Tabla de Contenidos: “…Flexarms -- Furniture clamp -- Furniture pad -- Gaffer grip -- Grid clamp -- Grifflon -- Grip clip -- Grip/electrical stage box -- Grip helper -- Grounding rod/spike -- Hand truck -- Ladder -- Lamppost system (by backstage equipment) -- Mafer clamp -- Matt pipe adapter baby -- Matt poles - polecats -- Meat ax -- Miniboom -- Muscle truck/cart -- No-nail hanger/crowder -- Offset arms -- Parallels -- Pipe clamp, baby -- Pipe clamp, junior -- Pony pipe clamp -- Poultry bracket (Matthews) -- Putty knife -- Reflector -- Reflector slip-ons (scrims) -- Sandbags -- Scrims - grip -- Single net -- Double net -- Lavender net -- Silk -- Scrims, butterfly kits -- Silks -- Scrims, flex -- Side arms -- Stair blocks -- Stand adapter pin -- Stands -- C-stand -- C-stand operation -- Lowboy stand -- Reflector (combo/light) stand -- Overhead (high roller) stand -- Overhead stand usage -- Stand extensions (riser) -- Studio overhead grip arm -- Taco carts -- T-bone -- Telescoping hanger-stirrup -- Trapeze -- Trombone -- Tube stretcher -- Tubing hanger -- Turtle -- Umbrella -- Wall bracket (set) -- Wall plate-junior -- Wall sled -- Wall spreader -- Wedges -- 3 Expendables -- Automatic tape gun (ATG) tape (aka snot tape) -- Baby powder -- Bead board -- Black wrap -- Bobbinet -- Butcher paper -- Clothespins (C-47s) -- Drywall screws -- Dulling spray -- Duvatyne -- Foam core -- Grip chain -- Laminated glass -- Layout board -- Lexan -- Penny nails (#8 and #16) -- Plywood -- Pushpin -- Sash cord #8 -- Show card -- Silicone spray -- Spray glue -- Spray oil -- Staples -- Stovepipe wire -- Streaks 'n' Tips® -- Tapes -- Camera tape -- Double-faced tape -- Gaffer or grip tape -- Paper tape -- Visqueen -- 4 Knots -- Bowline knot -- Clove hitch knot -- Half hitch knot -- Square knot -- 5 Basic tool descriptions -- Standard screwdriver (common or blade type) -- Phillips screwdriver…”

Tabla de Contenidos: “…-- PIAAC data allows for a novel wage analysis of LTC workers -- Half of wage differences between personal care workers and nurses relates to differences in education and other personal characteristics -- The LTC sector pays significantly less than the hospital sector to similar workers…”

Tabla de Contenidos: “…3.7 Changes of State -- CHEMISTRY LINK TO HEALTH: Steam Burns -- CLINICAL UPDATE: A Diet and Exercise Program -- Concept Map -- Chapter Review -- Key Terms -- Core Chemistry Skills -- Understanding the Concepts -- Additional Practice Problems -- Challenge Problems -- Answers -- COMBINING IDEAS from Chapters 1 to 3 -- Chapter 4 Atoms and Elements -- CAREER Farmer -- CLINICAL UPDATE Improving Crop Production -- 4.1 Elements and Symbols -- CHEMISTRY LINK TO HEALTH: Toxicity of Mercury -- 4.2 The Periodic Table -- CHEMISTRY LINK TO HEALTH: Elements Essential to Health -- 4.3 The Atom -- 4.4 Atomic Number and Mass Number -- CHEMISTRY LINK TO THE ENVIRONMENT: Many Forms of Carbon -- 4.5 Isotopes and Atomic Mass -- 4.6 Electron Energy Levels -- CHEMISTRY LINK TO HEALTH: Biological Reactions to UV Light -- 4.7 Trends in Periodic Properties -- CLINICAL UPDATE: Improving Crop Production -- Concept Map -- Chapter Review -- Key Terms -- Core Chemistry Skills -- Understanding the Concepts -- Additional Practice Problems -- Challenge Problems -- Answers -- Chapter 5 Nuclear Chemistry -- CAREER Radiation Technologist -- CLINICAL UPDATE Cardiac Imaging Using a Radioisotope -- 5.1 Natural Radioactivity -- 5.2 Nuclear Reactions -- CHEMISTRY LINK TO HEALTH: Radon in Our Homes -- 5.3 Radiation Measurement -- CHEMISTRY LINK TO HEALTH: Radiation and Food -- 5.4 Half‐Life of a Radioisotope -- CHEMISTRY LINK TO THE ENVIRONMENT: Dating Ancient Objects -- 5.5 Medical Applications Using Radioactivity -- CHEMISTRY LINK TO HEALTH: Brachytherapy -- 5.6 Nuclear Fission and Fusion -- CHEMISTRY LINK TO THE ENVIRONMENT: Nuclear Power Plants -- CLINICAL UPDATE: Cardiac Imaging Using a Radioisotope -- Concept Map -- Chapter Review -- Key Terms -- Core Chemistry Skills -- Understanding the Concepts -- Additional Practice Problems -- Challenge Problems -- Answers…”

Tabla de Contenidos: “…Peripheral Interfacing-III -- 11.1 | Serial Communication Principles -- 11.2 | Simplex, Half Duplex and Full Duplex Communication -- 11.3 | The Programmable Serial Communication Interface…”

Tabla de Contenidos: “…29 2.15 Conductors, Semiconductors, and Insulators 30 2.16 Static Dissipative Materials 30 2.17 ESD and Materials 31 2.18 Electrification and Coulomb's Law 31 2.19 Electromagnetism and Electrodynamics 33 2.20 Electrical Breakdown 33 2.21 Electro-Quasistatics and Magnetoquasistatics 36 2.22 Electrodynamics and Maxwell's Equations 36 2.23 Electrostatic Discharge (ESD) 36 2.24 Electromagnetic Compatibility (EMC) 37 2.25 Electromagnetic Interference (EMI) 37 2.26 Fundamentals of Manufacturing and Electrostatics 37 2.27 Materials, Tooling, Human Factors, and Electrostatic Discharge 38 2.28 Materials and Human-induced Electric Fields 39 2.29 Manufacturing Environment and Tooling 39 2.30 Manufacturing Equipment and ESD Manufacturing Problems 39 2.31 Manufacturing Materials 39 2.32 Measurement and Test Equipment 40 2.33 Manufacturing Testing for Compliance 41 2.34 Grounding and Bonding Systems 42 2.35 Work Surfaces 42 2.36 Wrist Straps 43 2.37 Constant Monitors 43 2.38 Footwear 43 2.39 Floors 44 2.40 Personnel Grounding with Garments 44 2.41 Garments 44 2.42 Air Ionization 44 2.43 Seating 45 2.44 Packaging and Shipping 46 2.45 Trays 46 2.46 ESD Identification 46 2.47 ESD Program Auditing 46 2.48 ESD On-Chip Protection 47 2.49 ESD, EOS, EMI, EMC, and Latchup 47 2.50 Manufacturing Electrical Overstress (EOS) 48 2.51 EMI 50 2.52 EMC 50 2.53 Summary and Closing Comments 50 References 50 3 ESD Standards 55 3.1 Factory - Flooring 55 3.2 Factory - Resistance Measurement of Materials 56 3.3 JEDEC 58 3.4 International Electro-Technical Commission (IEC) 59 3.5 IEEE 59 3.6 Department of Defense (DOD) 59 3.7 Military Standards 59 3.8 SAE 60 3.9 Summary and Closing Comments 60 Questions and Answers 60 References 61 4 ESD Testing 65 4.1 Electrostatic Discharge (ESD) Testing 65 4.2 ESD Models 65 4.3 HBM Test System 69 4.4 HBM Two-pin Test System 69 4.5 Machine Model (MM) 69 4.6 Small Charge Model (SCM) 70 4.7 Small Charge Model Source 71 4.8 CDM Pulse Waveform 72 4.9 HMM Equivalent Circuit 77 4.10 HMM Test Equipment 77 4.11 HMM Test Configuration 78 4.12 HMM Fixture Board 78 4.13 Transmission Line Pulse (TLP) 82 4.14 TLP Test Systems 84 4.15 IEC 61000-4-2 87 4.16 Equivalent Circuit 89 4.17 Test Equipment 89 4.18 Cable Discharge Event (CDE) 90 4.19 CDE Pulse Waveform 93 4.20 Equivalent Circuit 93 4.21 Commercial Test Systems 94 4.22 Systems Electromagnetic Interference (EMI) 95 4.23 Electromagnetic Compatibility (EMC) 95 4.24 Electrical Overstress (EOS) 95 4.25 Latchup 95 4.26 Electrical Overstress (EOS) 95 4.27 EOS Sources - Lightning 96 4.28 EOS Sources - Electromagnetic Pulse (EMP) 97 4.29 Electromagnetic Compatibility 97 4.30 Summary and Closing Comments 100 References 100 5 ESD Device Physics 117 5.1 Electro-thermal Instability 117 5.2 Stable System 118 5.3 Unstable System 118 5.4 Differential Relation of Voltage and Current 120 5.5 Time Constant Hierarchy 121 5.6 Thermal Physics Time Constants 121 5.7 Adiabatic, Thermal Diffusion Time Scale and Steady State 121 5.8 Electro-quasistatic and Magnetoquasistatics 122 5.9 Electrical Instability 124 5.10 Thermal Physics Time Constants 125 5.11 Adiabatic, Thermal Diffusion Time Scale and Steady State 126 5.12 Electrical Instability and Breakdown 126 5.13 Spatial Instability and Electro-thermal Current Constriction 127 5.14 Equipotential Surface 127 5.15 Heat Flow 128 5.16 Conservation of Heat 128 5.17 Electric Potential and Temperature Gradient 128 5.18 Electric Energy, Resistivity, and Thermal Conductivity 129 5.19 Breakdown 131 5.20 Electron Current Continuity Relationship 136 5.21 Air Breakdown and Peak Currents 138 5.22 Electro-thermal Instability 139 5.23 Mathematical Methods - Green's Function and Method of Images 141 5.24 Mathematical Methods - Green's Function and Method of Images 143 5.25 Mathematical Methods - Integral Transforms of the Heat Conduction Equation 148 5.26 Flux Potential Transfer Relations Matrix Methodology 152 5.27 Heat Equation Variable Conductivity 154 5.28 Mathematical Methods - Boltzmann Transformation 156 5.29 Mathematical Methods - The Duhamel Formulation 158 5.30 Spherical Source Tasca Model 160 5.31 Wunsch-Bell Model 163 5.32 The Smith and Littau Model 166 5.33 The Arkihpov-Astvatsaturyan-Godovosyn-Rudenko Model 168 5.34 The Vlasov-Sinkevitch Model 169 5.35 The Dwyer, Franklin and Campbell Model 169 5.36 Negative Differential Resistor and Resistor Ballasting 174 5.37 Ash Model - Nonlinear Failure Power Thresholds 176 5.38 Statistical Models for ESD Prediction 178 5.39 Summary and Closing Comments 180 References 180 6 ESD Events and Protection Circuits 189 6.1 Human Body Model (HBM) 189 6.2 Machine Model (MM) 191 6.3 Charged Device Model 193 6.4 Human Metal Model (HMM) 197 6.5 IEC 61000-4-2 History 204 6.6 IEC 61000-4-5 209 6.7 Cable Discharge Event (CDE) 213 6.8 CDM Scope 215 References 219 7 ESD Failure Mechanism 235 7.1 Tables of CMOS ESD Failure Mechanisms 235 7.2 LOCOS Isolation-Defined CMOS 235 7.3 LOCOS-bound Thick Oxide MOSFET 241 7.4 LOCOS-Bound Structures 242 7.5 Shallow Trench Isolation (STI) 245 7.6 STI Pull-down ESD Failure Mechanism 245 7.7 STI Pull-Down and Gate Wrap-Around 246 7.8 MOSFETs 247 7.9 LOCOS-bound Thick Oxide MOSFET 252 7.10 Bipolar Transistor Devices 254 7.11 Silicide Blocked N-diffusion Resistors 259 7.12 Silicon Germanium ESD Failure Mechanisms 259 7.13 Silicon Germanium Carbon ESD Failure Mechanisms 259 7.14 Gallium Arsenide Technology ESD Failure Mechanisms 260 7.15 Indium Gallium Arsenide ESD Failure Mechanisms 261 7.16 Micro Electromechanical (MEM) Systems 263 7.17 Micro-mirror Array Failures 265 7.18 EOS Bond Pad and Interconnect Failure 269 7.19 Summary and Closing Comments 272 References 273 8 ESD Design Synthesis 281 8.1 ESD Design Synthesis and Architecture Flow 281 8.2 ESD Design - the Signal Path and the Alternate Current Path 287 8.3 ESD Electrical Circuit and Schematic Architecture Concepts 289 8.4 The Ideal ESD Network 289 8.5 Mapping Semiconductor Chips and ESD Designs 293 8.6 Mapping across Semiconductor Fabricators 294 8.7 ESD Design Mapping across Technology Generations 295 8.8 ESD Networks, Sequencing, and Chip Architecture 306 8.9 ESD Layout and Floorplan-related Concepts 314 8.10 ESD Architecture and Floor-planning 323 8.11 Digital and Analog CMOS Architecture 347 8.12 Digital and Analog Floorplan - Placement of Analog Circuits 348 8.13 Mixed-signal Architecture - Digital, Analog, and RF Architecture 350 8.14 Summary and Closing Comments 351 Questions 351 References 352 9 On-chip ESD Protection Circuits - Input Circuitry 363 9.1 Receivers and ESD 363 9.2 Receivers and Receiver Delay Time 363 9.3 ESD Loading Effect on Receiver Performance 364 9.4 Receivers and HBM 365 9.5 Receivers and CDM 366 9.6 Receivers and Receiver Evolution 368 9.7 Receiver Circuits with Half-pass Transmission Gate 368 9.8 Receiver with Full-pass Transmission Gate 371 9.9 Receiver, Half-pass Transmission Gate, and Keeper Network 373 9.10 Receiver, Half-pass Transmission Gate, and the Modified Keeper Network 377 9.11 Receiver Circuits with Pseudo-zero VT Half-pass Transmission Gates 379 9.12 Receiver with Zero VT Transmission Gate 381 9.13 Receiver Circuits with Bleed Transistors 383 9.14 Receiver Circuits with Test Functions 384 9.15 Receiver with…”

Tabla de Contenidos: “…Intro -- Acknowledgments -- Contents -- Editors and Contributors -- 1 Animals in Our Midst: An Introduction -- 1.1 Introduction -- 1.2 Animal Ethics in the Anthropocene -- 1.3 The Netherlands as Mirror of Biodiversity Problems -- 1.3.1 The Recovery of Wildlife -- 1.3.2 Exotic Species and Climate Refugees -- 1.3.3 The Sixth Mass Extinction -- 1.3.4 Rewilding and De-extinction -- 1.3.5 Intensive Livestock Farming -- 1.3.6 The Ecological Impact of Large-Scale Hunting -- 1.3.7 Companion Animals -- 1.3.8 The 'Liminalisation' of Wildlife -- 1.3.9 The Struggle for Nature Between People -- 1.4 Overview of the Volume -- 1.4.1 Part 1: Animal Agents -- 1.4.2 Part 2: Domesticated Animals -- 1.4.3 Part 3: Urban Animals -- 1.4.4 Part 4: Wild Animals -- 1.4.5 Part 5: Animal Artefacts -- References -- 2 Animal Conservation in the Twenty-First Century -- 2.1 Introduction -- 2.2 Viable Populations -- 2.3 Sufficiently Large Numbers and the Amount of Area They Require -- 2.4 Challenges -- 2.5 Trophic Downgrading: "When the Cat Is Away, the Mice Will Play" -- 2.6 Conservation in Twenty-First Century: 'Cores, Corridors and Carnivores' Meets 'Nature Needs Half' -- 2.7 Viable Ecosystems with Red Deer and Wolf in the Netherlands -- 2.7.1 Current Population of Red Deer in the Netherlands -- 2.7.2 Current Population of Wolf in the Netherlands -- 2.7.3 Predator-Prey Relation Between Wolf and Red Deer -- 2.8 The Netherlands in 2120 -- 2.9 Change -- 2.10 Further Reading -- References -- Part I Animal Agents -- 3 Taking Animal Perspectives into Account in Animal Ethics -- 3.1 Introduction -- 3.2 Conceptualizing Animal Agency: Two Models -- 3.2.1 Propositional Agency -- 3.2.2 Materialist Agency -- 3.2.3 A Working Definition of Agency -- 3.3 Taking into Account Relational Agency in Animal Ethics on the Micro- and Macro Level -- 3.3.1 Relational Agency and Animal Ethics…”

Tabla de Contenidos: “…11.3.3 Applications on Hazardous Potential of WEEE Management and Recycling -- 11.4 Case Study -- 11.4.1 Goal and Scope Definition -- 11.4.1.1 Functional Unit -- 11.4.1.2 System Boundary -- 11.4.2 Life Cycle Inventory -- 11.4.2.1 Formal Collection -- 11.4.2.2 Informal Collection -- 11.4.2.3 Mechanical Dismantling -- 11.4.2.4 Plastic Recycling -- 11.4.2.5 Screen Glass Recycling -- 11.4.2.6 Battery Disposal -- 11.4.2.7 Electronic Refining for Materials -- 11.4.3 Life Cycle Impact Assessment -- 11.4.4 Results -- 11.4.4.1 Feature Phone Formal Collection Scenario -- 11.4.4.2 Feature Phone Informal Collection Scenario -- 11.4.4.3 Smartphone Formal Collection Scenario -- 11.4.4.4 Smartphone Informal Collection Scenario -- 11.4.5 Discussion -- 11.5 Conclusion -- References -- Chapter 12 Biodegradability and Compostability Aspects of Organic Electronic Materials and Devices -- 12.1 Introduction -- 12.1.1 Technological Innovation and Waste -- 12.1.2 Eco‐friendliness -- 12.1.3 Organic Electronics -- 12.1.4 Opportunities for Green Organic Electronics -- 12.2 State of the Art in Biodegradable Electronics -- 12.3 Organic Field‐Effect Transistors (OFETs) -- 12.3.1 Fundamentals -- 12.3.2 Anthraquinone, Benzoquinone, and Acenequinone -- 12.3.3 Quinacridones -- 12.4 Electrochemical Energy Storage -- 12.4.1 Quinones -- 12.4.2 Dopamine -- 12.4.3 Melanins -- 12.4.4 Tannins -- 12.4.5 Lignin -- 12.5 Biodegradation in Natural and Industrial Ecosystems -- 12.5.1 Degradation and Biodegradation -- 12.5.2 Composting Process -- 12.5.3 Materials Half‐Life Under Composting Conditions -- 12.5.4 Biodegradation in the Environment -- 12.6 Microbiome in Natural and Industrial Ecosystems -- 12.6.1 The Ruminant-Hay Natural Ecosystem -- 12.6.2 The Termite-Wood Natural Ecosystem -- 12.6.3 The Industrial Composter-Biowaste Ecosystem -- 12.6.3.1 Municipal Composting Facility…”

Tabla de Contenidos: “…#22 Make Work Fun -- #23 Put Your Money Where Your Mouth Is -- #24 Teach Your Team to Speak Up -- #25 Let Your Team Do the Problem-Solving -- #26 Trust Your People and Empower Them to Make an Impact -- #27 Don't Strip Your People of Their Decision-Making Powers -- #28 Speed to Decision Is a Competitive Advantage for Your Team -- #29 Great Leaders Do Whatever It Takes to Improve the Performance of Their Team Members -- #30 Success Leaves Secrets -- Month 5 Prioritizing Tasks, Diagnosing Issues, and Taking Action -- #1 It's Either a "Hell Yes" or a "Hell No" -- #2 Share the Company's Priorities with Your Team -- #3 Map Out the Best Path for Your Destination Point -- #4 Every First Week of the Month, Clean Up Your Pipeline -- #5 Direction &gt -- Speed -- #6 Teach Your Team to Do the Things They Need to Do -- #7 Make Your Team a Meritocracy -- #8 Know the Four Key Pillars for the Business Unit -- #9 Prioritize Tasks and Projects -- #10 Break Down Large, Hairy Objectives into Small, Doable Tasks -- #11 Work the Deals That Are Likely to Close First -- #12 Create a Game Plan the Night Before -- #13 Constantly Coach -- #14 Host Effective Team Meetings with Everyone -- #15 No Meeting Should Last Longer Than 30 Minutes -- #16 Ask Better Questions -- #17 Learn Fast and Fail Fast -- #18 Make Sure Your Reps Take Responsibility for Training -- #19 Get Great Trainers and Support Them -- #20 Get Paid or Pay for It -- #21 Coach Your Team on Specific Tasks -- #22 Work Where You Can Have the Biggest Impact -- #23 Big Goals Require Big Resources -- #24 Give Your Team a Head Start -- #25 Cut Timelines for Projects in Half -- #26 Work Hard on the Right Things vs. the Wrong Things -- #27 Find the Balance Between Helping Others and Maintaining Your Goals -- #28 Squeeze the Urgency with Your Team -- #29 Look to New Employees for Fresh Ideas…”

Tabla de Contenidos: “…Kinetic mechanism of the reductive half of reaction catalysed by sailcylate hydroxylase / The pH dependence of enzyme-phenol complexes of phenol hydroxylase / Differential induction and characterization of flavoprotein hydroxylases in Pseudomonas cepacia / Steroid monoxygenase from Cylindrocarpon radicicola. …”

Tabla de Contenidos: “…11.3 DC-Link Capacitors Voltage Balancing in Diode-Clamped Converter 334 -- 11.4 Control Algorithms for AC / DC / AC Converters 345 -- 11.5 AC / DC / AC Converter with Active Power FeedForward 356 -- 11.6 Summary and Conclusions 361 -- References 362 -- 12 Power Electronics for More Electric Aircraft 365 -- 12.1 Introduction 365 -- 12.2 More Electric Aircraft 367 -- 12.3 More Electric Engine (MEE) 372 -- 12.4 Electric Power Generation Strategies 374 -- 12.5 Power Electronics and Power Conversion 378 -- 12.6 Power Distribution 381 -- 12.7 Conclusions 384 -- References 385 -- 13 Electric and Plug-In Hybrid Electric Vehicles 387 -- 13.1 Introduction 387 -- 13.2 Electric, Hybrid Electric and Plug-In Hybrid Electric Vehicle Topologies 388 -- 13.3 EV and PHEV Charging Infrastructures 392 -- 13.4 Power Electronics for EV and PHEV Charging Infrastructure 404 -- 13.5 Vehicle-to-Grid (V2G) and Vehicle-to-Home (V2H) Concepts 407 -- 13.6 Power Electronics for PEV Charging 410 -- References 419 -- 14 Multilevel Converter/Inverter Topologies and Applications 422 -- 14.1 Introduction 422 -- 14.2 Fundamentals of Multilevel Converters/Inverters 423 -- 14.3 Cascaded Multilevel Inverters and Their Applications 432 -- 14.4 Emerging Applications and Discussions 444 -- 14.5 Summary 459 -- Acknowledgment 461 -- References 461 -- 15 Multiphase Matrix Converter Topologies and Control 463 -- 15.1 Introduction 463 -- 15.2 Three-Phase Input with Five-Phase Output Matrix Converter 464 -- 15.3 Simulation and Experimental Results 484 -- 15.4 Matrix Converter with Five-Phase Input and Three-Phase Output 488 -- 15.5 Sample Results 499 -- Acknowledgment 501 -- References 501 -- 16 Boost Preregulators for Power Factor Correction in Single-Phase Rectifiers 503 -- 16.1 Introduction 503 -- 16.2 Basic Boost PFC 504 -- 16.3 Half-Bridge Asymmetric Boost PFC 511 -- 16.4 Interleaved Dual-Boost PFC 519 -- 16.5 Conclusion 528 -- References 529 -- 17 Active Power Filter 534 -- 17.1 Introduction 534 -- 17.2 Harmonics 535.…”

Tabla de Contenidos: “…7.3.1 Electromagnetic Launchers -- 7.3.2 Hybrid-Powered Ships -- 7.3.3 Aircraft Applications -- 7.3.4 Dismounted Soldier Applications -- 7.4 Ruggedness Issues -- References -- Further Reading -- Chapter 8 Diagnostics, Prognostics, Reliability, EMC, and Other Topics Related to HEVs -- 8.1 Diagnostics and Prognostics in HEVs and EVs -- 8.1.1 Onboard Diagnostics -- 8.1.2 Prognostics Issues -- 8.2 Reliability of HEVs -- 8.2.1 Analyzing the Reliability of HEV Architectures -- 8.2.2 Reliability and Graceful Degradation -- 8.2.3 Software Reliability Issues -- 8.3 Electromagnetic Compatibility (EMC) Issues -- 8.4 Noise Vibration Harshness (NVH), Electromechanical, and Other Issues -- 8.5 End-of-Life Issues -- References -- Further Reading -- Chapter 9 Power Electronics in HEVs -- 9.1 Introduction -- 9.2 Principles of Power Electronics -- 9.3 Rectifiers Used in HEVs -- 9.3.1 Ideal Rectifier -- 9.3.2 Practical Rectifier -- 9.3.3 Single-Phase Rectifier -- 9.3.4 Voltage Ripple -- 9.4 Buck Converter Used in HEVs -- 9.4.1 Operating Principle -- 9.4.2 Nonlinear Model -- 9.5 Non-Isolated Bidirectional DC-DC Converter -- 9.5.1 Operating Principle -- 9.5.2 Maintaining Constant Torque Range and Power Capability -- 9.5.3 Reducing Current Ripple in the Battery -- 9.5.4 Regenerative Braking -- 9.6 Voltage Source Inverter -- 9.7 Current Source Inverter -- 9.8 Isolated Bidirectional DC-DC Converter -- 9.8.1 Basic Principle and Steady State Operations -- 9.8.1.1 Heavy Load Conditions -- 9.8.1.2 Light Load Condition -- 9.8.1.3 Output Voltage -- 9.8.1.4 Output Power -- 9.8.2 Voltage Ripple -- 9.9 PWM Rectifier in HEVs -- 9.9.1 Rectifier Operation of Inverter -- 9.10 EV and PHEV Battery Chargers -- 9.10.1 Forward/Flyback Converters -- 9.10.2 Half-Bridge DC-DC Converter -- 9.10.3 Full-Bridge DC-DC Converter -- 9.10.4 Power Factor Correction Stage…”

Tabla de Contenidos: “…20 The Radio Propagation Environment 437 / Juha Ylitalo and Tommi Jämsä -- 20.1 Introduction 437 -- 20.2 SISO and SIMO Channel Models 438 -- 20.3 MIMO Channel Models 441 -- 20.4 Radio Channel Implementation for Conformance Testing 454 -- 20.5 Concluding Remarks 455 -- References 455 -- 21 Radio Frequency Aspects 457 / Moray Rumney, Takaharu Nakamura, Stefania Sesia, Tony Sayers and Adrian Payne -- 21.1 Introduction 457 -- 21.2 Frequency Bands and Arrangements 459 -- 21.3 Transmitter RF Requirements 462 -- 21.4 Receiver RF Requirements 474 -- 21.5 RF Impairments 492 -- 21.6 Summary 500 -- References 501 -- 22 Radio Resource Management 503 / Muhammad Kazmi -- 22.1 Introduction 503 -- 22.2 Cell Search Performance 505 -- 22.3 Mobility Measurements 513 -- 22.4 UE Measurement Reporting Mechanisms and Requirements 516 -- 22.5 Mobility Performance 518 -- 22.6 RRC Connection Mobility Control Performance 525 -- 22.7 Radio Link Monitoring Performance 526 -- 22.8 Concluding Remarks 528 -- References 529 -- 23 Paired and Unpaired Spectrum 531 / Nicholas Anderson -- 23.1 Introduction 531 -- 23.2 Duplex Modes 532 -- 23.3 Interference Issues in Unpaired Spectrum 533 -- 23.4 Half-Duplex System Design Aspects 544 -- 23.5 Reciprocity 552 -- 24 Picocells, Femtocells and Home eNodeBs 563 / Philippe Godin and Nick Whinnett -- 24.1 Introduction 563 -- 24.2 Home eNodeB Architecture 564 -- 24.3 Interference Management for Femtocell Deployment 569 -- 24.4 RF Requirements for Small Cells 574 -- 24.5 Summary 580 -- References 580 -- 25 Self-Optimizing Networks 581 / Philippe Godin -- 25.1 Introduction 581 -- 25.2 Automatic Neighbour Relation Function (ANRF) 582 -- 25.3 Self-Configuration of eNodeB and MME 584 -- 25.4 Automatic Configuration of Physical Cell Identity 587 -- 25.5 Mobility Load Balancing Optimization 587 -- 25.6 Mobility Robustness Optimization 591 -- 25.7 Random Access CHannel (RACH) Self-Optimization 595 -- 25.8 Energy Saving 596 -- 25.9 Emerging New SON Use Cases 597.…”

Tabla de Contenidos: “…8.1.2 Angular Averaging -- 8.2 Radiation Stiffness and Coupling Loss Factors -- 8.2.1 Point Radiation Stiffness -- 8.2.2 Point Junctions -- 8.2.3 Area Radiation Stiffness -- 8.2.4 Area Junctions -- 8.2.5 Line Radiation Stiffness -- 8.2.6 Line Junctions -- 8.2.7 Summary -- Bibliography -- 9 Deterministic Applications -- 9.1 Acoustic One-Dimensional Elements -- 9.1.1 Transfer Matrix and Finite Element Convention -- 9.1.2 Acoustic One-Dimensional Networks -- 9.1.3 The Acoustic Pipe -- 9.1.4 Volumes and Closed Pipes -- 9.1.5 Limp Layer -- 9.1.6 Membranes -- 9.1.7 Perforated Sheets -- 9.1.8 Branch Lumped Elements -- 9.1.9 Boundary Conditions -- 9.1.10 Performance Indicators -- 9.2 Coupled One-Dimensional Systems -- 9.2.1 Change in Cross Section -- 9.2.2 Impedance Tube -- 9.2.3 Helmholtz Resonator -- 9.2.4 Quarter Wave Resonator -- 9.2.5 Muffler System -- 9.2.6 T-Joint -- 9.2.7 Conclusions of 1D-Systems -- 9.3 Infinite Layers -- 9.3.1 Plate Layer -- 9.3.2 Lumped Elements Layers -- 9.3.3 Fluid Layer -- 9.3.4 Equivalent Fluid - Fiber Material -- 9.3.5 Performance Indicators -- 9.3.6 Conclusions on Layer Formulation -- 9.4 Acoustic Absorber -- 9.4.1 Single Fiber Layer -- 9.4.2 Multiple Layer Absorbers -- 9.4.3 Absorber with Perforate -- 9.4.4 Single Degree of Freedom Liner -- 9.5 Acoustic Wall Constructions -- 9.5.1 Double Walls -- 9.5.2 Limp Double Walls with Fiber -- 9.5.3 Two Plates with Fiber -- 9.5.4 Conclusion on Double Walls -- Bibliography -- 10 Application of Random systems -- 10.1 Frequency Bands for SEA Simulation -- 10.2 Fluid Systems -- 10.2.1 Twin Chamber -- 10.3 Algorithms of SEA -- 10.4 Coupled Plate Systems -- 10.4.1 Two Coupled Plates -- 10.5 Fluid-Structure Coupled Systems -- 10.5.1 Twin Chamber -- 10.5.2 Noise Control Treatments -- 10.5.3 Transmission Loss of Trimmed Plate -- 10.5.4 Free Field Radiation into Half Space…”

Tabla de Contenidos: “…-- 15.1.2 Purpose of a Timer -- 15.1.3 Differences Between a Timer and a Counter -- 15.2 8051/52 Timers -- 15.3 Functioning of Timers 0 and 1 -- 15.3.1 Timer/Counter Select Block -- 15.3.2 Run/Stop Control Block -- 15.4 SFRs for Timer 0 and 1 Interrupts -- 15.4.1 TMOD -- 15.4.2 TCON (bits 4, 5, 6 and 7) -- 15.4.3 IE (bits 1, 3 and 7) -- 15.4.4 IP (bits 1 and 3) -- 15.4.5 TL0, TH0, TL1, TH1 -- 15.5 Interrupt Service Routines -- 15.5.1 Checklist for Timer 0 -- 15.5.2 Checklist for Timer 1 -- 15.6 Timer 2 -- 15.6.1 Similarities with Timers 0 and 1 -- 15.6.2 Differences with Timers 0 and 1 -- 15.6.3 Modes of Timer 2 -- 15.6.4 Functioning of Timer 2 -- 15.6.5 Timer 2 SFRs -- 15.6.6 Checklist for Timer 2 -- 15.7 Solved Examples -- Summary -- Points to Remember -- Review Questions -- Evaluate Yourself -- Search for Answers -- Think and Solve -- Chapter 16 : Serial Communication and Serial Interrupts -- Chapter Objectives -- 16.1 Introduction -- 16.1.1 Serial and Parallel Communications -- 16.1.2 Simplex, Full-Duplex and Half-Duplex Communications -- 16.1.3 Synchronous and Asynchronous Communications -- 16.2 Overview of Serial Communication -- 16.2.1 How Serial Communication Works -- 16.2.2 Serial Data Format -- 16.2.3 Baud Rate -- 16.3 Serial Communication SFRs -- 16.3.1 SBUF -- 16.3.2 SCON -- 16.3.3 PCON -- 16.4 Modes of Serial Communication -- 16.4.1 Mode 0 (Shift Register Mode) -- 16.4.2 Mode 1 (8-bit UART) -- 16.4.3 Mode 2 (9-bit UART with Fixed Baud Rate)…”

“…Example works in the risk assessment area include modeling risk probability distribution over given areas, considering hazmat types and transport modes, and environmental conditions. The first half of this handbook covers the two fields of risk assessment and shipment planning, while the second half of this handbook provides useful models and insights on other important issues including location problems for undesirable facilities, network interdiction, terrorist attack, and evacuation…”

“…The results of quantile regressions show a wage penalty in the lower half of the distribution and no gap in the upper half for informal employees. …”

“…Considering these contradictory developments, Herbert tackles the questions of both the collapse in the first half of the century and the development from a post-fascist, ruined society to one of the most stable liberal democracies in the world in the latter half. …”

“…In the book's second half, the author examines cultural texts that challenge this limited horizon and forge alternative ways of representing traumatic histories. …”

“…The reviewers are selected from a broad range of expertise with half from the multimedia community and the other half from the HCI community. …”

Tabla de Contenidos: “…Penttinen -- 11.1 Introduction 281 -- 11.2 Development of GSM 281 -- 11.3 Specification of GSM 285 -- 11.4 Architecture of GSM 286 -- 11.5 Functionality of GSM 294 -- 11.6 Numbering of GSM 303 -- 11.7 GSM Data 308 -- 11.8 Dual Half Rate 317 -- 11.9 DFCA 341 -- 11.10 EDGE 349 -- 11.11 DLDC 354 -- 11.12 EDGE2 366 -- References 367 -- 12 3GPP Mobile Communications: WCDMA and HSPA 371 /Patrick Marsch, Michat Maternia, Michal Panek, Ali Yaver, Ryszard Dokuczat and Rybakowski Marcin -- 12.1 Network Architecture 371 -- 12.2 Physical Layer Aspects 376 -- 12.3 Radio Interface Procedures 387 -- 12.4 WCDMA/HSPA Evolution since Release 5 402 -- 12.5 Planning and Dimensioning of WCDMA/HSPA Networks 410.…”