Tabla de Contenidos: “…Front Cover; Understanding DC Circuits; Copyright Page; Table of Contents; PREFACE; COURSE OBJECTIVES; PARTS LIST FOR EXPERIMENTS; UNIT 1: BASICS OF DC ELECTRONICS; Unit Introduction; Unit Objectives; Important Terms; Electronic Systems; Energy, Work, and Power; Structure of Matter; Self-Examination; Electrostatic Charges; Static Electricity; Self-Examination; Electric Current; Conductors; Insulators; Semiconductors; Current Flow; Electric Force (Voltage); Resistance; Voltage, Current, and Resistance; Volts, Ohms, and Amperes; Self-Examination; Components, Symbols, and Diagrams; Resistors…”

Tabla de Contenidos: “…-- FOREWORD -- PREFACE -- ACKNOWLEDGMENTS -- 1 BROADBAND ACCESS TECHNOLOGIES: AN OVERVIEW -- 1.1 Communication Networks -- 1.2 Access Technologies -- 1.2.1 Last-Mile Bottleneck -- 1.2.2 Access Technologies Compared -- 1.3 Digital Subscriber Line -- 1.3.1 DSL Standards -- 1.3.2 Modulation Methods -- 1.3.3 Voice over DSL -- 1.4 Hybrid Fiber Coax -- 1.4.1 Cable Modem -- 1.4.2 DOCSIS -- 1.5 Optical Access Networks -- 1.5.1 Passive Optical Networks -- 1.5.2 PON Standard Development -- 1.5.3 WDM PONs -- 1.5.4 Other Types of Optical Access Networks -- 1.6 Broadband over Power Lines -- 1.6.1 Power-Line Communications -- 1.6.2 BPL Modem -- 1.6.3 Challenges in BPL -- 1.7 Wireless Access Technologies -- 1.7.1 Wi-Fi Mesh Networks -- 1.7.2 WiMAX Access Networks -- 1.7.3 Cellular Networks -- 1.7.4 Satellite Systems -- 1.7.5 LMDS and MMDS Systems -- 1.8 Broadband Services and Emerging Technologies -- 1.8.1 Broadband Access Services -- 1.8.2 Emerging Technologies -- 1.9 Summary -- References -- 2 OPTICAL COMMUNICATIONS: COMPONENTS AND SYSTEMS -- 2.1 Optical Fibers -- 2.1.1 Fiber Structure -- 2.1.2 Fiber Mode -- 2.1.3 Fiber Loss -- 2.1.4 Fiber Dispersion -- 2.1.5 Nonlinear Effects -- 2.1.6 Light-Wave Propagation in Optical Fibers -- 2.2 Optical Transmitters -- 2.2.1 Semiconductor Lasers -- 2.2.2 Optical Modulators -- 2.2.3 Transmitter Design -- 2.3 Optical Receivers -- 2.3.1 Photodetectors -- 2.3.2 Optical Receiver Design -- 2.4 Optical Amplifiers -- 2.4.1 Rare-Earth-Doped Fiber Amplifiers -- 2.4.2 Semiconductor Optical Amplifiers -- 2.4.3 Raman Amplifiers -- 2.5 Passive Optical Components -- 2.5.1 Directional Couplers -- 2.5.2 Optical Filters -- 2.6 System Design and Analysis -- 2.6.1 Receiver Sensitivity -- 2.6.2 Power Budget -- 2.6.3 Dispersion Limit -- 2.7 Optical Transceiver Design for TDM PONs -- 2.7.1 Burst-Mode Optical Transmission -- 2.7.2 Colorless ONUs -- 2.8 Summary -- References -- 3 PASSIVE OPTICAL NETWORKS: ARCHITECTURES AND PROTOCOLS -- 3.1 PON Architectures -- 3.1.1 Network Dimensioning and Bandwidth…”

Tabla de Contenidos: “…Cover -- Copyright -- Credits -- About the Author -- About the Reviewer -- www.PacktPub.com -- Customer Feedback -- Table of Contents -- Preface -- Chapter 1: BLE and the Internet of Things -- Internet of Things -- Modern day IoT -- Real life examples of the Internet of Things -- Wearables -- The fitness tracker -- Smart home devices -- Amazon Echo -- Wireless bulbs -- Smart refrigerators -- Television and online media -- Google Chromecast -- Apple TV -- Automotive industry -- Technologies in the Internet of Things -- Wireless Local Area Network (WLAN) -- Wireless Ad-hoc Networks -- ZigBee -- Bluetooth Low Energy -- Bluetooth versions -- Bluetooth Low Energy Key Concepts -- Attribute Protocol (ATT) and Generic Attribute Profile (GATT) -- GATT Server and GATT Client -- Universally Unique Identifiers (UUIDs) -- GATT-based Bluetooth Profile Hierarchy -- Service -- Characteristic -- Generic Access Profile (GAP) -- Broadcaster -- Observer -- Central -- Peripheral -- Bluetooth Low Energy Security -- Key Generation -- Association Models in Pairing -- Numeric Comparison -- Just Works -- Out of Band (OOB) -- Passkey Entry -- Signing the Data -- Privacy -- Bluetooth Low Energy for the Internet of Things -- Applications of BLE in IoT -- Bluetooth Low Energy Beacons -- Bluetooth Low Energy Beacon use-case -- Communication model of BLE Beacons -- Bluetooth mesh networks -- Summary -- Chapter 2: BLE Hardware, Software, and Debugging Tools -- Bluetooth Low Energy hardware -- Development kits -- Nordic semiconductor nRF51 development kit -- S110 SoftDevice -- S120 SoftDevice -- S130 SoftDevice -- Adafruit Bluefruit LE on nRF8001 Bluetooth Low Energy IC -- Coin Arduino BLE hardware -- Bluetooth Low Energy software -- Bluetooth Developer Studio by Special Interest Group -- Nordic Semiconductor tools -- nRF Connect for Mobile (Android and iOS)…”

Tabla de Contenidos: “…4.5.2 VERTICAL METAL-OXIDE SEMICONDUCTOR POWER FIELD-EFFECT TRANSISTORS -- 4.5.3 GATE DRIVE IMPEDANCE -- Gate-Source Overvoltage -- Source Lead Inductance -- 4.5.4 SWITCHING SPEED -- 4.5.5 ON-STATE RESISTANCE -- P-Channel Vertical Metal-Oxide Semiconductor -- 4.6 INSULATED GATE BIPOLAR TRANSISTORS -- 4.6.1 INSULATED GATE BIPOLAR TRANSISTOR STRUCTURE -- 4.6.2 ADVANTAGES OVER MOSFETS AND BIPOLARS -- 4.6.3 DISADVANTAGES -- 4.7 WIDE BAND GAP DEVICES -- 5 - Analog Integrated Circuits -- 5.1 THE IDEAL OP-AMP -- 5.1.1 APPLICATIONS CATEGORIES -- 5.2 THE PRACTICAL OP-AMP -- 5.2.1 OFFSET VOLTAGE -- Output Saturation Due to Amplified Offset -- Reducing the Effect of Offset -- Offset Drift -- Circuit Techniques to Remove the Effect of Drift -- 5.2.2 BIAS AND OFFSET CURRENTS -- Bias Current Levels -- Output Offsets Due to Bias and Offset Currents -- 5.2.3 COMMON-MODE EFFECTS -- Common-Mode Rejection Ratio -- Power Supply Rejection Ratio -- 5.2.4 INPUT VOLTAGE RANGE -- Absolute Maximum Input -- 5.2.5 OUTPUT PARAMETERS -- Power Rail Voltage -- Load Impedance -- 5.2.6 AC PARAMETERS -- 5.2.7 SLEW RATE AND LARGE-SIGNAL BANDWIDTH -- Slew Rate -- Large-Signal Bandwidth -- Slewing Distortion -- 5.2.8 SMALL-SIGNAL BANDWIDTH -- 5.2.9 SETTLING TIME -- 5.2.10 THE OSCILLATING AMPLIFIER -- Ground Coupling -- Power Supply Coupling -- Output-Stage Instability -- Stray Capacitance at the Input -- Parasitic Feedback -- 5.2.11 OPEN-LOOP GAIN -- Sagging AOL -- 5.2.12 NOISE -- Definitions -- 5.2.13 CALCULATING THE EFFECT OF NOISE IN A CIRCUIT -- Power Spectral Density of Noise -- Types of Noise -- Thermal Noise -- Amplifier Noise -- Noise Bandwidth -- Modeling and Simulation of Noise -- 5.2.14 SUPPLY CURRENT AND VOLTAGE -- Supply Voltage -- Supply Current -- lS Versus Speed and Dissipation -- 5.2.15 TEMPERATURE RATINGS -- Specification Validity -- Package Reliability…”

Tabla de Contenidos: “…Cover -- Series Page -- Title Page -- Copyright Page -- Contents -- Preface -- Chapter 1 Comparative Analysis of MOSFET and FinFET -- 1.1 Introduction -- 1.1.1 Scaling Issue -- 1.1.2 Problems in MOSFET -- 1.2 Double Gate -- 1.3 Advantages and Disadvantage of MOSFET -- 1.4 MOSFET Drawbacks -- 1.5 FinFET -- 1.6 SOI-FinFET -- 1.7 Issues with FinFET-Based Technology -- 1.8 Advantage of FinFET -- 1.9 Drawbacks of FinFET -- 1.10 Applications of FinFET Technology -- 1.11 Conclusion -- References -- Chapter 2 Nanosheet FET for Future Technology Scaling -- 2.1 Introduction -- 2.2 Device Description and Simulation Parameters -- 2.2.1 Analysis of the Results Obtained -- 2.2.2 Impact of Variation in Width Across Various Thickness Values on Device Characteristics -- 2.2.3 Transfer Characteristics -- 2.2.4 Impact of Geometrical Variations on ON Current -- 2.2.5 Impact of Geometrical Variations on OFF-Current -- 2.2.6 Impact of Geometrical Variations on Switching Ratio -- 2.2.7 Impact of Geometrical Variations on Threshold Voltage -- 2.2.8 Impact of Geometrical Variations on Subthreshold Swing -- 2.2.9 Impact of Geometrical Variations on DIBL -- 2.2.10 Comparison with Previous Works -- 2.3 Conclusions -- References -- Chapter 3 Comparison of Different TFETs: An Overview -- 3.1 Introduction -- 3.2 Tunnel FET -- 3.3 Gate Engineering -- 3.3.1 Oxide-Thickness and Dielectric-Constant of Gateoxide -- 3.3.2 Multiple Gates -- 3.3.3 Spacer Engineering -- 3.4 Tunneling-Junction Engineering -- 3.4.1 Doping of Source -- 3.4.2 Heterojunctions -- 3.5 Materials Engineering -- 3.5.1 Germanium -- 3.5.2 III-V Semiconductors -- 3.5.3 Nanowires -- 3.6 Conclusion -- References -- Chapter 4 GaAs Nanowire Field Effect Transistor -- 4.1 Introduction -- 4.1.1 Semiconductor Nanowires -- 4.1.2 Metal Nanowires -- 4.1.3 Oxide Nanowires -- 4.1.4 Hybrid Nanowires…”

Tabla de Contenidos: “…Bibliography -- Chapter 5: Control Functions -- 5.1. Semiconductor components for control functions -- 5.2. …”

Tabla de Contenidos: “…Front Cover; Sensors for Mechatronics; Copyright Page; Contents; Preface; 1 Introduction; 1.1 Sensors in Mechatronics; 1.1.1 Definitions; 1.1.2 Sensor Development; 1.1.3 Sensor Nomenclature; 1.1.4 Sensors and Information; Binary Sensors; Analogue Sensors; Image Sensors; Optical Imaging; Acoustic Imaging; Tactile Imaging; 1.2 Selection of Sensors; References to Cited Literature; Literature for Further Reading; Introductory Books on Sensors and Mechatronics; Books on Semiconductor Sensors; 2 Sensor Fundamentals; 2.1 Physical Quantities; 2.1.1 Classification of Quantities…”

Tabla de Contenidos: “…Managing Product Quality: Total Recall at National Semiconductor 49; 3.1 Introduction; 3.2 The Problem; 3.3 The Knowledge Management Solution; 3.4 Conclusion; Chapter 4. …”

Tabla de Contenidos: “…1.2.3.4 Phase/frequency noise performance 1.2.3.5 Tunability; 1.2.3.6 Power scaling-master-oscillator power amplifiers (MOPAs); 1.2.4 Multi-wavelength fiber DFB lasers and fiber DFB laser arrays; 1.2.5 Optical transmission system experiments; 1.2.6 Fiber DFB laser in non-telecom applications; 1.3 Summary and concluding remarks-outlook; References; 2 Semiconductor Photonic Integrated Circuit Transmitters and Receivers; 2.1 Introduction; 2.2 Technology; 2.2.1 Group III-V PICs; 2.2.2 Group IV PICs; 2.2.3 Hybrid integration of Groups III-V and IV; 2.2.4 Comparison of PIC technologies…”

Tabla de Contenidos: “…Chapter 108.Resistor and capacitor letter and digit codeChapter 102.RC time constants; Chapter 106.RL time constants; Chapter 103.Reactance of capacitors at spot frequencies; Chapter 104.Reactance of inductors at spot frequencies; Chapter 139.Transistor letter symbols; Chapter 30.Common transistor and diode data; Chapter 117.Pro Electron system of Semiconductor type labelling,; Chapter 136.Thyristors; Chapter 18. …”

Tabla de Contenidos: “…Cover -- Half Title -- Series Page -- Title Page -- Copyright Page -- Dedication -- Acknowledgement -- Table of Contents -- Preface -- List of Figures -- List of Tables -- List of Contributors -- Chapter 1: Benchmarking Neuromorphic Computing for Inference -- 1.1: Introduction -- 1.2: State of the art in Benchmarking -- 1.2.1: Machine Learning -- 1.2.2: Hardware -- 1.3: Guidelines -- 1.3.1: Fair and Unfair Benchmarking -- 1.3.2: Combined KPIs and Approaches for Benchmarking -- 1.3.3: Outlook : Use-case Based Benchmarking -- 1.4: Conclusion -- References -- Chapter 2: Benchmarking the Epiphany Processor as a Reference Neuromorphic Architecture -- 2.1: Introduction and Background -- 2.2: Comparison with a Few Well-Known Digital Neuromorphic Platforms -- 2.3: Major Challenges in Neuromorphic Architectures -- 2.3.1: Memory Allocation -- 2.3.2: Efficient Communication -- 2.3.3: Mapping SNN onto Hardware -- 2.3.4: On-chip Learning -- 2.3.5: Idle Power Consumption -- 2.4: Measurements from Epiphany -- 2.5: Conclusion -- References -- Chapter 3: Temporal Delta Layer: Exploiting Temporal Sparsity in Deep Neural Networks for Time-Series Data -- 3.1: Introduction -- 3.2: Related Works -- 3.3: Methodology -- 3.3.1: Delta Inference -- 3.3.2: Sparsity Induction Using Activation Quantization -- 3.3.2.1: Fixed Point Quantization -- 3.3.2.2: Learned Step-Size Quantization -- 3.3.3: Sparsity Penalty -- 3.4: Experiments and Results -- 3.4.1: Baseline -- 3.4.2: Experiments -- 3.4.3: Result Analysis -- 3.5: Conclusion -- References -- Chapter 4: An End-to-End AI-based Automated Process for Semiconductor Device Parameter Extraction -- 4.1: Introduction -- 4.2: Semantic Segmentation -- 4.2.1: Proof of Concept and Architecture Overview -- 4.2.2: Implementation Details and Result Overview -- 4.3: Parameter Extraction -- 4.4: Conclusion -- 4.5: Future Work -- References…”

“…Switching power conversion involves several engineering disciplines: Semiconductor Physics, Thermal Management, Control Loop theory, Magnetics etc, and all these come into play eventually, in ways hard for non-experts to grasp. …”

Tabla de Contenidos: “…YIN Y YANG; EL ESPÍRITU DE LA SÍNTESIS; LA ENERGÍA VITAL; FUERZAS AUTOCURATIVAS; FUERZAS FORMATIVAS; BIOENERGÉTICA; REGULACIÓN PSICOFISIOLÓGICA; EL SUEÑO HOLÍSTICO; UNA ANTIGUA SINTERGÉTICA GRUPAL; DEL ALMA A LAS MOLÉCULAS: UNA RED DE CONCIENCIA Y VIDA; LA QUINTA ESENCIA: EL ALMA; ENERGÍA VITAL Y RADIACIÓN ELECTROMAGNÉTICA; LA ENERGÍA VITAL Y LA RADIÓNICA; LA TERAPIA CON LAS PROPIAS OSCILACIONES; EL CAMPO ENERGÉTICO VITAL; SEMICONDUCTORES; VISLUMBRANDO LA BIOCIBERNÉTICA11; LA PIEL ES UN RADAR; RESTAURANDO LA INTEGRIDAD…”

Tabla de Contenidos: “…8.4 Indirect collection systems8.5 Review of renewable energy desalination systems; 8.6 Process selection; Exercises; References; Chapter 9 - Photovoltaic Systems; 9.1 Semiconductors; 9.2 Photovoltaic panels; 9.3 Related equipment; 9.4 Applications; 9.5 Design of PV systems; 9.6 Tilt and yield; 9.7 Concentrating PV; 9.8 Hybrid PV/T systems; Exercises; References; Chapter 10 - Solar Thermal Power Systems; 10.1 Introduction; 10.2 Parabolic trough collector systems; 10.3 Power tower systems; 10.4 Dish systems; 10.5 Thermal analysis of solar power plants; 10.6 Solar updraft towers…”
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Tabla de Contenidos: “…Yoon -- 5 NEPES’ Fan-Out Packaging Technology from Single die, SiP to Panel-Level Packaging 97 /Jong Heon (Jay) Kim -- 6 M-Series Fan-Out with Adaptive Patterning 117 /Tim Olson and Chris Scanlan -- 7 SWIFTR Semiconductor Packaging Technology 141 /Ron Huemoeller and Curtis Zwenger -- 8 Embedded Silicon Fan-Out (eSiFOR) Technology for Wafer-Level System Integration 169 /Daquan Yu -- 9 Embedding of Active and Passive Devices by Using an Embedded Interposer: The i2 Board Technology 185 /Thomas Gottwald, Christian Roessle, and Alexander Neumann -- 10 Embedding of Power Electronic Components: The Smart p2 Pack Technology 201 /Thomas Gottwald and Christian Roessle -- 11 Embedded Die in Substrate (Panel-Level) Packaging Technology 217 /Tomoko Takahashi and Akio Katsumata -- 12 Blade: A Chip-First Embedded Technology for Power Packaging 241 /Boris Plikat and Thorsten Scharf -- 13 The Role of Liquid Molding Compounds in the Success of Fan-Out Wafer-Level Packaging Technology 261 /Katsushi Kan, Michiyasu Sugahara, and Markus Cichon -- 14 Advanced Dielectric Materials (Polyimides and Polybenzoxazoles) for Fan-Out Wafer-Level Packaging (FO-WLP) 271 /T. …”

Tabla de Contenidos: “…Breaking Down the Silos -- Reference -- Chapter 8 Congress -- The Bills of AI -- The Scientist Speaks -- 2020 and Beyond -- References -- Chapter 9 AI for Agencies -- The Agency Problem -- Strategic Plans -- Delivering AI-Enabled Capabilities That Address Key Missions -- Scaling AI's Impact across DoD -- Cultivating a Leading AI Workforce -- Leading in Military Ethics and AI Safety -- The CIO and American AI -- Strategy Development in Agencies -- The DLA Story -- References -- Chapter 10 A Chaotic Private Sector -- The Supply Side Problems of AI -- Sensemaking about AI -- The AI Supply Chain -- The ERA of Data Management -- Think with Sensors -- RPA Is the AI in America -- The Futurists and Virtue Signaling -- Chapter 11 Of Capital and Measurements -- The Presidential SPAC -- The Capital Investment in the Private Sector -- Mega Investment -- Mega Investment Is Made in Large Blocks -- Mega Investment Impact on Innovation -- The Investment Plan -- Data -- Skills Development -- Semiconductors -- With an Eye on the World -- Capital Investment in AI -- References -- Chapter 12 At the Speed of Relevance…”

Tabla de Contenidos: “…Chapter 11: Selecting Components for LED Drivers11.1 Discrete Semiconductors; 11.2 Passive Components; 11.3 The Printed Circuit Board (PCB); 11.4 Operational Amplifiers and Comparators; Chapter 12: Magnetic Materials for Inductors and Transformers; 12.1 Ferrite Cores; 12.2 Iron Dust Cores; 12.3 Special Cores; 12.4 Core Shapes and Sizes; 12.5 Magnetic Saturation; 12.6 Copper Losses; Chapter 13: EMI and EMC Issues; 13.1 EMI Standards; 13.2 Good EMI Design Techniques; 13.3 EMC Standards; 13.4 EMC Practices; Chapter 14: Thermal Considerations; 14.1 Efficiency and Power Loss…”

Tabla de Contenidos: “…""2.5 Direct Coupled Transistor Logic (DCTL) and Integrated Injection Logic (I2L)""""2.6 Emitter Coupled Logic (ECL) and Common Mode Logic (CML)""; ""2.7 Transistor Transistor Logic (TTL) 35""; ""2.8 Complementary Metal Oxide Semiconductor (CMOS) logic ""; ""2.9 Industrial logic families""; ""2.10 Choosing a lgic family""; ""Chapter 3. …”

Tabla de Contenidos: “…Cover -- Title Page -- Copyright -- Contents -- Preface -- Chapter 1 Sources of Energy and Technologies -- 1.1 Energy Uses in Different Countries -- 1.2 Energy Sources -- 1.2.1 Non‐Renewable Energy Resources -- 1.2.2 Renewable Sources of Energy -- 1.3 Energy and Environment -- 1.3.1 Climate Change -- 1.4 Review of Technologies for Renewable Energy System -- 1.4.1 Fluid Dynamics -- 1.4.1.1 Conservation of Mass -- 1.4.1.2 Conservation of Momentum -- 1.4.1.3 Conservation of Energy -- 1.5 Thermodynamics -- 1.5.1 Enthalpy -- 1.5.2 Specific Heat -- 1.5.3 Zeroth Law -- 1.5.4 First Law -- 1.5.4.1 Limitations of First law -- 1.5.5 Second Law of Thermodynamics -- 1.5.5.1 Kelvin-Planck Statement -- 1.5.5.2 Clausius Statement -- 1.5.6 Third Law of Thermodynamics -- 1.6 Thermodynamic Power Cycles -- 1.6.1 Ideal Cycle (Carnot Cycle) -- 1.6.2 Rankine Cycle -- 1.6.3 Brayton Cycle -- 1.7 Summary -- References -- Chapter 2 Power Electronic Converters -- 2.1 Types of Power Electronic Converters -- 2.2 Power Semiconductor Devices -- 2.2.1 Thyristor -- 2.2.1.1 Line Commutation -- 2.2.1.2 Load Commutation -- 2.2.1.3 Forced Commutation -- 2.2.2 Gate Turn‐Off Thyristor (GTO) -- 2.2.3 Power Bipolar Junction Transistor -- 2.2.4 Power MOSFET -- 2.2.5 Insulated Gate Bipolar Transistor (IGBT) -- 2.3 ac‐to‐dc Converters -- 2.3.1 Single‐Phase Diode Bridge Rectifiers -- 2.3.2 Three‐Phase Full‐Wave Bridge Diode Rectifiers -- 2.3.3 Single‐Phase Fully Controlled Rectifiers -- 2.3.4 Three‐Phase Fully Controlled Bridge Converter -- 2.4 dc‐to‐ac Converters (Inverters) -- 2.4.1 Single‐Phase Voltage Source Inverters -- 2.4.2 Square‐Wave PWM Inverter -- 2.4.3 Single‐Pulse‐Width Modulation -- 2.4.4 Multiple‐Pulse‐Width Modulation -- 2.4.5 Sinusoidal‐Pulse‐Width Modulation -- 2.4.6 Three‐Phase Voltage Source Inverters -- 2.4.7 Single‐Phase Current Source Inverters…”

Tabla de Contenidos: “…2 >> Cálculo de circuitos eléctricos con agrupación de resistencias3 >> Caída de tensión en un circuito; 4 >> Comparación de circuitos con resistencias en serie y en paralelo; 5 >> Lectura de intensidad, resistencia y voltaje con el polímetro; UNIDAD 3; 1 >> Los imanes; 2 >> Electromagnetismo; 3 >> Componentes magnéticos en circuitos eléctricos; UNIDAD 4; 1 >> Generación de corriente eléctrica; 2 >> Aparatos eléctricos; UNIDAD 5; 1 >> Materiales semiconductores; 2 >> El diodo; 4 >> El transistor; 5 >> Tiristor; 6 >> Efecto Hall; 7 >> Pinza amperimétrica; UNIDAD 6…”