Tabla de Contenidos: “…; Nyquist Sampling Theory; Nyquist Sampling Theory Simplified; Chapter 2 Camera Sensors; The Practical Differences Between Film and Digital Sensors; Sensor Size Has an Effect on the Image We See; CCD Versus CMOS; 3-Chip 2/3-Inch Sensors; Prisms Are Very Difficult to Engineer; Chromatic Aberration; Telecentricity in Lens Design; CCD Image Smear; Three Solutions to the Problem of CCD Image Smear; Interline Transfer CCD Sensors…”

Tabla de Contenidos: “…RAMDRAM; SRAM; NVRAM; DPRAM; EPROM; Flash; SD-MMC; Hard Disk; Memory architecture; Cache; Translation lookaside buffer (TLB); Instruction cache; Data cache; Cache customization; Virtual memory; Scratch pad; Software overlays; DMA; DRAM; Special-purpose memory; Memory structure of multicore architecture; Shared memory architecture; Uniform memory access (UMA); Non-uniform memory access (NUMA); Distributed memory architecture; Cache memory in multicore chips; Cache coherency; Directory-based cache coherence protocol; Snoopy cache coherence protocol; MESI cache coherence protocol…”

Tabla de Contenidos: “…Games for ExploringThe 4Cs; The 5 Whys; Affinity Map; Atomize; The Blind Side; Build the Checklist; Business Model Canvas; Button; Campfire; Challenge Cards; Customer, Employee, Shareholder; Design the Box; Do, Redo & Undo; Elevator Pitch; Five-Fingered Consensus; Flip It; Force Field Analysis; Give-and-Take Matrix; Heart, Hand, Mind; Help Me Understand; Make a World; Mood Board; Open Space; Pain-Gain Map; The Pitch; Product Pinocchio; Post the Path; RACI Matrix; Red:Green Cards; Speedboat; SQUID; Staple Yourself to Something; SWOT Analysis; Synesthesia; Talking Chips…”

Tabla de Contenidos: “…312 -- A.3.6 IMote 2 312 -- A.3.7 System-on-Chip CC2510 313 -- A.3.8 System-on-Chip CC2530 314 -- A.4 Networks and Protocols 315 -- A.4.1 ZigBee 315 -- A.4.2 RFID and Wireless Sensor Integration 318 -- A.4.3 Wireless Sensors for Industrial Environments 319 -- A.5 Systems 321 -- References 325 -- Index 337.…”

Tabla de Contenidos: “…-- Experiment 15 : telepathy test : Background : ESP ; The setup ; Quick facts about logic chips ; ESP logic ; Building it ; Making it better -- Experiment 16 : Enhanced ESP -- Are you ready? …”

“…As advances in technology and circuit design boost operating frequencies of microprocessors, DSPs and other fast chips, new design challenges continue to emerge. …”

Tabla de Contenidos: “…Front Cover -- Microfabrication and Precision Engineering -- Copyright Page -- Contents -- List of contributors -- About the editor -- Preface -- 1 Modeling of micro- and nano-scale cutting -- 1.1 Introduction -- 1.2 Modeling of microscale cutting -- 1.2.1 Minimum chip thickness and size effect -- 1.2.2 FEM modeling of microscale cutting -- 1.2.3 FEM basics -- 1.2.4 FEM cutting models -- 1.2.5 Friction modeling -- 1.2.6 Material modeling -- 1.3 Modeling of nanoscale cutting -- 1.3.1 Model geometry and material microstructure -- 1.3.2 Potential function -- 1.3.3 Boundary conditions and input parameters -- 1.3.4 Numerical integration and equilibration -- Conclusions -- References -- 2 Machining scale: workpiece grain size and surface integrity in micro end milling -- 2.1 Introduction -- 2.2 Specific cutting energy -- 2.3 Size effect -- 2.4 Workpiece microstructure scale -- 2.5 Surface integrity -- 2.5.1 Burr formation -- 2.5.2 Chip formation -- 2.5.3 Roughness -- 2.5.4 Microhardness -- 2.5.5 Microstructural damages -- 2.5.6 Size effect -- References -- 3 Micromachining technique based on the orbital motion of the diamond tip -- 3.1 Introduction -- 3.2 Principle of micromachining using the orbital motion of the diamond tip -- 3.3 Micromachining setup and test of the stage's trajectory -- 3.3.1 Establishment of the micromachining setup and the machining procedure -- 3.3.2 Test of the trajectory of the nanopiezo stage in the orbital motion -- 3.4 Micromachining mechanism using the orbital motion of the tip -- 3.4.1 Comparison of chip states with the conical and pyramidal tips -- 3.4.2 Difference between the micromilling process and this technique -- 3.4.3 Determination of the uncut chip thickness and the cutting rake angle -- 3.5 Formation mechanism and control methods of burrs -- 3.5.1 Burr formation during machining with the conical tip…”

Tabla de Contenidos: “…4.5.3.3 Per Cent variation in capacitance -- 4.5.3.4 Per Cent variation in coupling capacitance -- 4.5.4 Compact Conductance Model of a Three-Dimensional Via -- 4.5.4.1 Compact models of through silicon via conductance -- 4.6 Electrical Characterization Through Numerical Simulation -- 4.6.1 Ansys Quick Three-Dimensional Electromagnetic Field Solver -- 4.6.2 Numerical Analysis of Through Silicon Via Impedance -- 4.7 Case Study-Through Silicon Via Characterization of the MITLL TSV process -- 4.7.1 MIT Lincoln Laboratory Three-Dimensional Process -- 4.7.2 RLC Extraction of a Single Three-Dimensional Via -- 4.7.3 RLC Coupling Between Two Three-Dimensional Vias -- 4.7.4 Effects of Three-Dimensional Via Placement on Shielding -- 4.7.5 Effect of the Return Path on Three-Dimensional Via Inductance -- 4.8 Summary -- 5 Substrate Noise Coupling in Heterogeneous Three-Dimensional ICs -- 5.1 Heterogeneous Substrate Coupling -- 5.1.1 Common Circuits and Compatible Substrate Types -- 5.1.2 Resistive Properties of Different Substrate Materials -- 5.1.3 Noise Model Reduction for Different Substrate Materials -- 5.2 Frequency Response -- 5.2.1 Isolation Efficiency of Noise Coupled System -- 5.2.2 Transfer Function of Noise Coupled System -- 5.3 Techniques to Improve Noise Isolation -- 5.3.1 Ground Network Inductance -- 5.3.2 Distance Between Aggressor and Victim -- 5.4 Summary -- 6 Three-Dimensional ICs with Inductive Links -- 6.1 Wireless On-Chip Communication Interfaces -- 6.1.1 Inductive Links -- 6.2 On-Chip Inductors for Intertier Links -- 6.2.1 Intertier Coupling Efficiency -- 6.2.2 Geometry and Electrical Characteristics of Inductor -- 6.2.3 Design Flow for Inductive Link Coils -- 6.3 Transmitter and Receiver Circuits -- 6.3.1 Design of Synchronous Inductive Link Transceivers -- 6.3.2 Asynchronous Data Transmission and Recovery -- 6.3.3 Burst Data Transmission…”

Tabla de Contenidos: “…11.6.2 AI, behavioral science, and mechanism design for GDPR and cross-border data flow -- 11.7 Global treaty on cross-border data free flow -- 11.8 Conclusion -- AI disclosure -- References -- 12 - Synthetic data -- 12.1 Introduction -- 12.2 Synthetic data -- 12.3 Generative adversarial networks -- 12.4 Cost saving -- 12.5 Time saving -- 12.6 Privacy protection -- 12.7 Improved model performance -- 12.8 Data quality -- 12.9 Model explainability -- 12.10 Legal and ethics -- 12.11 Governance of synthetic data -- 12.12 Behavioral science and mechanism design in synthetic data -- 12.13 Conclusion -- AI disclosure -- References -- 13 - Computer chips -- 13.1 Introduction -- 13.2 Digital computing -- 13.3 Transistor -- 13.4 Integrated circuit -- 13.5 Moore's law -- 13.6 From CPU to GPU -- 13.7 NVIDIA chips -- 13.8 Quantum computing -- 13.9 AI, mechanism design, and behavioral science in computer chips -- 13.10 Computer chips and international relations -- 13.11 Conclusion -- AI disclosure -- References -- Further reading -- 14 - Space -- 14.1 Introduction -- 14.2 Communication -- 14.3 Earth observation -- 14.4 Navigation -- 14.5 Military -- 14.6 Space technology and AI -- 14.7 Starlink -- 14.8 Mechanism design and behavioral science -- 14.9 Space and international relations -- 14.10 Space governance -- 14.11 Conclusion -- AI disclosure -- References -- III - Sustainability -- 15 - Climate change -- 15.1 Introduction -- 15.2 What is climate change? …”

Tabla de Contenidos: “…Diagnóstico molecular de enfermedades infecciosas transmitidas por vectores; Ácido desoxirribonucleicoo ADN; Reacción en cadenade la Polimerasa o PCR; PCR en tiempo real; ADN chips; Epidemiología Molecular…”

Tabla de Contenidos: “…-- DESCRIPCIÓN FUNCIONAL DEL DNI ELECTRÓNICO -- NUEVAS CAPACIDADES: IDENTIFICACIÓN -- FIRMA ELECTRÓNICA -- CERTIFICADOS ELECTRÓNICOS: UNA BREVE DESCRIPCIÓN -- VIDA ÚTIL -- DESCRIPCIÓN FÍSICA DEL DNI ELECTRÓNICO -- TARJETA FÍSICA DEL DNI ELECTRÓNICO -- CHIP DEL DNI ELECTRÓNICO -- CERTIFICADOS DEL DNI ELECTRÓNICO -- REQUISITOS -- TIPOS DE DISPOSITIVOS, SISTEMAS OPERATIVOS Y ESTÁNDARES -- MEDIANTE CONTACTOS -- MEDIANTE ANTENA SIN CONTACTOS (NFC) -- USO DEL DNI ELECTRÓNICO -- FIRMA DE TRÁMITES ADMINISTRATIVOS CON DNI ELECTRÓNICO…”

Tabla de Contenidos: “…Agent-Based Architecture on Reconfigurable System-on-Chip for Real-Time Systems; PART VI: Networking Sensing and Communications; 18. …”

Tabla de Contenidos: “…The control design of blast furnace clay gun play mud quantityResearch and implementation of coal traffic video management system based on the technology of image tracking and recognition; Residents air conditioning load management model studies and impact analysis; Multi-objective optimized scheduling for hydro-thermal power system; An optimal space-borne Solid-State Recorder based on domestic chips; Study on additional damping controller for VSC-HVDC to prevent low-frequency oscillation; Lightning surge analysis for 220 kV AC double circuit transmission line using LPTL…”

Tabla de Contenidos: “…Cover; Creating PC Video; Title Page; Copyright Page; Table of Contents; Preface; 1 The Camcorder-Computer Link; The Stand-Alones; Enter the Computer; The Event Videographer; The World Turned Digital; Then Came FireWire; A New World of Hard Drives; 2 Selecting the Right Camcorder; Which Format Is Right for You?; Three-Chip Video Quality; The Smaller, the Better; Manual Options; Power to Spare; Zooooom; Variable-Speed Zoom; Color Monitors and Color Viewfinders; Electronic Image Stabilization; External Microphone and Headphone Jacks; Edit Control; Summary…”

Tabla de Contenidos: “…Hardware Design 1; Single-Chip Designs; Multichip Designs; Wait States; Memory; Types of PROM; RAM; I/O; Peripheral ICs; Data Bus Loading…”

Tabla de Contenidos: “…Cover; COLOR CORRECTION FOR VIDEO; Title Page; Copyright Page; Table of Contents; Acknowledgments; Introduction; Chapter 1 Getting Started with Color Correction; Quick Start; The Goals of Color Correction; Spreading the Tonal Range; Balancing the Colors; Conclusion; Chapter 2 Analyze This-Your Monitor; Monitor Environment; The Eyes Have It; Setting Up Your Computer Monitors; Calibrating Your Video Monitors; Alternative Methods for Video Monitor Calibration; Chapter 3 Using Scopes as Creative Tools; Choosing Your Scope; Waveform Monitor; Chip Chart and Waveform Monitor…”

Tabla de Contenidos: “…; Chapter 3: Digital noise: What it is and how to deal with it; Noise comes from many sources; Chip size vs. noise; Shutter speed vs. ISO speed; Do a noise test; Built-in noise suppression; Noise-reduction software; Got noise?…”

Tabla de Contenidos: “…The Value of People in Uncertain TimesThe Value of Team Players; An Infrastructure for Motivating Our People; For Reflection; Chapter 10: Leverage Your Assets; Leveraging Technology; Businesses are More Efficient Because They Have to Be to Survive; Learn to Make 1 + 1 = 4; For Reflection; Part 3: Leading the Way; Chapter 11: Reputation Counts; Occupy Umpqua; No Chipped Paint; Ripples on A Pond; For Reflection; Chapter 12: Create Buzz (But Manage Crisis); In Today's Noisy World, Buzz is Critical; Rumors Start Fast (And Bad News Spreads Faster); You are Best at Delivering Your Message…”

Tabla de Contenidos: “…Determination of 3D Displacement Fields between X-ray Computed Tomography Images Using 3D Cross-CorrelationCharacterization of Shear and Compaction Bands in Sandstone Using X-ray Tomography and 3D Digital Image Correlation; Deformation Characteristics of Tire Chips-Sand Mixture in Triaxial Compression Test by Using X-ray CT Scanning; Strain Field Measurements in Sand under Triaxial Compression Using X-ray CT Data and Digital Image Correlation; Latest Developments in 3D Analysis of Geomaterials by Morpho+; Quantifying Particle Shape in 3D; 3D Aggregate Evaluation Using Laser and X-ray Scanning…”