Tabla de Contenidos: “…Bipolar junction transistor (BJT) -- 2.6.2. Metal oxide semiconductor field effect transistor (MOSFET) -- 2.6.3. …”

Tabla de Contenidos: “…Cover -- Inside Front Cover -- Title Page -- Copyright Page -- Dedication -- Contents -- Foreword -- Preface -- About the Author -- Part One Introduction -- Chapter 1 Basic Concepts and Computer Evolution -- 1.1 Organization and Architecture -- 1.2 Structure and Function -- 1.3 A Brief History of Computers -- 1.4 The Evolution of the Intel x86 Architecture -- 1.5 Embedded Systems -- 1.6 Arm Architecture -- 1.7 Cloud Computing -- 1.8 Key Terms, Review Questions, and Problems -- Chapter 2 Performance Issues -- 2.1 Designing for Performance -- 2.2 Multicore, Mics, and Gpgpus -- 2.3 Two Laws that Provide Insight: Ahmdahl's Law and Little's Law -- 2.4 Basic Measures of Computer Performance -- 2.5 Calculating the Mean -- 2.6 Benchmarks and Spec -- 2.7 Key Terms, Review Questions, and Problems -- Part Two The Computer System -- Chapter 3 A Top- Level View of Computer Function and Interconnection -- 3.1 Computer Components -- 3.2 Computer Function -- 3.3 Interconnection Structures -- 3.4 Bus Interconnection -- 3.5 Point-to-Point Interconnect -- 3.6 Pci Express -- 3.7 Key Terms, Review Questions, and Problems -- Chapter 4 Cache Memory -- 4.1 Computer Memory System Overview -- 4.2 Cache Memory Principles -- 4.3 Elements of Cache Design -- 4.4 Pentium 4 Cache Organization -- 4.5 Key Terms, Review Questions, and Problems -- Appendix 4A Performance Characteristics of Two- Level Memories -- Chapter 5 Internal Memory -- 5.1 Semiconductor Main Memory -- 5.2 Error Correction -- 5.3 DDR Dram -- 5.4 Flash Memory -- 5.5 Newer Nonvolatile Solid-State Memory Technologies -- 5.6 Key Terms, Review Questions, and Problems -- Chapter 6 External Memory -- 6.1 Magnetic Disk -- 6.2 Raid -- 6.3 Solid State Drives -- 6.4 Optical Memory -- 6.5 Magnetic Tape -- 6.6 Key Terms, Review Questions, and Problems -- Chapter 7 Input/Output -- 7.1 External Devices -- 7.2 I/O Modules…”

Tabla de Contenidos: “…-- Electricity Versus Electronics -- THE PAINFUL TRUTH -- Cell Phone -- Computers -- Robots -- 2 - Electronic Concepts: More Interesting Than You Think: Some Basic Stuff You Really Need to Know -- INTRODUCTION -- ELECTRICITY AND ELECTRONICS -- Atoms and Electrons -- Charge, Voltage, and Current -- Dynamic Electricity and Current Flow -- Direction of Current Flow -- Conductors, Insulators, and Semiconductors -- MAGNETISM -- Magnetic Fields -- Electromagnetism -- Electromagnetic Induction -- VOLTAGE SOURCES -- Direct Current Voltages -- Alternating Current Voltages -- PRACTICAL DIRECT CURRENT AND ALTERNATING CURRENT VOLTAGE SOURCES -- Direct Current Voltage Sources -- Fuel Cell -- Alternating Current Voltage Sources -- Analog and Digital Signals -- Fourier Theory and the Frequency Domain -- 3 - The Systems Versus Components View of Electronics: A Fresh New Way to Learn About Electronics -- A Fresh New Way to Learn About Electronics -- INTRODUCTION -- WHY SYSTEMS AND NOT CIRCUITS? …”

Tabla de Contenidos: “…JUNTURAS ÓPTICAS EN SEMICONDUCTORES -- 7.3. EMISORES ÓPTICOS USADOS EN SISTEMAS DE F.O -- 7.3.1. …”

Tabla de Contenidos: “…-- Behaving differently depending on frequency -- Uses for Inductors -- Using Inductors in Circuits -- Reading inductance values -- Combining shielded inductors -- Tuning in to Radio Broadcasts -- Resonating with RLC circuits -- Ensuring rock‐solid resonance with crystals -- Influencing the Coil Next Door: Transformers -- Letting unshielded coils interact -- Isolating circuits from a power source -- Stepping up, stepping down voltages -- Chapter 9 Diving into Diodes -- Are We Conducting or Aren't We? -- Sizing up semiconductors -- Creating N‐types and P‐types -- Joining N‐types and P‐types to create components -- Forming a Junction Diode -- Biasing the diode -- Conducting current through a diode -- Rating your diode -- Identifying with diodes -- Which end is up? …”

Tabla de Contenidos: “…Resistor Noise -- 14.1.2. Semiconductor Noise -- 14.2. Total Noise Contributions -- 14.3. …”

Tabla de Contenidos: “…Chemical reactions -- OXO salts -- Halides -- Flame colour of Alkali metals -- Alkali metals and liquid NH3 -- Anomalous behaviour of Li -- Chapter 11: Group - 2(IIA) [Be, Mg, Ca, Sr, Ba, Ra] -- Properties which decrease down the group -- Properties which increase down the group -- Oxidation states and nature of bond -- Hydrides -- Halides -- Oxides and Hydroxides -- Oxo salts -- Flame colouration by Ca, Sr and Ba -- Chapter 12: Group - 11(IIB) Cu, Ag, Au -- Metallic bond strength -- Sublimation energy -- Atomic and ionic radii -- Ionization energy -- Noble metal nature -- Malleability, Thermal and Electrical Conductivities -- Oxidation states -- Magnetic properties -- Colour of compounds -- Solubility of Silver-Halides -- Chemistry of Photography -- Chapter 13: Group - 12(IIB) Zn, Cd, Hg -- Ionization energy -- Oxidation states -- Nature of bonds -- Electrode potential -- Magnetic properties -- Colour of compounds -- Some useful compounds -- Biochemistry of Zn, Cd and Hg -- Chapter 14: Group - 13 (IIIA) B, Al, Ga, In, Td -- Oxidation states and nature of bond -- Hydrides -- Diborane (B2H6) -- Structure of B2H6 -- Borazole (B2N3H6) -- Boric Acid -- Halides -- Lewis Acid strength of BX3 -- Alums -- Isolation of B -- Crystalline B -- Chapter 15: Group - 14(IVA) C, Si, Ge, Sn, Pb -- Catenation -- Allotropy and Structure -- Graphite -- Diamond -- Fullerenes -- Semiconductor property of Si and Ge -- Physical properties of group - 14 elements -- Oxidation states and Bonding -- Carbides -- Oxides -- Cyanogens (CN)2 -- Hydrogen cyanide (HCN) -- Cyanides (CN-) -- Halides -- Hydrides -- Silicones -- Silicates -- Isolation of Si -- Chapter 16: Group - 15(VA) N, P, As, Sb, Bi -- Allotropes of P -- Oxidation state and nature of bond -- Hydrides -- Ammonia NH3 -- Phosphine PH3 -- Oxides of N and P -- Dinitrogen oxide (or nitrous oxide) N2O -- Nitric oxide (NO)…”

Tabla de Contenidos: “…PREFACE xi ACKNOWLEDGMENTS xiii FOREWORD xv CHAPTER 1 INTRODUCTION 1 1.1 Introduction 1 Bibliography 4 CHAPTER 2 ELECTRIC NETWORK ANALYSIS IN ENERGY PROCESSING AND SMART GRID 5 2.1 Introduction 5 2.2 Complex Power Concepts 5 2.3 Review of AC-Circuit Analysis Using Phasor Diagrams 8 2.4 Polyphase Systems 9 2.5 Three-Phase Loads with Impedence Loads 13 2.6 Transformation of Y to Delta and Delta to Y 17 2.7 Summary of Phase and Line Voltages/Currents for Balanced Three-Phase Systems 19 2.8 Per-Unit Systems 22 2.9 Chapter Summary 27 Exercises 27 Bibliography 29 CHAPTER 3 MAGNETIC SYSTEMS FOR ENERGY PROCESSING 31 3.1 Introduction 31 3.2 Magnetic Fields 31 3.3 Equivalent Magnetic and Electric Circuits 34 3.4 Overview of Magnetic Materials 35 3.5 Hysteresis Loops and Hysteresis Losses in Ferromagnetic Materials 35 3.6 Definitions 38 3.7 Magnetic Circuit Losses 38 3.8 Producing Magnetic Flux in Air Gap 40 3.9 Rectangular-Shaped Magnetic Circuits 41 3.10 Chapter Summary 45 Exercises 45 Bibliography 47 CHAPTER 4 TRANSFORMERS 49 4.1 Introduction 49 4.2 First Two Maxwell's Laws 50 4.3 Transformers 51 4.4 Ideal Single-Phase Transformer Models 56 4.5 Modeling a Transformer into Equivalent Circuits 59 4.6 Transformer Testing 65 4.7 Transformer Specifications 71 4.8 Three-Phase Power Transformers 72 4.9 New Advances in Transformer Technology: Solid-State Transformers 72 4.10 Chapter Summary 78 Exercises 78 Bibliography 82 CHAPTER 5 INDUCTION MACHINES 83 5.1 Introduction 83 5.2 Construction and Types of Induction Motors 83 5.3 Operating Principle 85 5.4 Basic Induction-Motor Concepts 86 5.5 Induction-Motor Slip 88 5.6 Rotor Current and Leakage Reactance 88 5.7 Rotor Copper Loss 91 5.8 Developing the Equivalent Circuit of Polyphase, Wound-Rotor Induction Motors 92 5.9 Computing Corresponding Torque of Induction Motors 96 5.10 Approximation Model for Induction Machines 97 5.11 Speed Control of Induction Motors 100 5.12 Application of Induction Motors 101 5.13 induction-Generator Principles 101 5.14 Chapter Summary 103 Exercises 104 Bibliography 106 CHAPTER 6 SYNCHRONOUS MACHINES 107 6.1 Introduction 107 6.2 Synchronous-Generator Construction 107 6.3 Exciters 108 6.4 Governors 110 6.5 Synchronous Generator Operating Principle 110 6.6 Equivalent Circuit of Synchronous Machines 112 6.7 Synchronous Generator Equivalent Circuits 113 6.8 Over Excitation and Under Excitation 114 6.9 Open-Circuit and Short-Circuit Characteristics 115 6.10 Performance Characteristics of Synchronous Machines 118 6.11 Generator Compounding Curve 122 6.12 Synchronous Generator Operating Alone: Concept of Infinite Bus 122 6.13 Initial Elementary Facts about Synchronous Machines 123 6.14 Cylindrical-Rotor Machines for Turbo Generators 125 6.15 Synchronous Machines with Effects of Saliency: Two-Reactance Theory 125 6.16 The Salient-Pole Machine 126 6.17 Synchronous Motors 128 6.18 Synchronous Machines and System Stability 131 6.19 Chapter Summary 135 Exercises 136 Bibliography 137 CHAPTER 7 DC MACHINES 139 7.1 Introduction 139 7.2 Conductor Moving in a Uniform Magnetic Field 139 7.3 Current-Carrying Conductor in a Uniform Magnetic Field 139 7.4 DC-Machine Construction and Nameplate Parameters 141 7.5 DC Machine Pertinent Nameplate Parameters 142 7.6 Development and Configuration of Equivalent Circuits of DC Machines 142 7.7 Classification of DC Machines 147 7.8 Voltage Regulation 151 7.9 Power Computation for DC Machines 151 7.10 Power Flow and Efficiency 152 7.11 DC Motors 155 7.12 Computation of Speed of DC Motors 155 7.13 DC-Machine Speed-Control Methods 163 7.14 Ward Leonard System 164 7.15 Chapter Summary 166 Exercises 167 Bibliography 168 CHAPTER 8 PERMANENT-MAGNET MOTORS 169 8.1 Introduction 169 8.2 Permanent-Magnet DC Motors 169 8.3 Permanent-Magnet Synchronous Motors 177 8.4 Variants of Permanent-Magnet Synchronous Motors 186 8.5 Chapter Summary 190 Bibliography 190 CHAPTER 9 RENEWABLE ENERGY RESOURCES 193 9.1 Introduction 193 9.2 Distributed Generation Concepts 193 9.3 DG Benefits 194 9.4 Working Definitions and Classifications of Renewable Energy 195 9.5 Renewable-Energy Penetration 218 9.6 Maximum Penetration Limits of Renewable-Energy Resources 218 9.7 Constraints to Implementation of Renewable Energy 219 Exercises 221 Bibliography 222 CHAPTER 10 STORAGE SYSTEMS IN THE SMART GRID 223 10.1 Introduction 223 10.2 Forms of Energy 223 10.3 Energy Storage Systems 223 10.4 Cost Benefits of Storage 239 10.5 Chapter Summary 244 Bibliography 244 CHAPTER 11 POWER ELECTRONICS 247 11.1 Introduction 247 11.2 Power Systems with Power Electronics Architecture 248 11.3 Elements of Power Electronics 249 11.4 Power Semiconductor Devices 249 11.5 Applications of Power Electronics Devices to Machine Control 276 11.6 Applications of Power Electronics Devices to Power System Devices 280 11.7 Applications of Power Electronics to Utility, Aerospace, and Shipping 281 11.8 Facts 282 11.9 Chapter Summary 286 Bibliography 287 CHAPTER 12 CONVERTERS AND INVERTERS 289 12.1 Introduction 289 12.2 Definitions 289 12.3 DC-DC Converters 290 12.4 Inverters 296 12.5 Rectifiers 301 12.6 Applications 312 12.7 Chapter Summary 320 Exercises 320 Bibliography 322 CHAPTER 13 MICROGRID APPLICATION DESIGN AND TECHNOLOGY 323 13.1 Introduction to Microgrids 323 13.2 Types of Microgrids 324 13.3 Microgrid Architecture 325 13.4 Modeling of a Microgrid 330 13.5 Chapter Summary 332 Bibliography 333 CHAPTER 14 MICROGRID OPERATIONAL MANAGEMENT 335 14.1 Perfomance Tools of a Microgrid 335 14.2 Microgrid Functions 337 14.3 IEEE Standards for Microgrids 344 14.4 Microgrid Benefits 346 14.5 Chapter Summary 349 Bibliography 349 CHAPTER 15 THE SMART GRID: AN INTRODUCTION 351 15.1 Evolution, Drivers, and the Need for Smart Grid 351 15.2 Comparison of Smart Grid with the Current Grid System 352 15.3 Architecture of a Smart Grid 353 15.4 Design for Smart-Grid Function for Bulk Power Systems 353 15.5 Smart-Grid Challenges 362 15.6 Design Structure and Procedure for Smart-Grid Best Practices 363 15.7 Chapter Summary 365 Bibliography 365 CHAPTER 16 SMART-GRID LAYERS AND CONTROL 367 16.1 Introduction 367 16.2 Controls for the Smart Grid 367 16.3 Layers of Smart Grid Within the Grid 373 16.4 Command, Control, and Communication Applications in Real Time 390 16.5 Hardware-in-the-Loop for Energy Processing and the Smart Grid 394 16.6 Evolution of Cyber-Physical Systems 394 16.7 Chapter Summary 396 Bibliography 397 CHAPTER 17 ENERGY PROCESSING AND SMART-GRID TEST BEDS 401 17.1 Introduction 401 17.2 Study of Available Test Beds for the Smart Grid 401 17.3 Smart Microgrid Test-Bed Design 403 17.4 Smart-Grid Test Beds 404 17.5 Smart-Grid Case Studies 405 17.6 Simulation Tools, Hardware, and Embedded Systems 408 17.7 Limitations of Existing Smart-Grid Test Beds 411 17.8 Chapter Summary 412 Bibliography 412 INDEX 415.…”

Tabla de Contenidos: “…6.5 Exceptions to the Octet Rule: Odd-Electron Species, Incomplete Octets, and Expanded Octets -- Odd-Electron Species -- Incomplete Octets -- Expanded Octets -- 6.6 Bond Energies and Bond Lengths -- Bond Energy -- Bond Length -- 6.7 VSEPR Theory: The Five Basic Shapes -- Two Electron Groups: Linear Geometry -- Three Electron Groups: Trigonal Planar Geometry -- Four Electron Groups: Tetrahedral Geometry -- Five Electron Groups: Trigonal Bipyramidal Geometry -- Six Electron Groups: Octahedral Geometry -- 6.8 VSEPR Theory: The Effect of Lone Pairs -- Four Electron Groups with Lone Pairs -- Five Electron Groups with Lone Pairs -- Six Electron Groups with Lone Pairs -- 6.9 VSEPR Theory: Predicting Molecular Geometries -- Representing Molecular Geometries on Paper -- Predicting the Shapes of Larger Molecules -- 6.10 Molecular Shape and Polarity -- Vector Addition -- REVIEW -- Self-Assessment Quiz -- Key Learning Outcomes -- Key Terms -- Key Concepts -- Key Equations and Relationships -- EXERCISES -- Review Questions -- Problems by Topic -- Cumulative Problems -- Challenge Problems -- Conceptual Problems -- Answers to Conceptual Connections -- 7 Chemical Bonding II: Valence Bond Theory and Molecular Orbital Theory -- 7.1 Oxygen: A Magnetic Liquid -- 7.2 Valence Bond Theory: Orbital Overlap as a Chemical Bond -- 7.3 Valence Bond Theory: Hybridization of Atomic Orbitals -- sp3 Hybridization -- sp2 Hybridization and Double Bonds -- sp Hybridization and Triple Bonds -- sp3d and sp3d2 Hybridization -- Writing Hybridization and Bonding Schemes -- 7.4 Molecular Orbital Theory: Electron Delocalization -- Linear Combination of Atomic Orbitals (LCAO) -- Second-Period Homonuclear Diatomic Molecules -- Second-Period Heteronuclear Diatomic Molecules -- 7.5 Molecular Orbital Theory: Polyatomic Molecules -- 7.6 Bonding in Metals and Semiconductors…”

“…Major subject is to investigate basic parameters in semiconductors, impurities in oxides and phase determination of minerals. …”

Tabla de Contenidos: “…10.3 Principle of Designing of PVE Systems for Solar-Driven Water Splitting -- 10.4 Development of PVE Systems for Solar-Driven Water Splitting -- 10.4.1 PVE Systems Based on Si PV Cells -- 10.4.2 PVE Systems Based on Group III-V Compound PV Cells -- 10.4.3 PVE Systems Based on Chalcogenide PV Cells -- 10.4.4 PVE Systems Based on Perovskite PV Cells -- 10.4.5 PVE Systems Based on Organic Heterojunction PV Cells -- 10.5 Conclusions and Future Perspective -- References -- Chapter 11 Impactful Role of Earth-Abundant Cocatalysts in Photocatalytic Water Splitting -- 11.1 Introduction -- 11.2 Categories of Cocatalysts Utilized in Photocatalytic Water Splitting -- 11.2.1 Metal and Non-Metal Cocatalysts -- 11.2.2 Metal Oxides and Hydroxides -- 11.2.3 Metal Sulfides -- 11.2.4 Metal Phosphides and Carbides -- 11.2.5 Molecular Cocatalysts -- 11.3 Factors Determining the Cocatalyst Activity -- 11.3.1 Intrinsic Properties of Cocatalysts -- 11.3.2 Interfacial Coupling of Cocatalysts With Host Semiconductors -- 11.4 Advanced Characterization Techniques for Cocatalytic Process -- 11.5 Conclusion -- Acknowledgments -- References -- Index -- EULA…”

Tabla de Contenidos: “…3.4 Electronic Design Automation (EDA) -- 3.4.1 System-Level Design -- 3.4.2 Logic Synthesis and Physical Design -- 3.4.3 Test, Diagnosis, and Validation -- 3.5 Verification -- 3.6 Challenges -- 3.7 Conclusion -- References -- Chapter 4 IoT-Based Smart Home Security Alert System for Continuous Supervision -- 4.1 Introduction -- 4.2 Literature Survey -- 4.3 Results and Discussions -- 4.3.1 Raspberry Pi-3 B+Module -- 4.3.2 Pi Camera -- 4.3.3 Relay -- 4.3.4 Power Source -- 4.3.5 Sensors -- 4.3.5.1 IR &amp -- Ultrasonic Sensor -- 4.3.5.2 Gas Sensor -- 4.3.5.3 Fire Sensor -- 4.3.5.4 GSM Module -- 4.3.5.5 Buzzer -- 4.3.5.6 Cloud -- 4.3.5.7 Mobile -- 4.4 Conclusions -- References -- Chapter 5 A Detailed Roadmap from Conventional-MOSFET to Nanowire-MOSFET -- 5.1 Introduction -- 5.2 Scaling Challenges Beyond 100nm Node -- 5.3 Alternate Concepts in MOFSETs -- 5.4 Thin-Body Field-Effect Transistors -- 5.4.1 Single-Gate Ultrathin-Body Field-Effect Transistor -- 5.4.2 Multiple-Gate Ultrathin-Body Field-Effect Transistor -- 5.5 Fin-FET Devices -- 5.6 GAA Nanowire-MOSFETS -- 5.7 Conclusion -- References -- Chapter 6 Gate All Around MOSFETs-A Futuristic Approach -- 6.1 Introduction -- 6.1.1 Semiconductor Technology: History -- 6.2 Importance of Scaling in CMOS Technology -- 6.2.1 Scaling Rules -- 6.2.2 The End of Planar Scaling -- 6.2.3 Enhance Power Efficiency -- 6.2.4 Scaling Challenges -- 6.2.4.1 Poly Silicon Depletion Effect -- 6.2.4.2 Quantum Effect -- 6.2.4.3 Gate Tunneling -- 6.2.5 Horizontal Scaling Challenges -- 6.2.5.1 Threshold Voltage Roll-Off -- 6.2.5.2 Drain Induce Barrier Lowering (DIBL) -- 6.2.5.3 Trap Charge Carrier -- 6.2.5.4 Mobility Degradation -- 6.3 Remedies of Scaling Challenges -- 6.3.1 By Channel Engineering (Horizontal) -- 6.3.1.1 Shallow S/D Junction -- 6.3.1.2 Multi-Material Gate -- 6.3.2 By Gate Engineering (Vertical)…”

Tabla de Contenidos: “…Chapter 7: IoT-based smart monitoring topologies for energy-efficient smart buildings -- 7.1 Introduction -- 7.2 IoT-based smart building -- 7.2.1 Basic components of IoT -- 7.2.2 Sensors -- 7.2.3 Gateways -- 7.2.4 Building monitoring systems -- 7.2.5 IoT with integrating AI in smart buildings -- 7.2.6 Building automation systems (BAS) -- 7.2.7 IoT-based indoor localization -- 7.2.8 Lighting system -- 7.2.9 Shielding schedulers -- 7.2.10 Fire management system -- 7.2.11 Heating, ventilation and air conditioning -- 7.2.12 Energy efficiency toward smart buildings -- 7.2.13 Monitoring -- 7.2.14 Information management -- 7.2.15 Automation system -- 7.2.16 Feedback -- 7.2.17 User participation -- 7.3 Smart building architecture -- 7.3.1 Building Energy Management System (BEMS) -- 7.3.2 Protective lock system -- 7.3.3 Fire safety system -- 7.3.4 HVAC -- 7.3.5 Movement monitoring system -- 7.3.6 Cloud infrastructure -- 7.4 Monitoring techniques for smart buildings -- 7.4.1 Occupancy detection -- 7.4.2 Occupancy counting -- 7.4.2.1 Counting by whole -- 7.4.2.2 Counting at a specific place or zone -- 7.4.3 Occupancy tracking -- 7.4.4 Occupancy event recognition -- 7.4.5 Sensor network-based occupancy monitoring technique -- 7.4.6 CO 2 sensors -- 7.4.6.1 Nondispersive infrared sensors -- 7.4.6.2 Electrochemical sensors -- 7.4.6.3 Metal oxide semiconductor sensors -- 7.4.7 Humidity sensors -- 7.4.8 Temperature sensor -- 7.4.9 Microphone -- 7.4.10 Data fusion for occupancy tracking -- 7.4.11 Camera-based monitoring -- 7.5 Opportunities and challenges -- 7.5.1 Connectivity -- 7.5.2 Security -- 7.5.3 Poor testing -- 7.5.4 Weak password -- 7.5.5 Lack of visibility -- 7.6 Conclusion -- References -- Chapter 8: Soft computing techniques for renewable energy systems -- 8.1 Introduction -- 8.2 The soft computing - development history -- 8.3 Fuzzy Logic (FL)…”

“…It covers fundamental topics such as the electro-optic effect in nonlinear optic crystals and semiconductors. It addresses the optical and electro-optic properties of relevant materials, including traditional single crystalline lithium niobate, silicon, and III-V compound semiconductors, as well as emerging materials such as electrooptic polymers and organic nonlinear optic crystals. …”

Tabla de Contenidos: “…La CPU y el almacenamiento primario -- Almacenamiento primario -- Tipos de memoria de semiconductores -- La unidad de aritmética y lógica y la unidad de control -- 1.3. …”

Tabla de Contenidos: “…References -- Chapter 4 Optical Systems in Machine Vision -- 4.1 A Look at the Foundations of Geometrical Optics -- 4.1.1 From Electrodynamics to Light Rays -- 4.1.2 Basic Laws of Geometrical Optics -- 4.2 Gaussian Optics -- 4.2.1 Reflection and Refraction at the Boundary between two Media -- 4.2.2 Linearizing the Law of Refraction - The Paraxial Approximation -- 4.2.3 Basic Optical Conventions -- 4.2.4 Cardinal Elements of a Lens in Gaussian Optics -- 4.2.5 Thin Lens Approximation -- 4.2.6 Beam-Converging and Beam-Diverging Lenses -- 4.2.7 Graphical Image Constructions -- 4.2.8 Imaging Equations and Their Related Coordinate Systems -- 4.2.9 Overlapping of Object and Image Space -- 4.2.10 Focal Length, Lateral Magnification, and the Field of View -- 4.2.11 Systems of Lenses -- 4.2.12 Consequences of the Finite Extension of Ray Pencils -- 4.2.13 Geometrical Depth of Field and Depth of Focus -- 4.2.14 Laws of Central Projection-Telecentric System -- 4.3 Wave Nature of Light -- 4.3.1 Introduction -- 4.3.2 Rayleigh-Sommerfeld Diffraction Integral -- 4.3.3 Further Approximations to the Huygens-Fresnel Principle -- 4.3.4 Impulse Response of an Aberration-Free Optical System -- 4.3.5 Intensity Distribution in the Neighborhood of the Geometrical Focus -- 4.3.6 Extension of the Point Spread Function in a Defocused Image Plane -- 4.3.7 Consequences for the Depth of Field Considerations -- 4.4 Information Theoretical Treatment of Image Transfer and Storage -- 4.4.1 Physical Systems as Linear Invariant Filters -- 4.4.2 Optical Transfer Function (OTF) and the Meaning of Spatial Frequency -- 4.4.3 Extension to the Two-Dimensional Case -- 4.4.4 Impulse Response and MTF for Semiconductor Imaging Devices -- 4.4.5 Transmission Chain -- 4.4.6 Aliasing Effect and the Space-Variant Nature of Aliasing -- 4.5 Criteria for Image Quality -- 4.5.1 Gaussian Data…”

Tabla de Contenidos: “…9.3.1.2 Jetting Regime as Function of Fluid Properties and Laser Fluence -- 9.3.1.3 Jettability Phase Diagram -- 9.3.2 Jet Formation Dynamics during Laser Printing of Viscoelastic Alginate Solutions -- 9.3.2.1 Ink Coating Preparation and Design of Experiments -- 9.3.2.2 Typical Jetting Regimes -- 9.3.2.3 General Observation of the Jetting Dynamics -- 9.3.2.4 Effects of Laser Fluence on Jetting Dynamics -- 9.3.2.5 Effects of Alginate Concentration on Jetting Dynamics -- 9.3.2.6 Jettability Phase Diagram -- 9.4 Laser Printing Applications Using Optimized Printing Conditions -- 9.5 Conclusions and Future Work -- Acknowledgments -- References -- Chapter 10 Congruent LIFT with High‐Viscosity Nanopastes -- 10.1 Introduction -- 10.2 Congruent LIFT (or LDT) -- 10.3 Applications -- 10.4 Achieving Congruent Laser Transfers -- 10.5 Issues and Challenges -- 10.6 Summary -- Acknowledgment -- References -- Chapter 11 Laser Printing of Nanoparticles -- 11.1 Introduction, Setup, and Motivation -- 11.2 Laser‐Induced Transfer -- 11.3 Materials for Laser Printing of Nanoparticles -- 11.4 Laser Printing from Bulk‐Silicon and Silicon Films -- 11.5 Magnetic Resonances of Silicon Particles -- 11.6 Laser Printing from Prestructured Films -- 11.7 Applications: Sensing, Metasurfaces, and Additive Manufacturing -- 11.8 Outlook -- References -- Part III Applications -- Chapter 12 Laser Printing of Electronic Materials -- 12.1 Introduction and Context -- 12.2 Organic Thin‐Film Transistor -- 12.2.1 Operation and Characteristics of OTFTs -- 12.2.2 Laser Printing of the Semiconductor Layer -- 12.2.3 Laser Printing of Dielectric Layers -- 12.2.4 Laser Printing of Conducting Layers -- 12.2.5 Single‐Step Printing of Full OTFT Device -- 12.3 Organic Light‐Emitting Diode -- 12.4 Passive Components -- 12.5 Interconnection and Heterogeneous Integration -- 12.6 Conclusion -- References…”

Tabla de Contenidos: “…Cover -- Dedication -- Preface -- Contents -- Part A: Electrical Fundamentals -- 1: Systems of Units -- 1.1 Introduction -- 1.2 Scientific Notation -- 1.3 Fundamental and Derived Units -- 1.3.1 Fundamental Units -- 1.3.2 Derived Units -- 1.4 Standards and Units -- 1.5 Systems of Units -- 1.6 The SI System of Units -- 1.7 Importance of SI System -- 1.8 Definitions -- Summary -- Multiple Choice Questions (MCQ) -- Conventional Questions (CQ) -- 2: Electrons in Action -- 2.1 Introduction -- 2.2 Conduction in Solids -- 2.3 Bonding in Atoms -- 2.4 Energy Bands -- 2.5 Electrons in Action -- 2.6 Direction of Current Flow -- 2.7 Diffusion Current Momentarily -- 2.8 Drift Velocity -- 2.9 The Nature of Electric Current -- 2.10 Effects of Electricity -- Summary -- Multiple Choice Questions (MCQ) -- Conventional Questions (CQ) -- 3: Electric Circuit -- 3.1 Introduction -- 3.2 Electric Circuit -- 3.3 Current -- 3.4 Electromotive Force -- 3.5 Reference Zero -- 3.6 Safety Precautions While Handling Electric Circuits -- 3.7 Insulators -- 3.8 Semiconductors -- 3.9 Conductors -- Summary -- Multiple Choice Questions (MCQ) -- Conventional Questions (CQ) -- 4: Simple d.c. …”

Tabla de Contenidos: “…Front Cover -- Three-Dimensional Integrated Circuit Design -- Copyright Page -- Dedication -- Contents -- List of Figures -- About the Authors -- Preface to the Second Edition -- Preface to the First Edition -- Acknowledgments -- Organization of the Book -- 1 Introduction -- 1.1 Interconnect Issues in Integrated Systems -- 1.2 Three-Dimensional or Vertical Integration -- 1.2.1 Opportunities for Three-Dimensional Integration -- 1.2.2 Challenges of Three-Dimensional Integration -- 1.2.2.1 Technological/manufacturing limitations -- 1.2.2.2 Testing -- 1.2.2.3 Global interconnect design -- 1.2.2.4 Thermal issues -- 1.2.2.5 CAD algorithms and tools -- 1.3 Book Organization -- 2 Manufacturing of Three-Dimensional Packaged Systems -- 2.1 Stacking Methods for Transistors, Circuits, and Dies -- 2.1.1 System-in-Package -- 2.1.2 Transistor and Circuit Level Stacking -- 2.2 System-on-Package -- 2.3 Technologies for System-in-Package -- 2.3.1 Wire Bonded System-in-Package -- 2.3.2 Peripheral Vertical Interconnects -- 2.3.3 Area Array Vertical Interconnects -- 2.3.4 Metalizing the Walls of an SiP -- 2.4 Technologies for 2.5-D Integration -- 2.4.1 Interposer Materials -- 2.4.2 Metallization Processes -- 2.4.3 Vertical Interconnects -- 2.5 Summary -- 3 Manufacturing Technologies for Three-Dimensional Integrated Circuits -- 3.1 Monolithic Three-Dimensional ICs -- 3.1.1 Laser Crystallization -- 3.1.2 Seed Crystallization -- 3.1.3 Double-Gate Metal Oxide Semiconductor Field Effect Transistors for Stacked Three-Dimensional ICs -- 3.1.4 Molecular Bonding -- 3.2 Three-Dimensional ICs with Through Silicon Via or Intertier Via -- 3.2.1 Wafer Level Integration -- 3.2.2 Die-to-Die Integration -- 3.2.3 Bonding of Three-Dimensional ICs -- 3.3 Contactless Three-Dimensional ICs -- 3.3.1 Capacitively Coupled Three-Dimensional ICs…”

Tabla de Contenidos: “…Cover -- Title Page -- Copyright Page -- Preface -- Acknowledgments -- Brief Contents -- Contents -- 1 Introduction -- 1.1 The Electrical/Electronics Industry -- 1.2 A Brief History -- 1.3 Units of Measurement -- 1.4 Systems of Units -- 1.5 Significant Figures, Accuracy, and Rounding Off -- 1.6 Powers of Ten -- 1.7 Fixed-Point, Floating-Point, Scientific, and Engineering Notation -- 1.8 Conversion Between Levels of Powers of Ten -- 1.9 Conversion Within and Between Systems of Units -- 1.10 Symbols -- 1.11 Conversion Tables -- 1.12 Calculators -- 1.13 Computer Analysis -- 2 Voltage and Current -- 2.1 Introduction -- 2.2 Atoms and Their Structure -- 2.3 Voltage -- 2.4 Current -- 2.5 Voltage Sources -- 2.6 Ampere-Hour Rating -- 2.7 Battery Life Factors -- 2.8 Conductors and Insulators -- 2.9 Semiconductors -- 2.10 Ammeters and Voltmeters -- 2.11 Applications -- 2.12 Computer Analysis -- 3 Resistance -- 3.1 Introduction -- 3.2 Resistance: Circular Wires -- 3.3 Wire Tables -- 3.4 Temperature Effects -- 3.5 Types of Resistors -- 3.6 Color Coding and Standard Resistor Values -- 3.7 Conductance -- 3.8 Ohmmeters -- 3.9 Resistance: Metric Units -- 3.10 The Fourth Element-The Memristor -- 3.11 Superconductors -- 3.12 Thermistors -- 3.13 Photoconductive Cell -- 3.14 Varistors -- 3.15 Applications -- 4 Ohm's Law, Power, and Energy -- 4.1 Introduction -- 4.2 Ohm's Law -- 4.3 Plotting Ohm's Law -- 4.4 Power -- 4.5 Energy -- 4.6 Efficiency -- 4.7 Circuit Breakers, GFCIs, and Fuses -- 4.8 Applications -- 4.9 Computer Analysis -- 5 Series dc Circuits -- 5.1 Introduction -- 5.2 Series Resistors -- 5.3 Series Circuits -- 5.4 Power Distribution in a Series Circuit -- 5.5 Voltage Sources in Series -- 5.6 Kirchhoff's Voltage Law -- 5.7 Voltage Division in a Series Circuit -- 5.8 Interchanging Series Elements -- 5.9 Notation -- 5.10 Ground Connection Awareness…”