“…The semiconductor industry is a fundamental building block of the new economy, there is no area of modern life untouched by the progress of nanoelectronics. …”

“…Totally practical in nature, the book features numerous (quantify when known) case study designs using a variety of Field Programmable Gate Array (FPGA) and Complex Programmable Logic Devices (CPLD), for a range of applications from control and instrumentation to semiconductor automatic test equipment.Key features include:* Case studies that provide a walk through of the design process, highlighting the trade-offs involved.* Discussion of real world issues su…”

Tabla de Contenidos: “….) -- 1.1 INTRODUCCIÓN A LA LÓGICA DIGITAL INTEGRADA -- 1.1.1 CIRCUITOS INTEGRADOS -- 1.1.2 CIRCUITOS COMBINACIONALES -- 1.1.3 CIRCUITOS SECUENCIALES -- 1.1.4 MEMORIAS DE SEMICONDUCTORES -- 1.1.5 DISPOSITIVOS LÓGICOS PROGRAMABLES -- 1.2 INTRODUCCIÓN A LA ARQUITECTURA ARM -- 2 ELEMENTOS HARDWARE -- 2.1 CONECTORES Y HARDWARE PARA EL TRATAMIENTO (...) -- 2.1.1 TARJETAS DE MEMORIA -- 2.1.2 CONECTORES PARA LA MEMORIA RAM Y (...) -- 2.1.3 CABLES Y CONECTORES USB Y MINI USB -- 2.1.4 CONECTOR RJ45 -- 2.1.5 REDES -- 2.2 CONECTORES PARA EL TRATAMIENTO DE AUDIO (...) -- 2.2.1 CONECTOR JACK -- 2.2.2 HDMI -- 2.2.3 CONECTOR RCA -- 2.2.4 CONECTOR CSI -- 2.2.5 GPU PARA GRÁFICOS -- 3 HARDWARE DE LA PLACA RASPBERRY PI -- 3.1 DEFINICIÓN DE RASPBERRY PI -- 3.1.1 UN POCO DE HISTORIA -- 3.2 HARDWARE DE LA RASPBERRY PI -- 3.2.1 CONECTORES EN LA RASPBERRY PI -- 3.2.2 ARM -- 3.2.3 PROCESADOR GRÁFICO VIDEOCORE IV -- 3.2.4 PINES GPIO -- 3.2.5 LEDS DE ESTADO -- 3.2.6 PUERTOS Y BUSES EN RASPBERRY PI -- 4 MODELOS Y ACCESORIOS DE RASPBERRY PI -- 4.1 MODELOS DE RASPBERRY PI -- 4.1.1 RASPBERRY PI 1 -- 4.1.2 RASPBERRY PI 2 -- 4.1.3 RASPBERRY PI ZERO -- 4.1.4 RASPBERRY PI 3 -- 4.1.5 RASPBERRY PI COMPUTE MODULE -- 4.1.6 RESUMEN DE LAS DIFERENCIAS ENTRE (...) -- 4.2 ACCESORIOS DE LAS PLACAS RASPBERRY PI -- 4.2.1 CAJA RASPBERRY PI -- 4.2.2 FUENTE DE ALIMENTACIÓN UNIVERSAL -- 4.2.3 CÁMARA DE RASPBERRY PI -- 4.2.4 PI NOIR CAMERA V2 -- 4.2.5 RASPBERRRY PI USB WIFI DONGLE -- 4.2.6 SENSE HAT -- 4.2.7 RASPBERRY PI TOUCH DISPLAY -- 5 SISTEMAS DE HARDWARE LIBRE -- 5.1 LICENCIAS SOFTWARE Y HARDWARE -- 5.2 PROYECTOS DE PLACAS HARDWARE ABIERTAS -- 5.2.1 PINE A64 -- 5.2.2 ODROID -- 5.2.3 OLINUXINO -- 5.2.4 CUBIEBOARD -- 5.2.5 ROCK LITE PRO…”

Tabla de Contenidos: “…. -- 4. Dispositivos semiconductores de potencia -- 5. Simbología -- 6. Resumen -- Ejercicios de repaso y autoevaluación -- Capítulo 2 Circuitos electrónicos -- 1. …”

Tabla de Contenidos: “…6.3.1.3 Ultrashort pulse lasers -- 6.3.2 Wavelength based division -- 6.3.2.1 Mid infrared lasers (mid IR) -- 6.3.2.2 Infrared lasers (IR lasers) -- 6.3.2.3 Ultraviolet lasers (UV lasers) -- 6.4 Material removal mechanisms -- 6.4.1 Thermal ablation -- 6.4.2 Cold ablation/photochemical ablation/photo ablation -- 6.5 Laser microprocessing of materials -- 6.5.1 Direct laser micromachining in open surroundings -- 6.5.1.1 Metals and alloys -- 6.5.1.2 Semiconductors, composites, and specially developed materials -- 6.5.1.3 Glass and polymers -- 6.5.2 Direct laser micromachining in different surrounding conditions -- 6.6 Challenges and future of laser processing -- References -- 7 Underwater pulsed laser beam cutting with a case study -- 7.1 Introduction -- 7.2 Laser as a machine tool -- 7.3 Laser material interaction -- 7.4 Laser beam cutting -- 7.4.1 Process characteristics -- 7.4.2 Cut quality characteristics -- 7.4.3 Principles of laser beam cutting -- 7.4.3.1 Different types of laser beam cutting -- 7.4.3.1.1 Laser sublimation cutting -- 7.4.3.1.2 Controlled fracture technique -- 7.4.3.1.3 Laser fusion cutting -- 7.4.3.1.4 Reactive fusion cutting -- 7.4.3.1.5 Laser cutting at different assisted medium -- 7.4.3.1.6 Laser beam microcutting -- 7.4.4 Application of laser beam machining -- 7.5 Underwater laser beam machining -- 7.5.1 Advantages of laser beam cutting at submerged condition -- 7.5.2 Material removal mechanism of nanosecond pulsed laser beam cutting at submerged condition -- 7.5.3 Development of different types of liquid-assisted laser beam machining -- 7.5.3.1 Laser beam cutting in submerged condition -- 7.5.3.2 Underwater assist gas jet/waterjet assisted laser beam cutting -- 7.5.3.3 Molten salt-jet-guided/chemical laser beam -- 7.5.3.4 Water jet following the laser beam…”

Tabla de Contenidos: “…5.5 Design Procedure 122 -- 5.6 Analysis 123 -- 5.7 Applications 126 -- 5.8 Summary 133 -- Acknowledgment 133 -- References 133 -- 6 High Power Electronics: Key Technology forWind Turbines 136 -- 6.1 Introduction 136 -- 6.2 Development of Wind Power Generation 137 -- 6.3 Wind Power Conversion 138 -- 6.4 Power Converters for Wind Turbines 143 -- 6.5 Power Semiconductors for Wind Power Converter 149 -- 6.6 Controls and Grid Requirements for Modern Wind Turbines 150 -- 6.7 Emerging Reliability Issues for Wind Power System 155 -- 6.8 Conclusion 156 -- References 156 -- 7 Photovoltaic Energy Conversion Systems 160 -- 7.1 Introduction 160 -- 7.2 Power Curves and Maximum Power Point of PV Systems 162 -- 7.3 Grid-Connected PV System Configurations 165 -- 7.4 Control of Grid-Connected PV Systems 181 -- 7.5 Recent Developments in Multilevel Inverter-Based PV Systems 192 -- 7.6 Summary 195 -- References 195 -- 8 Controllability Analysis of Renewable Energy Systems 199 -- 8.1 Introduction 199 -- 8.2 Zero Dynamics of the Nonlinear System 201 -- 8.3 Controllability of Wind Turbine Connected through L Filter to the Grid 202 -- 8.4 Controllability of Wind Turbine Connected through LCL Filter to the Grid 208 -- 8.5 Controllability and Stability Analysis of PV System Connected to Current Source Inverter 219 -- 8.6 Conclusions 228 -- References 229 -- 9 Universal Operation of Small/Medium-Sized Renewable Energy Systems 231 -- 9.1 Distributed Power Generation Systems 231 -- 9.2 Control of Power Converters for Grid-Interactive Distributed Power Generation Systems 243 -- 9.3 Ancillary Feature 259 -- 9.4 Summary 267 -- References 268 -- 10 Properties and Control of a Doubly Fed Induction Machine 270 -- 10.1 Introduction. …”

Tabla de Contenidos: “…The Ownership of For-Profit Firms -- The Management of Firms -- What Owners Want -- 6.2 Production -- Production Functions -- Time and the Variability of Inputs -- 6.3 Short-Run Production: One Variable and One Fixed Input -- Solved Problem 6.1 -- Interpretation of Graphs -- Solved Problem 6.2 -- Law of Diminishing Marginal Returns -- APPLICATION Malthus and the Green Revolution -- 6.4 Long-Run Production: Two Variable Inputs -- Isoquants -- APPLICATION A Semiconductor Integrated Circuit Isoquant -- Substituting Inputs -- Solved Problem 6.3 -- Diminishing Marginal Rates of Technical Substitution -- The Elasticity of Substitution -- Solved Problem 6.4 -- 6.5 Returns to Scale -- Constant, Increasing, and Decreasing Returns to Scale -- Solved Problem 6.5 -- APPLICATION Returns to Scale in Various Industries -- Varying Returns to Scale -- 6.6 Productivity and Technical Change -- Relative Productivity -- APPLICATION A Good Boss Raises Productivity -- Innovations -- APPLICATION Tata Nano's Technical and Organizational Innovations -- CHALLENGE SOLUTION Labor Productivity During Downturns -- Summary -- Exercises -- Chapter 7 Costs -- CHALLENGE Technology Choice at Home Versus Abroad -- 7.1 Measuring Costs -- Opportunity Costs -- APPLICATION The Opportunity Cost of an MBA -- Solved Problem 7.1 -- Opportunity Cost of Capital -- Sunk Costs -- 7.2 Short-Run Costs -- Short-Run Cost Measures -- APPLICATION The Sharing Economy and the Short Run -- Solved Problem 7.2 -- Short-Run Cost Curves -- Production Functions and the Shape of Cost Curves -- APPLICATION Short-Run Cost Curves for a Japanese Beer Manufacturer -- Effects of Taxes on Costs -- Short-Run Cost Summary -- 7.3 Long-Run Costs -- Input Choice -- Solved Problem 7.3 -- Solved Problem 7.4 -- How Long-Run Cost Varies with Output -- Solved Problem 7.5 -- Solved Problem 7.6 -- The Shape of Long-Run Cost Curves…”

Tabla de Contenidos: “…-- 4.4 COMPROBACIÓN DE FUSIBLES -- 5 RESISTENCIAS -- 5.1 RESISTENCIAS FIJAS -- 5.1.1 Clasificación -- 5.1.2 Características -- 5.2 RESISTENCIAS VARIABLES -- 5.2.1 Potenciómetros -- 5.2.2 Fotorresistencias -- 5.2.3 Termistores -- 5.2.4 Varistores -- 6 CONDENSADORES -- 6.1 CLASIFICACIÓN -- 6.1.1 Condensadores fijos -- 6.1.2 Condensadores variables -- 6.2 CARACTERÍSTICAS DE UN CAPACITOR -- 6.3 IDENTIFICACIÓN DE UN CONDENSADOR -- 6.4 FUNCIONAMIENTO DE UN CAPACITOR -- 6.4.1 Corriente continua -- 6.4.2 Corriente alterna -- 7 BOBINAS Y TRANSFORMADORES -- 7.1 LA INDUCTANCIA -- 7.2 REACTANCIA INDUCTIVA -- 7.3 CLASIFICACIÓN DE LAS BOBINAS -- 7.4 IDENTIFICACIÓN -- 7.5 SIMBOLOGÍA DE LAS BOBINAS -- 7.6 INDUCTANCIA MUTUA -- 7.7 TRANSFORMADORES -- 7.8 FUNCIONAMIENTO DE UN TRANSFORMADOR -- 7.9 CLASIFICACIÓN DE TRANSFORMADORES -- 7.10 ESTRUCTURA BÁSICA -- 7.11 IDENTIFICACIÓN -- 7.12 RELACIÓN DE TRANSFORMACIÓN -- 7.13 RELACIÓN DE POTENCIA -- 7.14 LEYES BÁSICAS -- 7.15 PÉRDIDAS EN LOS TRANSFORMADORES -- 8 DIODOS -- 8.1 SEMICONDUCTORES INTRÍNSECOS Y EXTRÍNSECOS -- 8.2 EL DIODO -- 8.3 TIPOS DE DIODOS -- 8.4 FUNCIONAMIENTO -- 8.5 LA UNIÓN PN -- 8.5.1 Polarización inversa -- 8.5.2 Polarización directa -- 8.6 TIPOS DE DIODOS -- 8.6.1 Diodos rectificadores -- 8.6.2 Diodos Zener -- 8.6.3 Diodos LED…”
Acceso restringido con credenciales UPSA

Tabla de Contenidos: “…Einsatz von Programmierrichtlinien -- Regeln und Direktiven -- Verbindlichkeiten -- 5.3 Dynamische Testverfahren -- 5.3.1 Spezifikationsbasierte Testverfahren -- 5.3.1.1 Äquivalenzklassenbildung -- 5.3.1.2 Grenzwertanalyse -- 5.3.2 Erfahrungsbasierte Testverfahren -- Intuitive Testfallermittlung -- 5.3.3 Strukturbasierte Testverfahren -- 5.3.3.1 Anweisungstest -- 5.3.3.2 Entscheidungstests -- 5.3.3.3 Bedingungstest -- (Einfacher) Bedingungstest -- Mehrfachbedingungstest -- Modifizierter Bedingungs-/Entscheidungstest (MC/DC-Test) -- 5.3.4 Testverfahren für die Testdurchführung -- 5.3.4.1 Back-to-Back-Test -- Back-to-Back-Test unterschiedlicher Softwareversionen -- Back-to-Back-Test Programmcode gegen Funktionsmodell -- Back-to-Back-Test System gegen Software -- 5.3.4.2 Fehlereinfügungstest -- 5.4 Gegenüberstellung und Auswahl -- Teststufe -- Testart -- Testbasis -- Testaktivität -- Risiken -- Stand der Technik -- Erfahrung und Intuition -- Anhang -- A ISO 26262 -- A.1 Zusammenfassung der Bände -- Band 1 - Vocabulary -- Band 2 - Management of functional safety -- Band 3 - Concept phase -- Band 4 - Product development at the system level -- Band 5 - Product development at the hardware level -- Band 6 - Product development at the software level -- Band 7 - Production and operation -- Band 8 - Supporting processes -- Band 9 - Automotive Safety Integrity Level (ASIL)-oriented and safety- oriented analysis -- Band 10 - Guideline on ISO 26262 -- Band 11 - Guideline on application of ISO 26262 to semiconductors (nur ISO 26262:2018) -- Band 12 - Adaption of ISO 26262 for motorcycles (nur ISO 26262:2018) -- A.2 Übersicht der testrelevanten Methodentabellen -- B Automotive SPICE -- B.1 Prozessspezifikation SWE.6 -- B.2 ASPICE-Prozesse und VDA-Scope -- B.3 Generische Praktiken und Ressourcen -- B.4 Verfeinerte NPLF-Skala -- C Gegenüberstellung der Teststufen…”

Tabla de Contenidos: “…Chapter 1 Introductory Concepts -- 1-1 Digital and Analog Quantities -- 1-2 Binary Digits, Logic Levels, and Digital Waveforms -- 1-3 Basic Logic Functions -- 1-4 Combinational and Sequential Logic Functions -- 1-5 Introduction to Programmable Logic -- 1-6 Fixed-Function Logic Devices -- 1-7 Test and Measurement Instruments -- 1-8 Introduction to Troubleshooting -- Chapter 2 Number Systems, Operations, and Codes -- 2-1 Decimal Numbers -- 2-2 Binary Numbers -- 2-3 Decimal-to-Binary Conversion -- 2-4 Binary Arithmetic -- 2-5 Complements of Binary Numbers -- 2-6 Signed Numbers -- 2-7 Arithmetic Operations with Signed Numbers -- 2-8 Hexadecimal Numbers -- 2-9 Octal Numbers -- 2-10 Binary Coded Decimal (BCD) -- 2-11 Digital Codes -- 2-12 Error Codes -- Chapter 3 Logic Gates -- 3-1 The Inverter -- 3-2 The AND Gate -- 3-3 The OR Gate -- 3-4 The NAND Gate -- 3-5 The NOR Gate -- 3-6 The Exclusive-OR and Exclusive-NOR Gates -- 3-7 Programmable Logic -- 3-8 Fixed-Function Logic Gates -- 3-9 Troubleshooting -- Chapter 4 Boolean Algebra and Logic Simplification -- 4-1 Boolean Operations and Expressions -- 4-2 Laws and Rules of Boolean Algebra -- 4-3 DeMorgan's Theorems -- 4-4 Boolean Analysis of Logic Circuits -- 4-5 Logic Simplification Using Boolean Algebra -- 4-6 Standard Forms of Boolean Expressions -- 4-7 Boolean Expressions and Truth Tables -- 4-8 The Karnaugh Map -- 4-9 Karnaugh Map SOP Minimization -- 4-10 Karnaugh Map POS Minimization -- 4-11 The Quine-McCluskey Method -- 4-12 Boolean Expressions with VHDL -- Applied Logic -- Chapter 5 Combinational Logic Analysis -- 5-1 Basic Combinational Logic Circuits -- 5-2 Implementing Combinational Logic -- 5-3 The Universal Property of NAND and NOR Gates -- 5-4 Combinational Logic Using NAND and NOR Gates -- 5-5 Pulse Waveform Operation -- 5-6 Combinational Logic with VHDL -- 5-7 Troubleshooting -- Applied Logic -- Chapter 6 Functions of Combinational Logic -- 6-1 Half and Full Adders -- 6-2 Parallel Binary Adders -- 6-3 Ripple Carry and Look-Ahead Carry Adders -- 6-4 Comparators -- 6-5 Decoders -- 6-6 Encoders -- 6-7 Code Converters -- 6-8 Multiplexers (Data Selectors) -- 6-9 Demultiplexers -- 6-10 Parity Generators/Checkers -- 6-11 Troubleshooting -- Applied Logic -- Chapter 7 Latches, Flip-Flops, and Timers -- 7-1 Latches -- 7-2 Flip-Flops -- 7-3 Flip-Flop Operating Characteristics -- 7-4 Flip-Flop Applications -- 7-5 One-Shots -- 7-6 The Astable Multivibrator -- 7-7 Troubleshooting -- Applied Logic -- Chapter 8 Shift Registers -- 8-1 Shift Register Operations -- 8-2 Types of Shift Register Data I/Os -- 8-3 Bidirectional Shift Registers -- 8-4 Shift Register Counters -- 8-5 Shift Register Applications -- 8-6 Logic Symbols with Dependency Notation -- 8-7 Troubleshooting -- Applied Logic -- Chapter 9 Counters -- 9-1 Finite State Machines -- 9-2 Asynchronous Counters -- 9-3 Synchronous Counters -- 9-4 Up/Down Synchronous Counters -- 9-5 Design of Synchronous Counters -- 9-6 Cascaded Counters -- 9-7 Counter Decoding -- 9-8 Counter Applications -- 9-9 Logic Symbols with Dependency Notation -- 9-10 Troubleshooting -- Applied Logic -- Chapter 10 Programmable Logic -- 10-1 Simple Programmable Logic Devices (SPLDs) -- 10-2 Complex Programmable Logic Devices (CPLDs) -- 10-3 Macrocell Modes -- 10-4 Field-Programmable Gate Arrays (FPGAs) -- 10-5 Programmable Logic Software -- 10-6 Boundary Scan Logic -- 10-7 Troubleshooting -- Applied Logic -- Chapter 11 Data Storage -- 11-1 Semiconductor Memory Basics -- 11-2 The Random-Access Memory (RAM) -- 11-3 The Read-Only Memory (ROM) -- 11-4 Programmable ROMs -- 11-5 The Flash Memory -- 11-6 Memory Expansion -- 11-7 Special Types of Memories -- 11-8 Magnetic and Optical Storage -- 11-9 Memory Hierarchy -- 11-10 Cloud Storage -- 11-11 Troubleshooting -- Chapter 12 Signal Conversion and Processing -- 12-1 Analog-to-Digital Conversion -- 12-2 Methods of Analog-to-Digital Conversion -- 12-3 Methods of Digital-to-Analog Conversion -- 12-4 Digital Signal Processing -- 12-5 The Digital Signal Processor (DSP) -- Chapter 13 Data transmission -- 13-1 Data Transmission Media -- 13-2 Methods and Modes of Data Transmission -- 13-3 Modulation of Analog Signals with Digital Data -- 13-4 Modulation of Digital Signals with Analog Data -- 13-5 Multiplexing and Demultiplexing -- 13-6 Bus Basics -- 13-7 Parallel Buses -- 13-8 The Universal Serial Bus (USB) -- 13-9 Other Serial Buses -- 13-10 Bus Interfacing -- Chapter 14 Data Processing and Control -- 14-1 The Computer System -- 14-2 Practical Computer System Considerations -- 14-3 The Processor: Basic Operation -- 14-4 The Processor: Addressing Modes -- 14-5 The Processor: Special Operations -- 14-6 Operating Systems and Hardware -- 14-7 Programming -- 14-8 Microcontrollers and Embedded Systems -- 14-9 System on Chip (SoC) -- Chapter 15 Integrated Circuit Technologies -- 15-1 Basic Operational Characteristics and Parameters -- 15-2 CMOS Circuits -- 15-3 TTL (Bipolar) Circuits -- 15-4 Practical Considerations in the Use of TTL -- 15-5 Comparison of CMOS and TTL Performance -- 15-6 Emitter-Coupled Logic (ECL) Circuits -- 15-7 PMOS, NMOS, and E2CMOS…”

Tabla de Contenidos: “…10.7.8 The Genome Sequencer 454 FLX System -- 10.7.9 Illumina/Solexa Genome Analyzer -- 10.7.10 Transition Sequencing Techniques -- 10.7.11 Ion-Torrent's Semiconductor Sequencing -- 10.7.12 Helico's Genetic Analysis Platform -- 10.7.13 Third-Generation Sequencing Techniques -- 10.8 Conclusion -- Abbreviations -- Acknowledgement -- References -- 11 Bioinformatics in Cancer Detection -- 11.1 Introduction -- 11.2 The Era of Bioinformatics in Cancer -- 11.3 Aid in Cancer Research via NCI -- 11.4 Application of Big Data in Developing Precision Medicine -- 11.5 Historical Perspective and Development -- 11.6 Bioinformatics-Based Approaches in the Study of Cancer -- 11.6.1 SLAMS -- 11.6.2 Module Maps -- 11.6.3 COPA -- 11.7 Conclusion and Future Challenges -- References -- 12 Genomic Association of Polycystic Ovarian Syndrome: Single-Nucleotide Polymorphisms and Their Role in Disease Progression -- 12.1 Introduction -- 12.2 FSHR Gene -- 12.3 IL-10 Gene -- 12.4 IRS-1 Gene -- 12.5 PCR Primers Used -- 12.6 Statistical Analysis -- 12.7 Conclusion -- References -- 13 An Insight of Protein Structure Predictions Using Homology Modeling -- 13.1 Introduction -- 13.2 Homology Modeling Approach -- 13.2.1 Strategies for Homology Modeling -- 13.2.2 Procedure -- 13.3 Steps Involved in Homology Modeling -- 13.3.1 Template Identification -- 13.3.2 Sequence Alignment -- 13.3.3 Backbone Generation -- 13.3.4 Loop Modeling -- 13.3.5 Side Chain Modeling -- 13.3.6 Model Optimization -- 13.3.6.1 Model Validation -- 13.4 Tools Used for Homology Modeling -- 13.4.1 Robetta -- 13.4.2 M4T (Multiple Templates) -- 13.4.3 I-Tasser (Iterative Implementation of the Threading Assembly Refinement) -- 13.4.4 ModBase -- 13.4.5 Swiss Model -- 13.4.6 PHYRE2 (Protein Homology/Analogy Recognition Engine 2) -- 13.4.7 Modeller -- 13.4.8 Conclusion -- Acknowledgement -- References…”

Tabla de Contenidos: “…10.4.2 - Lightning and Thunderstorms -- 10.4.3 - Aircraft Impact -- 10.4.3.1 - Background -- 10.4.3.2 - Airfield Proximity -- 10.4.4 - Earthquake -- 10.4.5 - Meteorological Factors -- 10.4.6 - Other Consequences -- Part 4 - Achieving Reliability and Maintainability -- Chapter 11 - Design and Assurance Techniques -- 11.1 - Specifying and Allocating the Requirement -- 11.2 - Stress Analysis -- 11.3 - Environmental Stress Protection -- 11.4 - Failure Mechanisms -- 11.4.1 - Types of Failure Mechanism -- 11.4.2 - Failures in Semiconductor Components -- 11.4.3 - Discrete Components -- 11.5 - Complexity and Parts -- 11.5.1 - Reduction of Complexity -- 11.5.2 - Part Selection -- 11.5.3 - Redundancy -- 11.6 - Burn-In and Screening -- 11.7 - Maintenance Strategies -- Chapter 12 - Design Review, Test and Reliability Growth -- 12.1 - Review Techniques -- 12.2 - Categories of Testing -- 12.2.1 - Environmental Testing -- 12.2.2 - Marginal Testing -- 12.2.3 - High-Reliability Testing -- 12.2.4 - Testing for Packaging and Transport -- 12.2.5 - Multiparameter Testing -- 12.2.6 - Step-Stress Testing -- 12.3 - Reliability Growth Modeling -- 12.3.1 - The CUSUM Technique -- 12.3.2 - Duane Plots -- Chapter 13 - Field Data Collection and Feedback -- 13.1 - Reasons for Data Collection -- 13.2 - Information and Difficulties -- 13.3 - Times to Failure -- 13.4 - Spreadsheets and Databases -- Equipment code -- How found -- Type of fault -- Action taken -- Discipline -- Free text -- 13.5 - Best Practice and Recommendations -- 13.6 - Analysis and Presentation of Results -- 13.7 - Manufacturers' data -- 13.8 - Anecdotal Data -- 13.9 - Examples of Failure Report Forms -- 13.10 - No-Fault-Found (NFF) -- Chapter 14 - Factors Influencing Down Time -- 14.1 - Key Design Areas -- 14.1.1 - Access -- 14.1.2 - Adjustment -- 14.1.3 - Built-In Test Equipment…”

Tabla de Contenidos: “…2.5.4 Relative humidity measurement -- 2.5.5 Tilt measurement -- 2.5.6 Other applications -- 2.6 Future trends -- Sources of further information and advice -- References -- 3 - Smart temperature sensors and temperature sensor systems -- 3.1 Introduction -- 3.2 Measuring temperature, temperature differences, and temperature changes in industrial applications -- 3.3 Temperature-sensing elements -- 3.3.1 Introduction -- 3.3.2 Temperature sensor characteristics of bipolar junction transistors -- 3.3.3 ΔVBE temperature sensors -- 3.3.4 Bipolar junction transistors in complementary metal-oxide semiconductor (CMOS) technology -- 3.4 Basic concepts of smart temperature sensors -- 3.4.1 Architectures of smart temperature sensor systems -- 3.4.2 Temperature sensors with a duty-cycle-modulated (DEM) output -- 3.5 Methods to improve the accuracy of CMOS smart temperature-sensor systems -- 3.5.1 Dynamic element matching -- 3.5.2 Chopping -- 3.6 Principles of BJT-based smart temperature sensors with DCM -- 3.7 Signal processing of duty cycle modulated signals -- 3.7.1 Three methods of averaging -- 3.7.1.1 First type of averaging: best accuracy at any speed -- 3.7.1.2 Second type of averaging: simplest method -- 3.7.1.3 Third method of averaging: best accuracy at intermediate and low speeds -- 3.8 Fabrication and test results -- 3.8.1 Fabrication -- 3.8.2 Accuracy over temperature range and supply voltage range -- 3.8.3 Noise -- 3.8.4 Packaging shift and long-term stability -- 3.8.5 Performance summary -- 3.8.6 Simple systems with digital and analog signal processing -- 3.9 Summary -- References -- 4 - Capacitive sensors for displacement measurement in the subnanometer range -- 4.1 Introduction -- 4.2 Challenges for subnanometer displacement measurement with capacitive sensors -- 4.3 Offset capacitance cancellation technique…”

Tabla de Contenidos: “…-- 1.3 Advantages of Hybrid Perovskite Solar Cells -- 1.3.1 Band Gap Tunability -- 1.3.2 High Voc -- 1.3.3 Low Temperature Coefficient -- 1.4 Challenges for Hybrid Perovskites -- 1.4.1 Requirement of Improved Stability -- 1.4.2 Large‐Area Solar Cells -- 1.4.3 Toxicity of Pb and Sn Compounds -- 1.5 Overview of this Book -- Acknowledgment -- References -- Chapter 2 Overview of Hybrid Perovskite Solar Cells -- 2.1 Introduction -- 2.2 Historical Backgrounds of Halide Perovskite Photovoltaics -- 2.3 Semiconductor Properties of Organo Lead Halide Perovskites -- 2.4 Working Principle of Perovskite Photovoltaics -- 2.5 Compositional Design of the Halide Perovskite Absorbers -- 2.6 Strategy for Stabilizing Perovskite Solar Cells -- 2.7 All Inorganic and Lead‐Free Perovskites -- 2.8 Development of High‐Efficiency Tandem Solar Cells -- 2.9 Conclusion and Perspectives -- References -- Part I Characteristics of Hybrid Perovskites -- Chapter 3 Crystal Structures -- 3.1 What Is Hybrid Perovskite? …”

Tabla de Contenidos: “…Student accomodation (Coimbra, Portugal) / Aires Mateus e Associados. Semiconductor assembly plant (Wasserburg am Inn, Germany) / Von Seidlein. …”

Tabla de Contenidos: “…2.3 Computer storage technologies -- 2.3.1 Punched cards - Hollerith and IBM -- 2.3.2 Punched paper tapes -- 2.3.3 Handwriting recognition -- 2.3.4 Delay line memories -- 2.3.5 Core memories -- 2.3.6 Semiconductor memories -- 2.3.7 Redundant array of Independent Memories - RAIM -- 2.3.8 Magnetic Random Access Memory - MRAM -- 2.3.9 Magnetic tapes and tape libraries -- 2.3.10 An analytical model for a tape library -- 2.3.11 Summary of a recent article on magnetic tapes -- 2.3.12 Origins of Hard Disk Drives - HDDs -- 2.3.13 HDD manufacturers -- 2.3.14 Storage technologies expected to replace disk drives -- 2.3.15 Magnetic bubble memories -- 2.3.16 Charged Couple Devices - CCDs -- 2.3.17 Micro-Electro-Mechanical Systems - MEMS -- 2.3.18 IBM Zurich millipede -- 2.3.19 Phase Change Memory - PCM -- 2.3.20 Flash memories -- 2.3.21 Companies producing flash memories -- 2.3.22 Elevating commodity storage with the SALSA host translation layer -- 2.3.23 Flash SSD versus magnetic HDD pricing -- 2.3.24 Pure Storage design of Purity -- 2.3.25 Intel/Micron 3D_XPoint Optane Memory -- 2.3.26 Processing In Memory - PIM -- 2.3.27 Universal memory technology - UltraRAM -- 2.3.28 Racetrack memory -- 2.3.29 Optical storage -- 2.3.30 Holographic memory -- 2.3.31 M-DISC and storage longevity -- 2.3.32 Persistent and NonVolatile Memory - NVM -- 2.3.33 Glass as a new storage medium -- 2.3.34 DNA based archival storage system -- 2.4 Reliability studies of DRAM, HDDs, &amp -- flash SSDs -- 2.4.1 Flash SSD reliability at Facebook, Google &amp -- NetApp -- 2.5 Storage Networking Industry Association - SNIA -- 2.5.1 Solid state storage performance -- 2.5.2 Persistent Memory Forum -- 2.5.3 Computational storage -- 2.6 Big data and its sources -- 2.7 Sources of storage content -- 2.8 Ranking and description of media companies -- 2.9 Sources of news: newspapers, radio and TV stations…”

Tabla de Contenidos: “…1.8 History of Embedded Systems -- 1.9 Current Trends -- Conclusion -- Key Points of this Chapter -- Questions -- Exercises -- Chapter 2: Embedded Systems-The Hardware Point of View -- Introduction -- 2.1 Microcontroller Unit (MCU) -- 2.1.1 The Processor -- 2.1.2 The Harvard Architecture -- 2.2 A Popular 8-bit MCU -- 2.2.1 General Purpose I/O (GPIO) -- 2.2.2 Clock -- 2.2.3 Power on Reset -- 2.2.4 Brown Out Reset -- 2.2.5 Timers and Counters -- 2.2.6 Watchdog Timer -- 2.2.7 Real-time Clock (RTC) -- 2.2.8 Stack -- 2.2.9 Interrupts -- 2.2.10 DMA -- 2.2.11 Communication Ports -- 2.3 Memory for Embedded Systems -- 2.3.1 Semiconductor Memory -- 2.3.2 Random Access Memory (RAM) -- 2.3.3 Dynamic RAM (DRAM) -- 2.3.4 ROM (Read Only Memory) -- 2.3.5 Caches -- 2.4 Low Power Design -- 2.5 Pullup and Pulldown Resistors -- 2.5.1 Floating State of an Input -- 2.5.2 Pulldown and Pullup Resistances -- 2.5.3 Open Collector/Open Drain Gates -- 2.5.4 Weak and Strong Pullup -- 2.5.5 High Impedance State, Hi-Z -- Conclusion -- Key Points of this Chapter -- Questions -- Exercises -- Chapter 3: Sensors, ADCs and Actuators -- Introduction -- 3.1 Sensors -- 3.1.1 Temperature Sensors -- 3.1.2 Light Sensors -- 3.1.3 Proximity/Range Sensors -- 3.1.4 Encoders -- 3.1.5 Humidity Sensors -- 3.1.6 Other Sensors -- 3.2 Analog to Digital Converters -- 3.2.1 ADC Interfacing * -- 3.3 Actuators -- 3.3.1 Displays -- 3.3.2 Motors -- 3.3.3 Optocouplers/Opto Isolators -- 3.3.4 Relays -- Conclusion -- Key Points of this Chapter -- Questions -- Exercises -- Chapter 4: Examples of Embedded Systems -- Introduction -- 4.1 Mobile Phone -- 4.1.1 Block Diagram -- 4.1.2 The Cellular Concept -- 4.1.3 Multiple Access -- 4.1.4 Frequency Re-use -- 4.1.5 Handoff (Handover) -- 4.1.6 Spread Spectrum Techniques -- 4.1.7 Set Up and Maintanence -- 4.1.8 Conclusion -- 4.2 Automotive Electronics…”

Tabla de Contenidos: “…CONVERSIÓN FOTOVOLTAICA -- 3.3.1. SEMICONDUCTORES Y DOPAJE -- 3.3.2. LA MAGIA ESTÁ EN LA JUNTURA P-N…”

Tabla de Contenidos: “…Chapter 7 - Innovations in Manufacturing7.1 Introduction7.2 Pharmaceuticals7.3 Heavy Equipment7.4 Automotive7.5 Semiconductor7.6 Concluding Remarks 7.7 References8. …”

Tabla de Contenidos: “…-- Advantages/Disadvantages of Change Cycles -- Organisational Barriers to Change -- Performance-Driven Organisational Change -- Rate of Change -- Organisational Effectiveness -- Differents States of Change -- The Future State of Change -- The Current State of Change -- The Delta State of Change -- Creating Change -- Implementation of Change -- Practical tools to Understands Change -- General Guidelines for Effective Change -- Summary -- Case Study: A Semiconductor Solutions Company With an offshore Development Center in India -- Review Questions -- Organisational Resistance to Change -- Introduction -- Reactions to Change -- Core Facts of Resistance to Change -- Individual and Group Resistance to Change -- Individual Resistance -- Organisational Resistance -- Consequences of Resistance to Change -- Overcoming Resistance to Change -- Startegies for Introducing Planned Change -- Empirical-rational Strategy -- Normative-reductive Strategy -- Power-coercive Strategy -- Techniques to Manage Resistance During Change -- Education and Communication -- Sense of Participation and Invilvement -- Assistance and Support -- Incentives -- Negotiation -- Manipulation and Co-optation -- Coercion -- Othr Strategies for Introducing Change…”