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741por Maxfield, Clive, 1957-“…FPGAs are a customizable chip flexible enough to be deployed in a wide range of products and applications. …”
Publicado 2008
Libro electrónico -
742por Maya Álvarez, Miguel ÁngelTabla de Contenidos: “…5.6. CHAPA O PLACA5.7. CHIP O ASTILLA; 5.8. SOBREINJERTO; 6. ÉPOCAS DE INJERTAR; 7. …”
Publicado 2013
Biblioteca Universitat Ramon Llull (Otras Fuentes: Universidad Loyola - Universidad Loyola Granada, Biblioteca de la Universidad Pontificia de Salamanca)Libro electrónico -
743por Barraca Mairal, JorgeTabla de Contenidos: “…CAMINO A ÍTACA; La pregunta terapéutica; "Cambiar el chip"; Las cosas que anhelamos y las que deberíamos anhelar; ¿Y si no sé cuáles son mis metas?…”
Publicado 2007
Biblioteca Universitat Ramon Llull (Otras Fuentes: Universidad Loyola - Universidad Loyola Granada, Biblioteca de la Universidad Pontificia de Salamanca)Libro electrónico -
744por Williams, TimTabla de Contenidos: “…Printed circuit board qualityThermal stresses; Cleaning and testing; 2.3.2 Package placement; 2.3.3 Component identification; Polarity indication; 2.4 Surface protection; Variations in surface resistance; Circuit design vs. surface resistance; 2.4.1 Guarding; 2.4.2 Conformal coating; Coating vs. encapsulation; Steps to take before coating; Application; Test and rework; 2.5 Sourcing boards and artwork; 2.5.1 Artwork; Using a bureau; Disadvantages of a bureau; 2.5.2 Boards; Chapter 3 Passive components; 3.1 Resistors; 3.1.1 Resistor types; Surface mount chip; Metal film; Carbon; Wirewound…”
Publicado 2004
Libro electrónico -
745por Sweetman, DominicTabla de Contenidos: “…RISCs and MIPS Architectures; 1.1 Pipelines; 1.2 The MIPS Five-Stage Pipeline; 1.3 RISC and CISC; 1.4 Great MIPS Chips of the Past and Present; 1.5 MIPS Compared with CISC Architectures; Chapter 2. …”
Publicado 2007
Libro electrónico -
746por Kumar, AmitabhTabla de Contenidos: “…; Chapter 8 Chipsets for WiMAX devices; 8.1 Realizing WiMAX Functions in Physical Devices; 8.2 Requirements of Chipsets for Mobile WiMAX; 8.3 Systems on Chip (SOC) for WiMAX; 8.4 Fixed WiMAX SOCs; 8.5 Mobile WiMAX Chipsets; 8.6 Base Stations; 8.7 Handsets…”
Publicado 2008
Libro electrónico -
747por Bates, Martin, 1952-Tabla de Contenidos: “…Front Cover; Programming 8-bit PIC Microcontrollers in C: with Interactive Hardware Simulation; Copyright Page; Contents; Foreword; Preface; Introduction; Part 1 PIC Microcontroller Systems; 1.1 PIC16 Microcontrollers; MCU Features; Program Execution; RAM File Registers; Other PIC Chips; 1.2 PIC16 MCU Configuration; Clock Options; Configuration Options; Configuration in C; 1.3 PIC16 MCU Peripherals; Timers; A/D Converter; Comparator; Parallel Slave Port; Interrupts; 1.4 PIC16 Serial Interfaces; USART; SPI Bus; I[sup(2)]C Bus; 1.5 PIC16 MPLAB Projects; MPLAB C Project; Project Files…”
Publicado 2008
Libro electrónico -
748Publicado 2008Tabla de Contenidos: “…2.5.5 Dynamic Division and Other Dynamic Signal-processing Techniques2.6 A Universal Transducer Interface; 2.6.1 Description of the Interface Chip and the Applied Measurement Techniques; 2.6.2 Realization and Experimental Results; 2.7 Summary and Future Trends; 2.7.1 Summary; 2.7.2 Future Trends; Problems; References; 3 Silicon Sensors: An Introduction; 3.1 Introduction; 3.2 Measurement and Control Systems; 3.3 Transducers; 3.3.1 Form of Signal-carrying Energy; 3.3.2 Signal Conversion in Transducers; 3.3.3 Smart Silicon Sensors; 3.3.4 Self-generating and Modulating Transducers…”
Libro electrónico -
749por Minns, Peter D.Tabla de Contenidos: “…5.5 CONTROLLING THE FINITE-STATE MACHINE FROM A MICROPROCESSOR/MICROCONTROLLER5.6 A MEMORY-CHIP TESTER; 5.7 COMPARING ONE HOT WITH THE MORE CONVENTIONAL DESIGN METHOD OF CHAPTER 4; 5.8 A DYNAMIC MEMORY ACCESS CONTROLLER; 5.8.1 Flip-Flop Equations; 5.8.2 Output Equations; 5.9 HOW TO CONTROL THE DYNAMIC MEMORY ACCESS FROM A MICROPROCESSOR; 5.10 DETECTING SEQUENTIAL BINARY SEQUENCES USING A FINITE-STATE MACHINE; 5.11 SUMMARY; 6 Introduction to Verilog HDL; 6.1 A BRIEF BACKGROUND TO HARDWARE DESCRIPTION LANGUAGES; 6.2 HARDWARE MODELLING WITH VERILOG HDL: THE MODULE…”
Publicado 2008
Libro electrónico -
750Publicado 2012Tabla de Contenidos: “…7.6 References8 GenomicTools: an open source platform for developing high-throughput analytics in genomics; 8.1 Introduction; 8.2 Data types; 8.3 Tools overview; 8.4 C++ API for developers; 8.5 Case study: a simple ChIP-seq pipeline; 8.6 Performance; 8.7 Conclusion; 8.8 Resources; 8.9 References; 9 Creating an in-house 'omics data portal using EBI Atlas software; 9.1 Introduction; 9.2 Leveraging 'omics data for drug discovery; 9.3 The EBI Atlas software; 9.4 Deploying Atlas in the enterprise; 9.5 Conclusion and learnings; 9.6 Acknowledgments; 9.7 References…”
Libro electrónico -
751por Walls, ColinTabla de Contenidos: “…EABI and File/Debug Formats1.5.4 Conclusions; 1.6 Embedded Software for Transportation Applications; 1.6.1 Introduction; 1.6.2 Transportation System Characteristics; 1.6.3 Programming Issues; 1.6.4 Real-Time Operating System Factors; RTOS Requirements; OSEK/VDX; 1.6.5 Conclusions; 1.7 How to Choose a CPU for Your System on Chip Design; 1.7.1 Design Complexity; 1.7.2 Design Reuse; 1.7.3 Memory Architecture and Protection; 1.7.4 CPU Performance; 1.7.5 Power Consumption; 1.7.6 Costs; 1.7.7 Software Issues; 1.7.8 Multicore SoCs; 1.7.9 Conclusions; 1.8 An Introduction to USB Software…”
Publicado 2012
Libro electrónico -
752por Lifante, Gines“…The elements in such ""photonic chip"" are interconnected through waveguides, and also the integrated optics components themselves are fabricated using waveguide configuration, such as couplers, switches, modulators, multiplexors, amplifiers and lasers, etc. …”
Publicado 2003
Libro electrónico -
753Publicado 2022“…The Pico contains a customer System on a Chip (SoC) called the RP2040, making it the Foundation's first entry into the low-cost microcontroller market. …”
Libro electrónico -
754por McFedries, Paul“…A friendly character called Chip introduces each task, and sidebars offer real-world advice…”
Publicado 2007
Libro electrónico -
755por Hall, Stephen H.Tabla de Contenidos: “…7.5 Common terminology -- 7.6 Drawbacks of differential signaling -- 7.7 References -- 7.8 Problems -- Chapter 8: Mathematical Requirements of Physical Channels -- 8.1 Frequency domain effects in time domain simulations -- 8.2 Requirements for a physical Channel -- 8.3 References -- 8.4 Problems -- Chapter 9: Network Analysis for Digital Engineers -- 9.1 High frequency voltage and current waves -- 9.2 Network Theory -- 9.3 Properties of Physical S-parameters -- 9.4 References -- 9.5 Problems -- Chapter 10: Topics in High-Speed Channel Modeling -- 10.1 Creating a physical transmission line mode -- 10.2 Non-Ideal Return Paths -- 10.3 Vias -- 10.4 References -- 10.5 Problems -- Chapter 11: I/O Circuits and Models -- 11.1 Introduction -- 11.2 Push-Pull Transmitters -- 11.3 CMOS Receivers -- 11.4 ESD Protection Circuits -- 11.5 On-Chip Termination -- 11.6 Bergeron Diagrams -- 11.7 Open Drain Transmitters -- 11.8 Differential Current Mode Transmitters -- 11.9 Low Swing/Differential Receivers -- 11.10 IBIS Models -- 11.11 Summary -- 11.12 References -- 11.13 Problems -- Chapter 12: Equalization -- 12.1 Introduction -- 12.2 Continuous Time Linear Equalizers -- 12.3 Discrete Linear Equalizers -- 12.4 Decision Feedback Equalization -- 12.5 Summary -- 12.6 References -- 12.7 Problems -- Chapter 13: Modeling and Budgeting of Timing Jitter and Noise -- 13.1 The Eye Diagram -- 13.2 Bit Error Rate -- 13.3 Jitter Sources and Budgets -- 13.4 Noise Sources and Budgets -- 13.5 Peak Distortion Analysis Methods -- 13.6 Summary -- 13.7 References -- 13.8 Problems -- Chapter 14: System Analysis Using Response Surface Modeling -- 14.1 Introduction -- 14.2 Case Study: 10 Gb/s differential PCB interface -- 14.3 RSM Construction by Least Squares Fitting -- 14.4 Measures of Fit -- 14.5 Significance Testing -- 14.6 Confidence Intervals -- 14.7 Sensitivity Analysis and Design Optimization -- 14.8 Defect Rate Prediction Using Monte Carlo Simulation -- 14.9 Additional RSM Considerations -- 14.10 Summary…”
Publicado 2009
Libro electrónico -
756por Vermesan, OvidiuTabla de Contenidos: “…Cover -- Half Title -- Series Page -- Title Page -- Copyright Page -- Dedication -- Acknowledgement -- Table of Contents -- Preface -- List of Figures -- List of Tables -- List of Contributors -- Chapter 1: Benchmarking Neuromorphic Computing for Inference -- 1.1: Introduction -- 1.2: State of the art in Benchmarking -- 1.2.1: Machine Learning -- 1.2.2: Hardware -- 1.3: Guidelines -- 1.3.1: Fair and Unfair Benchmarking -- 1.3.2: Combined KPIs and Approaches for Benchmarking -- 1.3.3: Outlook : Use-case Based Benchmarking -- 1.4: Conclusion -- References -- Chapter 2: Benchmarking the Epiphany Processor as a Reference Neuromorphic Architecture -- 2.1: Introduction and Background -- 2.2: Comparison with a Few Well-Known Digital Neuromorphic Platforms -- 2.3: Major Challenges in Neuromorphic Architectures -- 2.3.1: Memory Allocation -- 2.3.2: Efficient Communication -- 2.3.3: Mapping SNN onto Hardware -- 2.3.4: On-chip Learning -- 2.3.5: Idle Power Consumption -- 2.4: Measurements from Epiphany -- 2.5: Conclusion -- References -- Chapter 3: Temporal Delta Layer: Exploiting Temporal Sparsity in Deep Neural Networks for Time-Series Data -- 3.1: Introduction -- 3.2: Related Works -- 3.3: Methodology -- 3.3.1: Delta Inference -- 3.3.2: Sparsity Induction Using Activation Quantization -- 3.3.2.1: Fixed Point Quantization -- 3.3.2.2: Learned Step-Size Quantization -- 3.3.3: Sparsity Penalty -- 3.4: Experiments and Results -- 3.4.1: Baseline -- 3.4.2: Experiments -- 3.4.3: Result Analysis -- 3.5: Conclusion -- References -- Chapter 4: An End-to-End AI-based Automated Process for Semiconductor Device Parameter Extraction -- 4.1: Introduction -- 4.2: Semantic Segmentation -- 4.2.1: Proof of Concept and Architecture Overview -- 4.2.2: Implementation Details and Result Overview -- 4.3: Parameter Extraction -- 4.4: Conclusion -- 4.5: Future Work -- References…”
Publicado 2023
Libro electrónico -
757
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758Publicado 2015Tabla de Contenidos: “…1.11.1 Device / Hardware Purchases References and Further Reading; Chapter 2 Wearable Computing Background and Theory; 2.1 Wearable Computing History; 2.1.1 Wearable Computing Pioneers; 2.1.2 Academic Research at Various Universities; 2.2 Internet of Things (IoT) and Wearables; 2.2.1 Machine to Machine (M2M); 2.3 Wearables' Mass Market Enablers; 2.3.1 "ARM-ed" revolution; 2.3.1.1 ARM alternatives; 2.3.2 System on Chip (SoC); 2.3.3 Human Dependence on Computing; 2.3.4 Smartphone extensions; 2.3.5 Sensors; 2.3.5.1 Micro-Electro-Mechanical Systems (MEMS) Sensors…”
Libro electrónico -
759Publicado 2023Tabla de Contenidos:Libro electrónico
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760por Dobkin, Daniel MarkTabla de Contenidos: “…5.4 Talking Back5.5 Tag IC Overall Design Challenges; 5.6 Packaging: No Small Matter; 5.7 Other Passive Ways; 5.8 Assault of the Battery; 5.9 Capsule Summary; Further Reading; Passive Tag IC Design; Chip Assembly Techniques; Conductive Inks; SAW Tags; Organic ICs; Battery Tags and Active Sensors; Exercises; 6 Reader Antennas; 6.1 Not Just for Insects Anymore?…”
Publicado 2012
Libro electrónico