap ideas -- 11.8.2 Tree bitmap search algorithm -- 11.8.3 PopTrie: an alternate bitmap algorithm -- 11.9 Binary search on ranges -- 11.10 Binary search on ranges with Initial Lookup Table -- 11.11 Binary search on prefix lengths -- 11.12 Linear search on prefix lengths with hardware assist -- 11.12.1 Using Bloom Filters to compress prefix bitmaps -- 11.12.2 SAIL: Uncompressed Bitmaps up to a pivot level -- 11.13 Memory allocation in compressed schemes -- 11.13.1 Frame-based compaction -- 11.14 Fixed Function Lookup-chip models -- 11.15 Programmable Lookup Chips and P4 -- 11.15.1 The P4 language -- 11.15.2 IP Lookups in the P4 Model -- 11.16 Conclusions -- 11.17 Exercises -- 12 Packet classification -- 12.1 Why packet classification? …”

Tabla de Contenidos: “…., SFF) -- Section 7.4.4 Tables '2' and '3' -- 3.3.3 Random Hardware Failures -- Section 7.4.5 -- 3.4 Integration and Test (Referred to as Verification) -- Section 7.5 and 7.9 of the Standard Table B3 (avoidance) -- 3.5 Operations and Maintenance -- Section 7.6 Table B4 (avoidance) -- 3.6 Validation (Meaning Overall Acceptance Test and the Close Out of Actions) -- Section 7.3 and 7.7: Table B5 -- 3.7 Safety Manuals -- Section 7.4.9.3-7 and App D -- 3.8 Modifications -- Section 7.8 -- 3.9 Acquired Subsystems -- 3.10 "Proven in Use" (Referred to as Route 2s in the Standard) -- 3.11 ASICs and CPU Chips -- (a) Digital ASICs and User Programmable ICs -- Section 7.4.6.7 and Annex F of the Standard -- (b) Digital ICs with On-Chip Redundancy (up to SIL 3) -- Annex E of the Standard -- 3.12 Conformance Demonstration Template -- IEC 61508 Part 2 -- 4 - Meeting IEC 61508 Part 3 -- 4.1 Organizing and Managing the Software Engineering -- 4.1.1 Section 7.1 and Annex G of the Standard Table "1" -- 4.2 Requirements Involving the Specification…”

“…Over 80 practical and interesting recipes that explore the plethora of functionalities and opportunities available with Raspberry Pi Zero About This Book Deep dive into the components of the small yet powerful Raspberry Pi Zero Get into grips with integrating various hardware, programming, and networking concepts with the so-called “cheapest computer” Explore the functionalities of this $5 chip through practical recipes Who This Book Is For This book is for programmers and hobbyists who are eager to dive deep into the Raspberry Pi Zero. …”

Tabla de Contenidos: “…-- 8.3 When You Can't Version Control a Circuit Chip -- 8.4 Don't Forget the Interfaces -- 8.5 Understanding Dependencies -- 8.6 Traceability -- 8.7 Deploying Changes to the Firmware -- 8.8 The Future of Hardware CM -- Conclusion -- PART III: THE PEOPLE SIDE OF CM -- Chapter 9 Rightsizing Your Processes -- Goals of Rightsizing Your CM Processes -- 9.1 Why Is Rightsizing Your Processes Important? …”

“…This book will walk you through the Bioconductor tools necessary for you to understand and carry out protocols in RNA-seq and ChIP-seq, phylogenetics, genomics, gene search, gene annotation, statistical analysis, and sequence analysis. …”

Tabla de Contenidos: “…16.1 | Multicore Processing - The Concepts -- 16.2 | Major Issues in Multicore Processing -- 16.3 | The x86-based Chip Multiprocessors -- 16.4 | Conclusion -- Key Points of this chapter -- Questions -- Exercises -- 17. …”

Tabla de Contenidos: “…-- Raspberry Pi Hardware -- System on a Chip -- Raspberry Pi RAM -- Connectivity -- Setting Up the Raspberry Pi -- microSD Memory Card -- Installing the OS -- Inserting the microSD Memory Card -- Connecting a Keyboard and Mouse -- Connecting a Monitor…”

Tabla de Contenidos: “…Button That Skirt and Cover That Thigh -- 40. Chipped Green Nail Polish and Other Grooming Mistakes -- 41. …”

Tabla de Contenidos: “…Cover -- Dedication -- Contents -- Preface to the First Edition -- Preface -- Acknowledgements -- Chapter 1 : Introduction -- Chapter Objectives -- 1.1 Introduction -- 1.2 Microprocessor -- 1.2.1 Microprocessor-Based System -- 1.3 Microcontroller -- 1.3.1 General Architecture -- 1.3.2 Software Protection in Microcontrollers -- 1.3.3 Brief History of Intel Microcontrollers -- 1.4 MCS-51 Family -- 1.4.1 Princeton and Harvard Architectures -- 1.4.2 Comparison Between 8085 and MCS-51 -- 1.5 Power Management -- 1.6 Microcontroller Packaging -- 1.6.1 Plastic Dual-Inline Package (PDIP) -- 1.6.2 Quad Flat Package (QFP) -- 1.6.3 Plastic-Leaded Chip Carrier (PLCC) -- 1.6.4 Plastic Quad Flat Pack (PQFP) -- 1.6.5 Thin Quad Flat Pack (TQFP) -- 1.7 Future Trend -- Summary -- Points to Remember -- Review Questions -- Evaluate Yourself -- Search for Answers -- Think and Solve -- Chapter 2 : General Architecture -- Chapter Objectives -- 2.1 External Features -- 2.2 Pins and Signals -- 2.3 Internal Architecture -- 2.4 Program Memory Organization -- 2.4.1 Pipeline Architecture -- 2.4.2 Program Lock Bits -- 2.5 Data Memory Organization -- 2.5.1 Register Banks -- 2.5.2 Bit-Addressable Area -- 2.5.3 Scratch-Pad Area -- 2.6 System Clock -- 2.7 Reset -- 2.8 How to Program 8051 -- 2.8.1 Overview of Programming -- 2.8.2 Editor -- 2.8.3 Assembler -- 2.8.4 Burning the Chip -- 2.8.5 IDE -- Summary -- Points to Remember -- Review Questions -- Evaluate Yourself -- Search for Answers -- Think and Solve -- Chapter 3 : I/O Ports and Special Function Registers -- Chapter Objectives -- 3.1 Introduction -- 3.2 SFR Map -- 3.3 SFR Functions -- 3.4 Processor Status Word -- 3.4.1 Comparison with 8085 Flags -- 3.5 Accumulator (Register A) -- 3.6 Register B -- 3.7 Stack Pointer -- 3.8 Port Registers (P0, P1, P2 and P3) -- 3.8.1 Comparing 8255 PPI with MCS-51 Ports…”