Mostrando 15,381 - 15,400 Resultados de 15,584 Para Buscar '"The First Edition"', tiempo de consulta: 0.15s Limitar resultados
  1. 15381
    Publicado 2016
    Libro electrónico
  2. 15382
    Publicado 2022
    Libro electrónico
  3. 15383
    Publicado 2025
    Libro electrónico
  4. 15384
    Publicado 2024
    Libro electrónico
  5. 15385
    Publicado 2024
    Libro electrónico
  6. 15386
    Publicado 2024
    Libro electrónico
  7. 15387
    Publicado 2024
    Libro electrónico
  8. 15388
    Publicado 2025
    Libro electrónico
  9. 15389
    Publicado 2025
    Tabla de Contenidos: “…Cover -- Half Title -- Title Page -- Copyright Page -- Dedication -- Table of Contents -- Preface to the Third Edition -- Preface to the Second Edition -- Preface to the First Edition -- Acknowledgments -- Authors -- Chapter 1 Fundamentals of Remote Sensing -- 1.1 Introduction to Remote Sensing -- 1.1.1 Atmospheric Interactions -- 1.1.2 Reflectance Properties of Surface Materials -- 1.1.3 Spatial, Spectral, and Radiometric Resolution -- 1.1.4 Scale Issues in Remote Sensing -- 1.2 Optical Remote Sensing Systems -- 1.3 Atmospheric Correction -- 1.3.1 Dark Object Subtraction -- 1.3.2 Modeling Techniques -- 1.3.2.1 Modeling the Atmospheric Effect -- 1.3.2.2 Steps in Atmospheric Correction -- 1.4 Correction for Topographic Effects -- 1.5 Remote Sensing in the Microwave Region -- 1.6 Radar Fundamentals -- 1.6.1 SLAR Image Resolution -- 1.6.2 Geometric Effects on Radar Images -- 1.6.3 Factors Affecting Radar Backscatter -- 1.6.3.1 Surface Roughness -- 1.6.3.2 Surface Conductivity -- 1.6.3.3 Parameters of the Radar Equation -- 1.7 Imaging Radar Polarimetry -- 1.7.1 Radar Polarization State -- 1.7.2 Polarization Synthesis -- 1.7.3 Polarization Signatures -- 1.8 Radar Speckle Suppression -- 1.8.1 Multilook Processing -- 1.8.2 Filters for Speckle Suppression -- References -- Chapter 2 Pattern Recognition Principles -- 2.1 A Terminological Introduction -- 2.2 Taxonomy of Classification Techniques -- 2.3 Fundamental Pattern Recognition Techniques -- 2.3.1 Unsupervised Methods -- 2.3.1.1 The k-Means Algorithm -- 2.3.1.2 Fuzzy C-Means Clustering -- 2.3.2 Supervised Methods -- 2.3.2.1 Parallelepiped Method -- 2.3.2.2 Minimum Distance Classifier -- 2.3.2.3 Maximum Likelihood Classifier -- 2.3.2.4 Fuzzy Maximum Likelihood Classifier -- 2.4 Spectral Unmixing -- 2.5 Ensemble Classifiers -- 2.6 Incorporation of Ancillary Information…”
    Libro electrónico
  10. 15390
    Publicado 2017
    Tabla de Contenidos: “…Front Cover -- Three-Dimensional Integrated Circuit Design -- Copyright Page -- Dedication -- Contents -- List of Figures -- About the Authors -- Preface to the Second Edition -- Preface to the First Edition -- Acknowledgments -- Organization of the Book -- 1 Introduction -- 1.1 Interconnect Issues in Integrated Systems -- 1.2 Three-Dimensional or Vertical Integration -- 1.2.1 Opportunities for Three-Dimensional Integration -- 1.2.2 Challenges of Three-Dimensional Integration -- 1.2.2.1 Technological/manufacturing limitations -- 1.2.2.2 Testing -- 1.2.2.3 Global interconnect design -- 1.2.2.4 Thermal issues -- 1.2.2.5 CAD algorithms and tools -- 1.3 Book Organization -- 2 Manufacturing of Three-Dimensional Packaged Systems -- 2.1 Stacking Methods for Transistors, Circuits, and Dies -- 2.1.1 System-in-Package -- 2.1.2 Transistor and Circuit Level Stacking -- 2.2 System-on-Package -- 2.3 Technologies for System-in-Package -- 2.3.1 Wire Bonded System-in-Package -- 2.3.2 Peripheral Vertical Interconnects -- 2.3.3 Area Array Vertical Interconnects -- 2.3.4 Metalizing the Walls of an SiP -- 2.4 Technologies for 2.5-D Integration -- 2.4.1 Interposer Materials -- 2.4.2 Metallization Processes -- 2.4.3 Vertical Interconnects -- 2.5 Summary -- 3 Manufacturing Technologies for Three-Dimensional Integrated Circuits -- 3.1 Monolithic Three-Dimensional ICs -- 3.1.1 Laser Crystallization -- 3.1.2 Seed Crystallization -- 3.1.3 Double-Gate Metal Oxide Semiconductor Field Effect Transistors for Stacked Three-Dimensional ICs -- 3.1.4 Molecular Bonding -- 3.2 Three-Dimensional ICs with Through Silicon Via or Intertier Via -- 3.2.1 Wafer Level Integration -- 3.2.2 Die-to-Die Integration -- 3.2.3 Bonding of Three-Dimensional ICs -- 3.3 Contactless Three-Dimensional ICs -- 3.3.1 Capacitively Coupled Three-Dimensional ICs…”
    Libro electrónico
  11. 15391
    Publicado 2022
    Libro electrónico
  12. 15392
    Publicado 2024
    Libro electrónico
  13. 15393
    Publicado 2020
    Tabla de Contenidos: “…Cover -- Half Title -- Series Page -- Title Page -- Copyright Page -- Dedication -- Contents -- Foreword -- Preface -- Preface to the First Edition -- Introduction -- Authors -- List of Symbols and Abbreviations -- Part I: Introduction to Images and Computing using Python -- 1. …”
    Libro electrónico
  14. 15394
    Publicado 2019
    Libro electrónico
  15. 15395
    Publicado 2019
    Libro electrónico
  16. 15396
    Publicado 2021
    Libro electrónico
  17. 15397
    Publicado 2023
    Libro electrónico
  18. 15398
    por Lakner, Gary
    Publicado 2004
    Libro electrónico
  19. 15399
    Publicado 2024
    “…Scott Kelby, the world's #1 best-selling photography technique books author, is back with a totally updated and revised new edition of his bestselling book How Do I Do That In Photoshop? The first edition of this bestselling book presented an entirely new concept in Photoshop books--one that's designed from the ground up to get you straight to whatever it is you need to do in Photoshop right now, get your answer fast, and get you back to editing your images in Photoshop. …”
    Libro electrónico
  20. 15400
    Publicado 2023
    Libro electrónico