“…From there, Tim will teach you how to create exterior walls, foundation walls, footings, and interior walls. …”

“…The first behind-the-walls look at the "hidden life" of Polish prisons, this book penetrates the inmates' façade of silence and deception toward outsiders and presents a vivit portrait of the prison's secret social organization…”

“…Papers address the question of exchange and mobility in prehistoric societies in relation to the evolution of their environments through the prism of their graphic productions, on objects or on walls. This volume offers the opportunity to question their symbolic behaviours within very diverse temporal, chrono-cultural or geographic contexts…”

Tabla de Contenidos: “…3.2.2 General Categorization of Phase Change Materials -- 3.2.2.1 Organic -- 3.2.2.2 Inorganic -- 3.2.2.3 Eutectic Mixtures -- 3.2.2.4 Comparison Summary -- 3.2.3 Encapsulation -- 3.2.3.1 Microencapsulation -- 3.2.3.2 Macroencapsulation -- 3.2.4 Long-Term Stability -- 3.3 State-of-the-Art Phase Change Materials -- 3.3.1 Phase Change Material Compounds -- 3.3.2 Phase Change Materials in Products for Building Applications -- 3.3.3 Phase Change Materials in Windows -- 3.3.4 Comparison of Commercial Products -- 3.4 Phase Change Materials in Building Applications -- 3.4.1 Building Applications -- 3.4.1.1 Free Cooling -- 3.4.1.2 Peak Load Shifting -- 3.4.1.3 Active Building Systems -- 3.4.1.4 Passive Building Systems -- 3.4.1.5 Thermal Comfort Control -- 3.4.2 Solar Energy Storage -- 3.4.3 Examples of Integration of Phase Change Materials for Passive Systems -- 3.4.3.1 Walls -- 3.4.3.2 Floors -- 3.4.3.3 Roofs -- 3.4.3.4 Windows and Shutters -- 3.4.3.5 Concrete -- 3.4.3.6 Thermal Insulation Materials -- 3.4.3.7 Furniture and Indoor Appliances -- 3.4.4 Retrofitting -- 3.4.5 Safety Requirements -- 3.5 Future Research Opportunities -- 3.5.1 Improving the Current Technologies -- 3.5.1.1 Increasing Thermal Storage Capacity -- 3.5.1.2 Enhancing Heat Transfer -- 3.5.2 New Technologies -- 3.5.2.1 Nanoencapsulated Phase Change Materials -- 3.5.2.2 Adjustable Phase Change Temperature -- 3.5.3 Further Reflections -- 3.5.3.1 Developing a Standard Test Scheme -- 3.5.3.2 Differential Scanning Calorimetry -- 3.5.3.3 T-History -- 3.5.3.4 Dynamic Heat Flow Apparatus -- 3.5.3.5 Dynamic Hot Box -- 3.5.3.6 Dynamic Guarded Hot Plate -- 3.5.3.7 M-Value -- 3.5.3.8 Environmental Impact Assessments -- 3.5.3.9 Expected Lifetime Predicament of Phase Change Materials -- 3.5.3.10 Quantifying the Effect of Phase Change Materials in Real-Life Buildings…”

Tabla de Contenidos: “…Front Cover -- Three-Dimensional Integrated Circuit Design -- Copyright Page -- Dedication -- Contents -- List of Figures -- About the Authors -- Preface to the Second Edition -- Preface to the First Edition -- Acknowledgments -- Organization of the Book -- 1 Introduction -- 1.1 Interconnect Issues in Integrated Systems -- 1.2 Three-Dimensional or Vertical Integration -- 1.2.1 Opportunities for Three-Dimensional Integration -- 1.2.2 Challenges of Three-Dimensional Integration -- 1.2.2.1 Technological/manufacturing limitations -- 1.2.2.2 Testing -- 1.2.2.3 Global interconnect design -- 1.2.2.4 Thermal issues -- 1.2.2.5 CAD algorithms and tools -- 1.3 Book Organization -- 2 Manufacturing of Three-Dimensional Packaged Systems -- 2.1 Stacking Methods for Transistors, Circuits, and Dies -- 2.1.1 System-in-Package -- 2.1.2 Transistor and Circuit Level Stacking -- 2.2 System-on-Package -- 2.3 Technologies for System-in-Package -- 2.3.1 Wire Bonded System-in-Package -- 2.3.2 Peripheral Vertical Interconnects -- 2.3.3 Area Array Vertical Interconnects -- 2.3.4 Metalizing the Walls of an SiP -- 2.4 Technologies for 2.5-D Integration -- 2.4.1 Interposer Materials -- 2.4.2 Metallization Processes -- 2.4.3 Vertical Interconnects -- 2.5 Summary -- 3 Manufacturing Technologies for Three-Dimensional Integrated Circuits -- 3.1 Monolithic Three-Dimensional ICs -- 3.1.1 Laser Crystallization -- 3.1.2 Seed Crystallization -- 3.1.3 Double-Gate Metal Oxide Semiconductor Field Effect Transistors for Stacked Three-Dimensional ICs -- 3.1.4 Molecular Bonding -- 3.2 Three-Dimensional ICs with Through Silicon Via or Intertier Via -- 3.2.1 Wafer Level Integration -- 3.2.2 Die-to-Die Integration -- 3.2.3 Bonding of Three-Dimensional ICs -- 3.3 Contactless Three-Dimensional ICs -- 3.3.1 Capacitively Coupled Three-Dimensional ICs…”

Tabla de Contenidos: “…6.15 Rhombic Antenna -- 6.16 Yagi-Uda Antenna -- 6.17 Log-periodic Antennas -- 6.18 Loop Antenna -- 6.18.1 Radiation Resistance, Rr of Loop Antenna -- 6.19 Helical Antenna -- 6.20 Whip Antenna -- 6.21 Ferrite Rod Antenna -- 6.22 Turnstile Antenna -- 6.23 Discone Antenna -- 6.24 Notch Antenna -- Points to Remember -- Solved Problems -- Objective Questions -- Exercise Problems -- Chapter 7: Microwaves Antennas -- 7.1 Introduction -- 7.2 Rod Reflector -- 7.3 Plane Reflector -- 7.4 Corner Reflector -- 7.5 Parabolic Reflector -- 7.6 Types of Parabolic Reflectors -- 7.6.1 Cut or Truncated Paraboloid -- 7.6.2 Parabolic Cylinder -- 7.6.3 Pillbox Antenna -- 7.6.4 Offset Paraboliod -- 7.6.5 Torus Antenna -- 7.7 Feed Systems for Parabolic Reflectors -- 7.7.1 Half-Wave Dipole Feed -- 7.7.2 Yagi-Uda Antenna Feed -- 7.7.3 Array of Collinear Dipoles Feed -- 7.7.4 Centre-fed with Spherical Reflector -- 7.7.5 Horn Feed -- 7.7.6 Cassegrain Feed -- 7.8 Shaped Beam Antennas -- 7.8.1 Fanned Beams -- 7.8.2 Sector Beam -- 7.8.3 Cosecant Beams -- 7.9 Horn Antenna -- 7.10 Corrugated Horns -- 7.11 Slot Antenna -- 7.12 Impedance of Slot Antenna -- 7.13 Impedance of a Few Typical Dipoles -- 7.14 Slots in the Walls of Rectangular Waveguide -- 7.15 Babinet's Principle -- 7.16 The Method of Moment (MOM) -- 7.17 Lens Antenna -- 7.17.1 Types of Lens Antennas -- 7.18 Equation of the Shape of Lens -- 7.19 Microstrip or Patch Antennas -- Points to Remember -- Solved Problems -- Objective Questions -- Exercise Problems -- Chapter 8: Antenna Measurements -- 8.1 Introduction -- 8.2 Drawbacks in Measurements of Antenna Parameters -- 8.3 Methods to Overcome Drawbacks in Measurements -- 8.4 Some Methods for Accurate Measurements -- 8.5 Measurement Ranges -- 8.6 Differences between Indoor and Outdoor Ranges -- 8.7 Antenna Impedance Measurement -- 8.8 Measurement of Antenna Pattern…”

Tabla de Contenidos: “…Chapter 9: Drainage infrastructure for industrial and commercial premises, estates and business parks -- 9.1 Introduction -- 9.2 Sustainable Drainage Technology -- 9.2.1 Bringing various objectives into a single technology -- 9.2.2 SUDS in relation to industrial estates -- 9.2.3 Example SUDS features -- 9.2.3.1 Grass filter strips -- 9.2.3.1.1 Advantages -- 9.2.3.1.2 Disadvantages -- 9.2.3.2 Grass swales as source control measures -- 9.2.3.2.1 Advantages -- 9.2.3.2.2 Disadvantages -- 9.2.3.3 Grass swales as conveyance features -- 9.2.3.3.1 Advantages -- 9.2.3.3.2 Disadvantages -- 9.2.3.4 Bioretention -- 9.2.3.4.1 Advantages -- 9.2.3.4.2 Disadvantages -- 9.2.3.5 Green roofs -- 9.2.3.5.1 Advantages -- 9.2.3.5.2 Disadvantages -- 9.2.3.6 Green walls -- 9.2.3.6.1 Advantages -- 9.2.3.6.2 Disadvantages -- 9.2.3.7 Pervious pavements -- 9.2.3.7.1 Advantages -- 9.2.3.7.2 Disadvantages -- 9.2.3.8 Filter drains -- 9.2.3.8.1 Advantages -- 9.2.3.8.2 Disadvantages -- 9.2.3.9 Extended detention basins -- 9.2.3.9.1 Advantages -- 9.2.3.9.2 Disadvantages -- 9.2.3.10 Retention ponds and stormwater wetlands -- 9.2.3.10.1 Advantages -- 9.2.3.10.2 Disadvantages -- 9.3 Other Drainage Features -- 9.3.1 Inspection chambers -- 9.3.2 Silt traps and oil interceptors -- 9.3.3 Packaged filtration units and vortex separators -- 9.4 Infrastructure Strategy -- 9.4.1 Water quality and pollution risks for industrial premises and estates -- 9.4.2 Spatial application of SUDS -- 9.4.2.1 At source and on site -- 9.4.2.2 Conveyance swales or drains -- 9.4.2.3 Regional (whole estate) features -- 9.4.3 Treatment capability -- 9.5 Discussion -- 9.5.1 Treatment trains -- 9.5.2 Compromise or lateral thinking -- 9.5.3 Technology development for managing design and construction risks -- 9.5.4 Catchment initiatives and retrofits -- 9.6 Conclusions -- 9.7 Acknowledgements -- References…”

“…The dynamic relationship between them is timeless, echoing through human history in patterns that link the bow and arrow with the IED (improvised explosive device), the walls of Jericho with reconnaissance satellites. …”

“…You can put the kibosh on these hackers and their dirty deeds by hardening the walls that protect your data"…”

“…In the second part, innovative applications are described from the use of glass in optical devices and lasers to fibres in composites, micropatterned components in sensors and microdevices, beads in building walls and sealing in solid oxide fuel cells…”

“…This work deals with the bending moment capacity of thin-walled steel poles with polygonal sections. Based on experimental and numerical investigations the bearing behavior of steel poles in bending with polygonal sections with an arbitrary number of corners up to the transition from a polygonal section to a round section is presented. …”

“…You’ll discover the latest tools, skills, and ideas from experts such as Steve Souders (Google), Mandi Walls (Opscode), Jeremy Edberg (Netflix), Nancy Leveson (MIT), and a host of others…”

“…They fulfil all the construction requirements even in singlelayer outside walls. Using two houses as examples all details are presented clearly and comprehensively in a scale of 1:10. …”