Tabla de Contenidos: “…Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Additional contributors to this redbook -- Become a published author -- Comments welcome -- Part 1 Introduction -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Chapter 1. …”

Tabla de Contenidos: “…Front Cover -- OCUP 2 Certification Guide -- Copyright Page -- Contents -- Foreword -- Acknowledgments -- Discount Information -- 1 What is OCUP 2? …”

Tabla de Contenidos: “…Front Cover -- Three-Dimensional Integrated Circuit Design -- Copyright Page -- Dedication -- Contents -- List of Figures -- About the Authors -- Preface to the Second Edition -- Preface to the First Edition -- Acknowledgments -- Organization of the Book -- 1 Introduction -- 1.1 Interconnect Issues in Integrated Systems -- 1.2 Three-Dimensional or Vertical Integration -- 1.2.1 Opportunities for Three-Dimensional Integration -- 1.2.2 Challenges of Three-Dimensional Integration -- 1.2.2.1 Technological/manufacturing limitations -- 1.2.2.2 Testing -- 1.2.2.3 Global interconnect design -- 1.2.2.4 Thermal issues -- 1.2.2.5 CAD algorithms and tools -- 1.3 Book Organization -- 2 Manufacturing of Three-Dimensional Packaged Systems -- 2.1 Stacking Methods for Transistors, Circuits, and Dies -- 2.1.1 System-in-Package -- 2.1.2 Transistor and Circuit Level Stacking -- 2.2 System-on-Package -- 2.3 Technologies for System-in-Package -- 2.3.1 Wire Bonded System-in-Package -- 2.3.2 Peripheral Vertical Interconnects -- 2.3.3 Area Array Vertical Interconnects -- 2.3.4 Metalizing the Walls of an SiP -- 2.4 Technologies for 2.5-D Integration -- 2.4.1 Interposer Materials -- 2.4.2 Metallization Processes -- 2.4.3 Vertical Interconnects -- 2.5 Summary -- 3 Manufacturing Technologies for Three-Dimensional Integrated Circuits -- 3.1 Monolithic Three-Dimensional ICs -- 3.1.1 Laser Crystallization -- 3.1.2 Seed Crystallization -- 3.1.3 Double-Gate Metal Oxide Semiconductor Field Effect Transistors for Stacked Three-Dimensional ICs -- 3.1.4 Molecular Bonding -- 3.2 Three-Dimensional ICs with Through Silicon Via or Intertier Via -- 3.2.1 Wafer Level Integration -- 3.2.2 Die-to-Die Integration -- 3.2.3 Bonding of Three-Dimensional ICs -- 3.3 Contactless Three-Dimensional ICs -- 3.3.1 Capacitively Coupled Three-Dimensional ICs…”

Tabla de Contenidos: “…Front Cover -- Metaheuristic Optimization Algorithms -- Copyright Page -- Contents -- List of contributors -- 1 Particle swarm optimization algorithm: review and applications -- 1.1 Introduction -- 1.2 Particle swarm optimization -- 1.2.1 Standard particle swarm optimization -- 1.2.2 Particle swarm optimization algorithm -- 1.3 Related works -- 1.3.1 Neural networks -- 1.3.2 Feature selection -- 1.3.3 Data clustering -- 1.3.4 Mobile robots -- 1.4 Discussion -- 1.5 Conclusion -- References -- 2 Social spider optimization algorithm: survey and new applications -- 2.1 Introduction -- 2.2 Related work -- 2.2.1 Medical field -- 2.2.2 Engineering field -- 2.2.3 Mathematics field -- 2.2.4 Artificial intelligence field -- 2.2.5 Data science -- 2.3 Social spider optimization method -- 2.4 Experiment result -- 2.5 Discussion -- 2.6 Conclusion -- References -- 3 Animal migration optimization algorithm: novel optimizer, analysis, and applications -- 3.1 Introduction -- 3.2 Animal migration optimization algorithm procedure -- 3.3 Related works -- 3.3.1 Image processing -- 3.3.2 Data clustering -- 3.3.3 Data mining -- 3.3.4 Benchmark functions -- 3.3.5 Computer networks -- 3.3.6 Neural networks -- 3.3.7 Other applications -- 3.4 Discussion -- 3.5 Conclusion -- References -- 4 A Survey of cuckoo search algorithm: optimizer and new applications -- 4.1 Introduction -- 4.2 Cuckoo search algorithm -- 4.2.1 Cuckoo rearing conduct -- 4.2.2 Lévy trips in nature -- 4.3 Related works -- 4.4 Method -- 4.5 Discussion -- 4.6 Advanced work -- 4.7 Conclusion -- References -- 5 Teaching-learning-based optimization algorithm: analysis study and its application -- 5.1 Introduction -- 5.2 Teaching-learning-based optimization -- 5.2.1 Teacher section -- 5.2.2 Learner section -- 5.3 Literature review -- 5.3.1 Optimization problem -- 5.3.2 Technoeconomic analysis…”

Tabla de Contenidos: “…Front cover -- Contents -- Figures -- Tables -- Examples -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Part 1 Highly available clusters with IBM Tivoli Storage Manager -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Figures -- Tables -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Summary of changes -- October 2003, Second Edition -- Part 1 Introduction -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Figures -- Tables -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team that wrote this book -- Become a published author -- Comments welcome -- Part 1 Implementing a BI solution framework -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Notice -- Become a published author -- Comments welcome -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team who wrote this redbook -- Become a published author -- Comments welcome -- Part 1 Integrated Runtime V1.1 -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Tables -- Figures -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Part 1 Description of the DCE replacement strategies -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Part 1 Introduction to Domino Web Access 6.5 -- Chapter 1. …”

Tabla de Contenidos: “…Front cover -- Contents -- Figures -- Notices -- Trademarks -- Preface -- The team that wrote this redbook -- Become a published author -- Comments welcome -- Chapter 1. …”

Tabla de Contenidos: “…Signal Propagation and Channel Model 95 -- 5.1 Introduction 95 -- 5.2 Wireless Channel Propagation 96 -- 5.2.1 Path Loss and Shadowing 96 -- 5.2.2 Multipath Fading 97 -- 5.2.3 Multipath Channel Parameters 98 -- 5.2.4 MIMO Channel 104 -- 5.3 Front-End Electronics Effects 105 -- 5.3.1 Carrier Frequency Offset 105 -- 5.3.2 Sampling Clock Offset 106 -- 5.3.3 Phase Noise 106 -- 5.3.4 IQ Imbalance and DC Offset 107 -- 5.3.5 Power Amplifier Nonlinearity 110 -- 5.4 Channel Model 111 -- 5.4.1 Model for Front-End Impairments 112 -- 5.4.2 Multipath Rayleigh Fader Model 113 -- 5.4.3 Channel Models Used in Standards 116 -- Summary 122 -- References 123 -- PART TWO: MIMO-OFDM RECEIVER PROCESSING -- 6. …”

Tabla de Contenidos: “…Front Cover -- Human Interaction with Electromagnetic Fields -- Copyright -- Contents -- About the authors -- Preface -- 1 On Exposure of Humans to Electromagnetic Fields - General Considerations -- 1.1 General Considerations -- 1.1.1 Environmental Electromagnetic Fields -- 1.1.1.1 Static Fields -- 1.1.1.2 Time-Varying Fields -- 1.1.2 Human Exposure to Undesired Radiation -- 1.1.3 Biomedical Applications of Electromagnetics Fields -- 1.2 Coupling Mechanisms and Biological Effects -- 1.2.1 Coupling to Static Fields -- 1.2.1.1 Coupling to Static Magnetic Fields -- 1.2.1.2 Coupling to Static Electric Fields -- 1.2.2 Coupling to Time-Varying Fields -- 1.2.2.1 Coupling to LF Electric Fields -- 1.2.2.2 Coupling to LF Magnetic Fields -- 1.2.2.3 Absorption of Energy From Electromagnetic Radiation -- 1.2.2.4 Indirect Coupling -- 1.2.3 Biological Effects -- 1.2.3.1 Biological Effects of Static Magnetic Fields -- 1.2.3.2 Biological Effects of LF Fields -- 1.2.3.3 Biological Effects of HF Radiation -- 1.2.3.4 Electromagnetic Fields and Cancer -- 1.3 Safety Guidelines and Exposure Limits -- 1.3.1 EMF Standards -- 1.3.2 ICNIRP Guidelines -- 1.3.3 IEEE Standards -- 1.3.4 Directive 2013/35/EU -- 1.4 A Note on Electromagnetic and Thermal Dosimetry -- 1.4.1 Exposure to LF Fields -- 1.4.2 Exposure to HF Fields -- 1.4.3 Exposure to Transients -- 1.4.4 Stochastic Modeling -- References -- 2 Theoretical Background: an Outline of Computational Electromagnetics (CEM) -- 2.1 Fundamentals of Computational Electromagnetics -- 2.1.1 An Outline of Classical Electromagnetic Field Theory -- 2.1.2 Maxwell's Equations - Differential and Integral Form -- 2.1.3 The Continuity Equation -- 2.1.4 Conservation of Electromagnetic Energy - Poynting Theorem -- 2.1.5 Electromagnetic Wave Equations -- 2.1.6 Electromagnetic Potentials -- 2.1.7 Plane Wave Propagation…”

Tabla de Contenidos: “…Intro -- Blockchain in Action -- Copyright -- dedication -- brief contents -- contents -- front matter -- Preface -- Acknowledgments -- About this book -- Who should read this book -- How this book is organized: A roadmap -- About the code -- liveBook discussion forum -- Other online resources -- About the author -- About the cover illustration -- Part 1. …”

Tabla de Contenidos: “…Front Cover -- International Futures: Building and Using Global Models -- Copyright -- Contents -- Prologue -- Glossary I: Model Acronyms and Abbreviations -- Glossary II: Modeling-Related Concepts, Tools, and Databases -- Glossary III: Organizations, Projects, and Teams -- Chapter 1: Introduction -- 1.1. …”