“…Recent achievements in hardware and software development, such as multi-core CPUs and DRAM capacities of multiple terabytes per server, enabled the introduction of a revolutionary technology: in-memory data management. …”

Tabla de Contenidos: “…Rotating Magnetic MemoryMagnetic Core Memory; Static Random Access Memory (SRAM); Address Lines and Data Lines; Combining Memory Chips into Memory Systems; Dynamic Random Access Memory (DRAM); The Raspberry Pi Memory System; Cache; Virtual Memory; Chapter 4: ARM Processors and Systems-on-a-Chip; The Incredible Shrinking CPU; Digital Logic Primer; Inside the CPU; Rethinking the CPU: CISC vs. …”

Tabla de Contenidos: “…RAMDRAM; SRAM; NVRAM; DPRAM; EPROM; Flash; SD-MMC; Hard Disk; Memory architecture; Cache; Translation lookaside buffer (TLB); Instruction cache; Data cache; Cache customization; Virtual memory; Scratch pad; Software overlays; DMA; DRAM; Special-purpose memory; Memory structure of multicore architecture; Shared memory architecture; Uniform memory access (UMA); Non-uniform memory access (NUMA); Distributed memory architecture; Cache memory in multicore chips; Cache coherency; Directory-based cache coherence protocol; Snoopy cache coherence protocol; MESI cache coherence protocol…”

Tabla de Contenidos: “…""Getting an A+""""Chapter 3: What to Remember about Memory""; ""Understanding the Types of Memory""; ""Identifying the Types of DRAM""; ""How Would You Like Your Chips Packaged?""…”

Tabla de Contenidos:

Tabla de Contenidos: “…Identifying the Types of MotherboardsUnderstanding Bus Architectures; Performance Considerations; Getting an A+; Chapter 2: Picking Your Processor; Understanding Processor Terminology; Identifying Socket Types; Looking at Popular Intel Processors; Don't Forget Non-Intel Chips; Installing a Processor; Keeping a Processor Cool; Increasing Performance; Getting an A+; Chapter 3: What to Remember about Memory; Understanding the Types of Memory; Identifying the Types of DRAM; How Would You Like Your Chips Packaged?; Understanding Error-Checking Memory; Multichannel Memory Architecture…”

Tabla de Contenidos: “…SCANNERS IN MFPs; Shading Compensation and Image Enhancement; CIS Scanner Image Processing and Interface Circuitry; CCD Scanner Image Processing and Interface Circuitry; Description of DRAM Control; General Description of Memory Access; Color Image Scanners; Transference of Pixel Signals onto a Video Line; The Color Scanner of the Brother MFC 7000FC Machine…”

Tabla de Contenidos: “…Combined Effect of Classic and Quantum Errors; 4.3.3 - A summary of device scaling limits; 4.3.4 - Charge-based Binary Logic Switch; 4.3.5 - Charge-based Memory Element; DRAM; SRAM; Floating gate/flash memory; 4.4 - System-level Analysis; 4.4.1 - Tiling Considerations: Device density; 3D Tiling of Flash Memory; 4.4.2 - Energy adjustment for system reliability; 4.4.3 - Models for Connected Binary Switches…”

Tabla de Contenidos: “…Vertical 3D Memory Technologies; Contents; Acknowledgments; 1 Basic Memory Device Trends Toward the Vertical; 1.1 Overview of 3D Vertical Memory Book; 1.2 Moore's Law and Scaling; 1.3 Early RAM 3D Memory; 1.3.1 SRAM as the First 3D Memory; 1.3.2 An Early 3D Memory-The FinFET SRAM; 1.3.3 Early Progress in 3D DRAM Trench and Stack Capacitors; 1.3.4 3D as the Next Step for Embedded RAM; 1.4 Early Nonvolatile Memories Evolve to 3D; 1.4.1 NOR Flash Memory-Both Standalone and Embedded; 1.4.2 The Charge-Trapping EEPROM; 1.4.3 Thin-Film Transistor Takes Nonvolatile Memory into 3D…”

Tabla de Contenidos: “…12 Semiconductor Memory Devices -- 12.1 Semiconductor Memory -- 12.2 Dynamic RAM -- 12.3 Synchronous DRAM (SDRAM) -- 12.4 ROM (Read Only Memory) -- 12.5 Cache Memory -- 12.6 Mapping Techniques -- 12.7 Cache and the x86 Family -- Key Points of this Chapter -- Questions -- Exercise -- 13 Multiprocessor Configurations -- 13.1 Multiprocessor Systems -- 13.2 Multiprocessing Using 8086 -- 13.3 The 8086 and 8089 in a Tightly Coupled Configuration -- 13.4 Loosely Coupled Configurations and Bus Arbitration -- 13.5 Bus Arbitration Using the 8289 Bus Arbiter IC -- 13.6 The Arithmetic Co-Processor 8087 -- Key Points of this Chapter -- Questions -- Exercise -- 14 80186 - The Embedded Microprocessor -- 14.1 Additions in the Instruction Set -- 14.2 Instruction Set Enhancements -- 14.3 Block Diagram of the 80186 -- 14.4 Programming the Timer Unit -- 14.5 Programming -- Key Points of this Chapter -- Questions -- Exercise -- 15 The 80286 and 80386 Processors -- 15.1 The 80286 Processor -- 15.2 The 80386 -- 15.3 Internal Architecture -- 15.4 Programming Enhancements -- 15.5 Hardware Features of 80386 -- 15.6 Virtual Memory -- 15.7 Memory Management Unit -- 15.8 Converting a Logical Address to a Physical Address -- 15.9 Calculating the size of the Logical Address Space -- 15.10 Protection -- 15.11 Multi Tasking -- 15.12 Interrupts of 80386 -- 15.13 Privileged Instructions -- 15.14 Conclusion -- Key Points of this Chapter -- Questions -- Exercise -- 16 The Pentium Processor -- 16.1 The Enhanced Features of 80486 -- 16.2 Data Alignment -- 16.3 The Pentium Processor -- 16.4 Pentium Pro -- 16.5 Pentium-II And Pentium-III -- 16.6 Pentium-IV -- 16.7 Latest Trends in Microprocessor Design -- 16.8 Multi-Core Technology and Intel -- 16.9 Mobile Processors -- 16.10 Legacy Support -- Key Points of this Chapter -- Questions -- Exercise -- 17 The x86 Based Personal Computer…”

Tabla de Contenidos:

Tabla de Contenidos: “…4.1.5 Biological Nanowires -- 4.2 Properties of Nanowires -- 4.2.1 Electrical Properties of Nanowire -- 4.2.2 Mechanical Properties -- 4.2.3 Optical Properties of Nanowire -- 4.2.4 Nonlinear Optical Properties -- 4.2.5 Photovoltaic Properties -- 4.3 Nanowire-FET -- 4.4 Proposed Work (GaAs Nanowire-FET) -- 4.5 Conclusion -- References -- Chapter 5 Graphene Nanoribbon for Future VLSI Applications: A Review -- 5.1 Introduction -- 5.1.1 Significance of Nano-Scale Reign -- 5.1.2 Importance of Repeaters -- 5.1.3 Interconnect Models -- 5.1.4 Lumped Model -- 5.1.5 Distributed Model -- 5.1.6 Aluminum and Copper as Interconnects -- 5.1.7 Graphene Nanoribbon as Interconnects -- 5.1.8 Classification of GNRs -- 5.1.9 Fundamental Physics -- 5.1.10 According to Structure and Conductivity -- 5.1.11 GNR Field Effect Transistor (GNRFET) -- 5.1.12 Model Development of GNRFET -- 5.1.13 Pros and Cons of GNRFET -- 5.2 Future Applications of Graphene and Graphene-Based FETs -- References -- Chapter 6 Ferroelectric Random Access Memory (FeRAM) -- 6.1 Introduction -- 6.1.1 Basic Characteristics of Ferroelectric Capacitors -- 6.1.2 FRAM Fabrication Process -- 6.2 Structure of Ferroelectric Memory Cells in Capacitor-Type FRAM Devices -- 6.2.1 A Capacitor-Type FRAM with a Memory Cell Resembling DRAM -- 6.3 Write/Read Operations in the FRAM Using a Capacitor- Type Memory Cell that Resembles a DRAM -- 6.4 Other Capacitor-Type FRAM -- 6.5 FRAM of FET Type -- 6.6 Memory Utilizing a Ferroelectric Tunnel Junction -- 6.6.1 Previous Ferroelectric Memory Designs -- 6.7 Cross Point Matrix Array -- 6.8 Ferroelectric Shadow RAMs -- 6.9 2T2C Ferroelectric RAM Architecture -- 6.9.1 Evaluation of FRAM Devices' Reliability -- 6.9.2 Comparative Analysis of FeRAM to Other Memory Technologies -- 6.10 FeRAM vs. …”

Tabla de Contenidos: “…Front Cover -- Network Algorithmics -- Copyright -- Contents -- Preface to the second edition -- Preface -- Audience -- What this book is about -- Organization of the book -- Features -- Usage -- Why this book was written -- Acknowledgments -- 15 principles used to overcome network bottlenecks -- Part 1 The rules of the game -- 1 Introducing network algorithmics -- 1.1 The problem: network bottlenecks -- 1.1.1 Endnode bottlenecks -- 1.1.2 Router bottlenecks -- 1.2 The techniques: network algorithmics -- 1.2.1 Warm-up example: scenting an evil packet -- 1.2.2 Strawman solution -- 1.2.3 Thinking algorithmically -- 1.2.4 Refining the algorithm: exploiting hardware -- 1.2.5 Cleaning up -- 1.2.6 Characteristics of network algorithmics -- 1.3 Exercise -- 2 Network implementation models -- 2.1 Protocols -- 2.1.1 Transport and routing protocols -- 2.1.2 Abstract protocol model -- 2.1.3 Performance environment and measures -- 2.2 Hardware -- 2.2.1 Combinatorial logic -- 2.2.2 Timing and power -- 2.2.3 Raising the abstraction level of hardware design -- 2.2.4 Memories -- Registers -- SRAM -- Dynamic RAM -- Page-mode DRAMs -- Interleaved DRAMs -- 2.2.5 Memory subsystem design techniques -- 2.2.6 Component-level design -- 2.2.7 Final hardware lessons -- 2.3 Network device architectures -- 2.3.1 Endnode architecture -- 2.3.2 Router architecture -- Lookup -- Switching -- Queuing -- Header validation and checksums -- Route processing -- Protocol processing -- Fragmentation, redirects, and ARPs -- 2.4 Operating systems -- 2.4.1 Uninterrupted computation via processes -- 2.4.2 Infinite memory via virtual memory -- 2.4.3 Simple I/O via system calls -- 2.5 Summary -- 2.6 Exercises -- 3 Fifteen implementation principles -- 3.1 Motivating the use of principles-updating ternary content-addressable memories -- 3.2 Algorithms versus algorithmics…”

Tabla de Contenidos: “…Semiconductor Memory Devices -- 12.1 | Semiconductor Memory -- 12.2 | Dynamic RAM -- 12.3 | Synchronous DRAM (SDRAM) -- 12.4 | ROM (Read Only Memory) -- 12.5 | Cache Memory -- 12.6 | Mapping Techniques -- 12.7 | Cache and the x86 Family -- Key Points of this chapter -- Questions -- Exercises -- 13. …”

Tabla de Contenidos: “…Scale-Out -- Rack-Optimized Servers -- Blade Servers -- Server Sprawl -- Virtualization -- Server Deployment Today -- Unified Computing System (UCS) -- Chapter 2 Server Architectures -- The Processor Evolution -- Sockets -- Cores -- Threads -- Intel® Hyper-Threading Technology -- Front-Side Bus -- Dual Independent Buses -- Dedicated High-Speed Interconnect -- Intel® QuickPath Interconnect -- The Memory Subsystem -- SRAMs -- DRAMs -- SDRAMs -- DIMMs -- ECC and Chipkill® -- Memory Ranks -- UDIMMs and RDIMMs -- DDR2 and DDR3 -- The I/O Subsystem -- PCI Express® -- Intel Microarchitectures -- Platform Architecture -- CPU Architecture -- Virtualization Support -- Advanced Reliability -- Advanced Encryption Standard -- Trusted Execution Technology -- Chip Design -- Chipset Virtualization Support -- Intel® VT-d for Direct I/O -- Intel® VT-c for Connectivity -- VMDirectPath® -- Chapter 3 UCS Enabling Technologies -- Unified Fabric -- 10 Gigabit Ethernet -- Lossless Ethernet -- Terminology -- PFC (Priority-Based Flow Control) -- DCBX: Data Center Bridging eXchange -- Bandwidth Management -- FCoE (Fibre Channel over Ethernet) -- Virtualization -- Server Virtualization -- SR-IOV -- The IEEE Standard Effort -- Port Extenders and Virtualization -- VNTag -- Fabric Extenders -- VN-Link -- Memory Expansion -- Speed vs. …”

Tabla de Contenidos: “…1.8 History of Embedded Systems -- 1.9 Current Trends -- Conclusion -- Key Points of this Chapter -- Questions -- Exercises -- Chapter 2: Embedded Systems-The Hardware Point of View -- Introduction -- 2.1 Microcontroller Unit (MCU) -- 2.1.1 The Processor -- 2.1.2 The Harvard Architecture -- 2.2 A Popular 8-bit MCU -- 2.2.1 General Purpose I/O (GPIO) -- 2.2.2 Clock -- 2.2.3 Power on Reset -- 2.2.4 Brown Out Reset -- 2.2.5 Timers and Counters -- 2.2.6 Watchdog Timer -- 2.2.7 Real-time Clock (RTC) -- 2.2.8 Stack -- 2.2.9 Interrupts -- 2.2.10 DMA -- 2.2.11 Communication Ports -- 2.3 Memory for Embedded Systems -- 2.3.1 Semiconductor Memory -- 2.3.2 Random Access Memory (RAM) -- 2.3.3 Dynamic RAM (DRAM) -- 2.3.4 ROM (Read Only Memory) -- 2.3.5 Caches -- 2.4 Low Power Design -- 2.5 Pullup and Pulldown Resistors -- 2.5.1 Floating State of an Input -- 2.5.2 Pulldown and Pullup Resistances -- 2.5.3 Open Collector/Open Drain Gates -- 2.5.4 Weak and Strong Pullup -- 2.5.5 High Impedance State, Hi-Z -- Conclusion -- Key Points of this Chapter -- Questions -- Exercises -- Chapter 3: Sensors, ADCs and Actuators -- Introduction -- 3.1 Sensors -- 3.1.1 Temperature Sensors -- 3.1.2 Light Sensors -- 3.1.3 Proximity/Range Sensors -- 3.1.4 Encoders -- 3.1.5 Humidity Sensors -- 3.1.6 Other Sensors -- 3.2 Analog to Digital Converters -- 3.2.1 ADC Interfacing * -- 3.3 Actuators -- 3.3.1 Displays -- 3.3.2 Motors -- 3.3.3 Optocouplers/Opto Isolators -- 3.3.4 Relays -- Conclusion -- Key Points of this Chapter -- Questions -- Exercises -- Chapter 4: Examples of Embedded Systems -- Introduction -- 4.1 Mobile Phone -- 4.1.1 Block Diagram -- 4.1.2 The Cellular Concept -- 4.1.3 Multiple Access -- 4.1.4 Frequency Re-use -- 4.1.5 Handoff (Handover) -- 4.1.6 Spread Spectrum Techniques -- 4.1.7 Set Up and Maintanence -- 4.1.8 Conclusion -- 4.2 Automotive Electronics…”

Tabla de Contenidos: “…Cover -- Inside Front Cover -- Title Page -- Copyright Page -- Dedication -- Contents -- Foreword -- Preface -- About the Author -- Part One Introduction -- Chapter 1 Basic Concepts and Computer Evolution -- 1.1 Organization and Architecture -- 1.2 Structure and Function -- 1.3 A Brief History of Computers -- 1.4 The Evolution of the Intel x86 Architecture -- 1.5 Embedded Systems -- 1.6 Arm Architecture -- 1.7 Cloud Computing -- 1.8 Key Terms, Review Questions, and Problems -- Chapter 2 Performance Issues -- 2.1 Designing for Performance -- 2.2 Multicore, Mics, and Gpgpus -- 2.3 Two Laws that Provide Insight: Ahmdahl's Law and Little's Law -- 2.4 Basic Measures of Computer Performance -- 2.5 Calculating the Mean -- 2.6 Benchmarks and Spec -- 2.7 Key Terms, Review Questions, and Problems -- Part Two The Computer System -- Chapter 3 A Top- Level View of Computer Function and Interconnection -- 3.1 Computer Components -- 3.2 Computer Function -- 3.3 Interconnection Structures -- 3.4 Bus Interconnection -- 3.5 Point-to-Point Interconnect -- 3.6 Pci Express -- 3.7 Key Terms, Review Questions, and Problems -- Chapter 4 Cache Memory -- 4.1 Computer Memory System Overview -- 4.2 Cache Memory Principles -- 4.3 Elements of Cache Design -- 4.4 Pentium 4 Cache Organization -- 4.5 Key Terms, Review Questions, and Problems -- Appendix 4A Performance Characteristics of Two- Level Memories -- Chapter 5 Internal Memory -- 5.1 Semiconductor Main Memory -- 5.2 Error Correction -- 5.3 DDR Dram -- 5.4 Flash Memory -- 5.5 Newer Nonvolatile Solid-State Memory Technologies -- 5.6 Key Terms, Review Questions, and Problems -- Chapter 6 External Memory -- 6.1 Magnetic Disk -- 6.2 Raid -- 6.3 Solid State Drives -- 6.4 Optical Memory -- 6.5 Magnetic Tape -- 6.6 Key Terms, Review Questions, and Problems -- Chapter 7 Input/Output -- 7.1 External Devices -- 7.2 I/O Modules…”

Tabla de Contenidos: “…Divestitures -- Third Party Assessment and Monitoring -- Outsourcing and Offshoring -- Types of Attackers -- Hackers -- Script Kiddies -- Outsiders -- Insiders -- Hacktivist -- Bots and Botnets -- Phishers and Spear Phishers -- Summary of Exam Objectives -- Self-Test -- Self-Test Quick Answer Key -- References -- Chapter 3: Domain 2: Asset Security -- Unique Terms and Definitions -- Introduction -- Classifying Data -- Labels -- Security Compartments -- Clearance -- Formal Access Approval -- Need to Know -- Sensitive Information/Media Security -- Sensitive Information -- Handling -- Storage -- Retention -- Ownership and Inventory -- Asset Inventory -- Asset Retention -- Business or Mission Owners -- Data Owners -- System Owner -- Custodian -- Users -- Data Controllers and Data Processors -- Data Location -- Data Maintenance -- Data Loss Prevention -- Digital Rights Management -- Cloud Access Security Brokers -- Data Collection Limitation -- Memory and Remanence -- Data Remanence -- Memory -- Cache Memory -- RAM and ROM -- DRAM and SRAM -- Firmware -- Flash Memory -- Solid State Drives (SSDs) -- Data Destruction -- Overwriting -- Degaussing -- Destruction -- Shredding -- Determining Data Security Controls -- Certification and Accreditation -- Standards and Control Frameworks -- Standards Selection -- PCI-DSS -- OCTAVE -- ISO 17799 and the ISO 27000 Series -- COBIT -- ITIL -- Scoping and Tailoring -- Data States -- Protecting Data in Use -- Protecting Data in Transit -- Drive and Tape Encryption -- Media Storage and Transportation -- Summary of Exam Objectives -- Self-Test -- Self-Test Quick Answer Key -- References -- Chapter 4: Domain 3: Security Architecture and Engineering -- Unique Terms and Definitions -- Introduction -- Secure Design Principles -- Threat Modeling -- Least Privilege and Defense-in-Depth -- Secure Defaults -- Privacy by Design…”

Tabla de Contenidos: “…Quiz -- RAM Basics -- RAM Types -- DRAM -- SRAM -- SDRAM -- DDR SDRAM -- DDR2 SDRAM -- Rambus -- Operational Characteristics -- Comparison of Memory Modules -- Memory Module Width -- Parity and Non-Parity Memory -- ECC and Non-ECC Memory -- Registered and Unbuffered Memory -- Single-Sided and Double-Sided Memory -- Installing Memory Modules -- Installing DIMMs and Rambus RDRAM Modules -- Troubleshooting Memory -- Verifying RAM Compatibility…”