Tabla de Contenidos: “….); 1.1 CONECTORES; 1.1.1 CONECTORES EXTERNOS; 1.1.2 CONECTORES INTERNOS; 1.2 LA CAJA O CHASIS; 1.2.1 MATERIAL DE LAS CAJAS; 1.2.2 FORMATOS MÁS USUALES; 1.2.3 POSIBILIDADES DE EXPANSIÓN; 1.3 LA PLACA BASE; 1.3.1 FORMATOS MÁS USUALES; 1.3.2 FORMATOS MÁS REDUCIDOS; 1.3.3 ELEMENTOS DE LA PLACA BASE; 1.3.4 EL SOCKET O ZÓCALO DE LA CPU; 1.4 EL CHIPSET; 1.4.1 EL NORTHBRIDGE; 1.4.2 EL SOUTHBRIDGE; 1.5 LA MEMORIA RAM; 1.5.1 PARÁMETROS FUNDAMENTALES DE LA MEMORIA…”

Tabla de Contenidos: “…-- Building an M5Stack Core Snap Circuits numbers and letters device -- Game selection procedure -- The M5Stack Core controller's software -- Building an M5Stack Core Snap Circuits alarm device -- Building an M5Stack Core Snap Circuits counter with a sound device -- Summary -- Interactive quiz answers -- Chapter 5: Solderless Breadboarding with the M5Stack -- Technical requirements -- An introduction to electronic interfacing circuits -- Building a discrete transistor LED electronic flasher -- Building a discrete transistor DC motor driver circuit -- Building a littleBits temperature sensor M5Stack Core simulator monitor -- An M5Stack controller littleBits LED flasher -- Summary -- Interactive quiz answers -- Quiz answers -- Chapter 6: M5Stack and Arduino -- Technical requirements -- M5Stack Core2 touchscreen UI controls introduction -- Building a touch control inverting switch -- Building a touch control counter -- Building a touch control relay controller -- Building a touch control LED dimmer controller -- Summary -- Interactive quiz answers -- Quiz answers -- Part 3: M5Stack IoT Projects -- Chapter 7: Working with M5Stack and Bluetooth -- Technical requirements -- The ESP32 microcontroller Bluetooth chipset -- UiFlow BLE coding blocks pallet overview -- Detecting an M5Stack Core Bluetooth signal with the Nordic Semiconductor nRF toolbox -- Building an M5Stack Bluetooth messenger device…”

Tabla de Contenidos: “…Chapter 6 - Millimeter-wave Circuits and Applications -- 6.1 Millimeter-wave Benchmark Circuits and Building Blocks -- 6.1.1 Benchmark Circuits -- 6.1.2 Circuit Building Blocks -- 6.1.2.1 W-band low-noise amplifier (LNA) with 0.5 V supply voltage -- 6.1.2.2 W-band low-power frequency tripler -- 6.2 Millimeter-wave and Terahertz Systems -- 6.2.1 240 GHz SiGe Chipset -- 6.2.1.1 Wideband LO signal generation -- 6.2.1.2 Transmitter building blocks -- 6.2.1.3 Receiver building blocks -- 6.2.1.4 Antenna design -- 6.2.1.5 Packaging and high-speed PCB design -- 6.2.1.6 Tx and Rx characterization -- 6.2.1.7 Ultra-high data rate wireless communication -- 6.2.2 210-270 GHz Circularly Polarized Radar -- 6.2.3 0.5 THz Computed Tomography -- 6.2.3.1 Components -- 6.2.3.2 Detector design -- 6.2.3.3 THz-CT results -- References -- Chapter 7 - Future of SiGe HBT Technology and Its Applications -- 7.1 Introduction -- 7.2 Technology Comparison -- 7.3 Future Millimeter-wave and THz Applications -- 7.3.1 Communication -- 7.3.2 Radar -- 7.3.3 Imaging and Sensing -- References -- Index -- About the Editors -- Back Cover…”

Tabla de Contenidos: “…Before and During the Video Test: The Beep Codes -- Text Errors -- Post Cards -- The Boot Process -- Care and Feeding of BIOS and CMOS -- Losing CMOS Settings -- Flashing ROM -- Beyond A+ -- UEFI -- Chapter Review -- Questions -- Answers -- Chapter 9 Motherboards -- Historical/Conceptual -- How Motherboards Work -- Form Factors -- 801 -- Chipset -- Motherboard Components -- Expansion Bus -- Structure and Function of the Expansion Bus -- PCI -- AGP -- PCI-X -- Mini-PCI -- PCI Express -- Installing Expansion Cards -- Troubleshooting Expansion Cards -- Upgrading and Installing Motherboards -- Choosing the Motherboard and Case -- Installing the Motherboard -- 802 -- Troubleshooting Motherboards -- Symptoms -- Techniques -- Options -- Chapter Review -- Questions -- Answers -- Chapter 10 Power Supplies -- Historical/Conceptual -- Understanding Electricity -- 801 -- Powering the PC -- Supplying AC -- Supplying DC -- Installing and Maintaining Power Supplies -- Installing -- Cooling -- 802 -- Troubleshooting Power Supplies -- No Motherboard -- Switches -- When Power Supplies Die Slowly -- Fuses and Fire -- Beyond A+ -- It Glows! …”

Tabla de Contenidos: “…Setting up a bind shell -- Setting up reverse shells -- Antimalware evasion techniques -- Encoding payloads with MSFvenom -- Creating custom payloads with Shellter -- Working with wireless adapters -- Connecting wireless adapters to Kali Linux -- Connecting a wireless adapter with an RTL8812AU chipset -- Managing and Monitoring wireless modes -- Configuring Monitoring mode -- Using aircrack-ng to enable monitor mode -- Summary -- Further reading -- Chapter 9: Performing Network Penetration Testing -- Technical requirements -- Exploring password-based attacks -- Creating a keyword-based wordlist -- Generating a custom wordlist using Crunch -- Gaining access by exploiting SSH -- Exploiting Remote Desktop Protocol -- Performing host discovery -- Profiling a targeted system -- Identifying and exploiting vulnerable services -- Exploiting Linux-based systems -- Compromising Windows-based systems -- Exploiting vulnerable SMB services -- Cracking hashes with Hashcat -- Exploiting Windows Remote Management -- Exploiting ElasticSearch -- Exploiting Simple Network Management Protocol -- Summary -- Further reading -- Chapter 10: Post-Exploitation Techniques -- Technical requirements -- Pass-the-hash techniques -- Gaining a shell with PTH-WinExe -- Working with Impacket -- Pass-the-hash for remote desktop -- Post exploitation using Meterpreter -- Core operations -- User interface options -- File transfers -- Privilege escalation -- Token stealing and impersonation -- Setting up persistence -- Lateral movement and pivoting -- Clearing tracks -- Data encoding and exfiltration -- Encoding using exe2hex -- Exfiltration with PacketWhisper -- Part 1 - setting up the environment -- Part 2 - changing the DNS settings on the targeted system -- Part 3 - performing data exfiltration -- Part 4 - reassembling data -- Man-in-the-Middle (MiTM) attacks…”

Tabla de Contenidos:

Tabla de Contenidos: “…Intro -- Title Page -- Copyright Page -- About the Author -- About the Contributing Author -- About the Technical Reviewer -- Brief Contents -- Contents in Detail -- Foreword by Chris Evans -- Acknowledgments -- Introduction -- Why Car Hacking Is Good for All of Us -- What's in This Book -- Chapter 1: Understanding Threat Models -- Finding Attack Surfaces -- Threat Modeling -- Level 0: Bird's-Eye View -- Level 1: Receivers -- Level 2: Receiver Breakdown -- Threat Identification -- Level 0: Bird's-Eye View -- Level 1: Receivers -- Level 2: Receiver Breakdown -- Threat Rating Systems -- The DREAD Rating System -- CVSS: An Alternative to DREAD -- Working with Threat Model Results -- Summary -- Chapter 2: Bus Protocols -- The CAN Bus -- The OBD-II Connector -- Finding CAN Connections -- CAN Bus Packet Layout -- The ISO-TP Protocol -- The CANopen Protocol -- The GMLAN Bus -- The SAE J1850 Protocol -- The PWM Protocol -- The VPW Protocol -- The Keyword Protocol and ISO 9141-2 -- The Local Interconnect Network Protocol -- The MOST Protocol -- MOST Network Layers -- MOST Control Blocks -- Hacking MOST -- The FlexRay Bus -- Hardware -- Network Topology -- Implementation -- FlexRay Cycles -- Packet Layout -- Sniffing a FlexRay Network -- Automotive Ethernet -- OBD-II Connector Pinout Maps -- The OBD-III Standard -- Summary -- Chapter 3: Vehicle Communication With SocketCAN -- Setting Up can-utils to Connect to CAN Devices -- Installing can-utils -- Configuring Built-In Chipsets -- Configuring Serial CAN Devices -- Setting Up a Virtual CAN Network -- The CAN Utilities Suite -- Installing Additional Kernel Modules -- The can-isotp.ko Module -- Coding SocketCAN Applications -- Connecting to the CAN Socket -- Setting Up the CAN Frame -- The Procfs Interface -- The Socketcand Daemon -- Kayak -- Summary -- Chapter 4: Diagnostics and Logging…”

Tabla de Contenidos: “…Scale-Out -- Rack-Optimized Servers -- Blade Servers -- Server Sprawl -- Virtualization -- Server Deployment Today -- Unified Computing System (UCS) -- Chapter 2 Server Architectures -- The Processor Evolution -- Sockets -- Cores -- Threads -- Intel® Hyper-Threading Technology -- Front-Side Bus -- Dual Independent Buses -- Dedicated High-Speed Interconnect -- Intel® QuickPath Interconnect -- The Memory Subsystem -- SRAMs -- DRAMs -- SDRAMs -- DIMMs -- ECC and Chipkill® -- Memory Ranks -- UDIMMs and RDIMMs -- DDR2 and DDR3 -- The I/O Subsystem -- PCI Express® -- Intel Microarchitectures -- Platform Architecture -- CPU Architecture -- Virtualization Support -- Advanced Reliability -- Advanced Encryption Standard -- Trusted Execution Technology -- Chip Design -- Chipset Virtualization Support -- Intel® VT-d for Direct I/O -- Intel® VT-c for Connectivity -- VMDirectPath® -- Chapter 3 UCS Enabling Technologies -- Unified Fabric -- 10 Gigabit Ethernet -- Lossless Ethernet -- Terminology -- PFC (Priority-Based Flow Control) -- DCBX: Data Center Bridging eXchange -- Bandwidth Management -- FCoE (Fibre Channel over Ethernet) -- Virtualization -- Server Virtualization -- SR-IOV -- The IEEE Standard Effort -- Port Extenders and Virtualization -- VNTag -- Fabric Extenders -- VN-Link -- Memory Expansion -- Speed vs. …”

Tabla de Contenidos: “…-- What's Included in the Book -- Interactive Online Learning Environment and Test Bank -- How to Use This Book -- The CompTIA A+ Exam Objectives -- A+ Certification Exam Objectives: 220-1101 -- Objective Map -- A+ Certification Exam Objectives: 220-1102 -- Objective Map -- Assessment Test for Exam 220-1101 -- Answers to Assessment Test 220-1101 -- Assessment Test for Exam 220-1102 -- Answers to Assessment Test 220-1102 -- Part I 220-1101 -- Chapter 1 Motherboards, Processors, and Memory -- Understanding Motherboards -- Motherboard Form Factors -- System Board Components -- Understanding Processors -- CPU Architecture -- CPU Characteristics -- Understanding Memory -- Important Memory Terms -- Types of Memory -- Memory Packaging -- Understanding Cooling Systems -- Fans -- Memory Cooling -- Hard Drive Cooling -- Chipset Cooling -- CPU Cooling -- Summary -- Exam Essentials -- Review Questions -- Performance-Based Question 1 -- Performance-Based Question 2 -- Chapter 2 Expansion Cards, Storage Devices, and Power Supplies -- Installing and Configuring Expansion Cards -- Video -- Multimedia -- Network Interface Card -- Input/Output -- Adapter Configuration -- Understanding Storage Devices -- Hard Disk Drive Systems -- Solid-State Drives -- RAID -- Removable Storage and Media -- Installing, Removing, and Configuring Storage Devices -- Understanding Power Supplies -- Power Supply Input -- Power Supply Output and Ratings -- Power Connectors -- Modular Power Supplies -- Redundant Power Supplies…”

“…Network requirements such as spectrum; chipsets, software and handsets which enable multimedia services; delivery platforms and content protection technologies which provide revenue assurance are covered in detail. …”

“…Learn about the key enablers of a mobile TV service, like smartphones, chipsets, and mobile software. Gain access to…”

“…Updates include new CPUs like the Intel Core i Series and AMD’s Phenom family...solid state drives (SSDs) and hard disk drives...motherboard form factors, chipsets, power supplies, DDR3 memory, Windows 7 readiness, and a whole lot more! …”

“…You'll also learn to assess a device physically by opening it, looking at the PCB, and identifying the chipsets and interfaces. You'll then use that information to gain entry to the device or to perform other actions, such as dumping encryption keys and firmware. …”

Tabla de Contenidos: “…-- 2.1 Server als Definitionssache -- 2.2 Von Hosts und Servern -- 2.3 Warum ein PC kein Server ist -- 2.4 Bauformen von Servern -- 2.5 Alles eine Frage der Höheneinheit -- 2.6 KVMs -- 2.7 Fragen zu diesem Kapitel -- Kapitel 3: Serverhardware -- 3.1 Die Architektur von Servern -- 3.1.1 Alt, aber noch vorhanden: PCI -- 3.1.2 PCI-X -- 3.1.3 PCI-Express -- 3.1.4 Die Weiterentwicklungen bei Intel -- 3.1.5 Die Bussysteme im Vergleich -- 3.1.6 Chipsets im Vergleich -- 3.2 Prozessoren für Server -- 3.2.1 Technische Funktion der CPU -- 3.2.2 Hardwarevirtualisierung via Prozessor -- 3.2.3 Mehrkernprozessoren -- 3.2.4 Cache-Speicher (Pufferspeicher) -- 3.3 Der Arbeitsspeicher -- 3.3.1 Unterschiedliche Funktionsweisen -- 3.3.2 Aufbau von RAM-Bausteinen -- 3.3.3 Fehlerbehandlung -- 3.3.4 Aktuelle RAM-Typen -- 3.3.5 Single Channel, Dual Channel, Quad Channel -- 3.3.6 Bauformen -- 3.4 Kühlung von Servern -- 3.4.1 Wärmeleitpaste -- 3.4.2 Lüfter -- 3.4.3 Kühlkörper -- 3.4.4 Wasserkühlung -- 3.5 Hot-Plug-Architekturen -- 3.6 BIOS in ROM? …”

Tabla de Contenidos: “…Auflage -- Kapitel 2: Vorbereitung auf CompTIA A+ -- 2.1 Prüfen Sie Ihr Wissen -- 2.2 Fragen zu einem Computersystem -- 2.2.1 Die Front eines PC-Systems -- 2.2.2 Rückseitige Anschlüsse -- 2.2.3 Blick auf das Mainboard -- Teil I: Alles Blech oder was -- Kapitel 3: Vom Bit bis zum Personal Computer -- 3.1 Die Welt der Elektronik -- 3.2 Ganz klein und ganz groß -- 3.3 Der Personal Computer -- 3.4 Vom Laptop bis zum Smartphone -- 3.5 Smart sind die Geräte -- 3.5.1 Unterhaltung -- 3.5.2 Wearable Computer -- 3.6 Fragen zu diesem Kapitel -- Kapitel 4: Einblick in die Systemarchitektur -- 4.1 Die Systemzentrale: Der Prozessor -- 4.1.1 Single Core, Dual Core, noch mehr Core -- 4.1.2 Intel Core i und AMD Zen -- 4.1.3 Sockel für Prozessoren -- 4.1.4 Die technische Funktion der CPU -- 4.1.5 Der Cache -- 4.2 Mainboard-Komponenten -- 4.2.1 Das Chipset -- 4.2.2 Der DMA-Controller -- 4.2.3 Der Interrupt-Controller -- 4.2.4 Der Taktgeber -- 4.2.5 Mainboard-Formfaktoren -- 4.3 Der Arbeitsspeicher -- 4.3.1 Aufbau von RAM-Bausteinen -- 4.3.2 Aktuelle RAM-Typen hören auf den Namen DDR -- 4.3.3 Single Channel, Dual Channel, Quad Channel -- 4.3.4 Bauformen -- 4.3.5 Was folgt nach DDR4? …”

Tabla de Contenidos: “…Auflage -- Kapitel 2: Vorbereitung auf CompTIA A+ -- 2.1 Prüfen Sie Ihr Wissen -- 2.2 Fragen zu einem Computersystem -- 2.2.1 Die Front eines PC-Systems -- 2.2.2 Rückseitige Anschlüsse -- 2.2.3 Blick auf das Mainboard -- Teil I: Alles Blech oder was -- Kapitel 3: Vom Bit bis zum Personal Computer -- 3.1 Die Welt der Elektronik -- 3.1.1 Darstellung von Zahlen -- 3.1.2 Darstellung von Texten -- 3.1.3 Darstellung von Bildern -- 3.1.4 Darstellung von Tönen -- 3.2 Ganz klein und ganz groß -- 3.3 Der Personal Computer -- 3.4 Vom Laptop bis zum Smartphone -- 3.5 Smart sind die Geräte -- 3.5.1 Unterhaltung -- 3.5.2 Wearable Computer -- 3.6 Fragen zu diesem Kapitel -- Kapitel 4: Einblick in die Systemarchitektur -- 4.1 Die Systemzentrale: Der Prozessor -- 4.1.1 Single Core, Dual Core, noch mehr Core -- 4.1.2 Intel Core i und AMD Zen -- 4.1.3 Sockel für Prozessoren -- 4.1.4 Die technische Funktion der CPU -- 4.1.5 Der Cache -- 4.2 Mainboard-Komponenten -- 4.2.1 Das Chipset -- 4.2.2 Der DMA-Controller‌ -- 4.2.3 Der Interrupt-Controller‌ -- 4.2.4 Der Taktgeber‌ -- 4.2.5 Mainboard-Formfaktoren -- 4.3 Der Arbeitsspeicher -- 4.3.1 Aufbau von RAM-Bausteinen -- 4.3.2 Aktuelle RAM-Typen hören auf den Namen DDR -- 4.3.3 Single Channel, Dual Channel, Quad Channel -- 4.3.4 Bauformen -- 4.3.5 Was folgt nach DDR5? …”

Tabla de Contenidos: “…-- 2.1 Server als Definitionssache -- 2.2 Von Hosts und Servern -- 2.3 Warum ein PC kein Server ist -- Kapazität‌: -- Ausbaubarkeit‌: -- Physische Sicherheit‌: -- Eignung für den Dauerbetrieb‌: -- Lebenszeit von Systemen und Verfügbarkeit der Ersatzteile: -- 2.4 Bauformen von Servern -- 2.5 Alles eine Frage der Höheneinheit -- 2.6 KVMs -- 2.7 Out-of-Band-Management -- 2.8 Fragen zu diesem Kapitel -- Kapitel 3: Serverhardware -- 3.1 Die Architektur von Servern -- 3.1.1 Etwas Historie zu Beginn: PCI -- 3.1.2 PCI-X‌ -- 3.1.3 PCI Express -- 3.1.4 Die Weiterentwicklungen bei Intel -- 3.1.5 Die Bussysteme im Vergleich -- 3.1.6 Chipsets im Vergleich -- 3.2 Prozessoren für Server -- 3.2.1 Technische Funktion der CPU -- 3.2.2 Hardware-Virtualisierung via Prozessor -- 3.2.3 Mehrkernprozessoren -- 3.2.4 Cache-Speicher (Pufferspeicher) -- 3.3 Der Arbeitsspeicher -- 3.3.1 Unterschiedliche Funktionsweisen -- 3.3.2 Aufbau von RAM-Bausteinen -- 3.3.3 Fehlerbehandlung -- 3.3.4 Aktuelle RAM-Typen -- 3.3.5 Single Channel, Dual Channel, Quad Channel -- 3.3.6 Bauformen -- 3.4 Kühlung von Servern -- 3.4.1 Wärmeleitpaste -- 3.4.2 Lüfter -- 3.4.3 Kühlkörper -- 3.4.4 Wasserkühlung -- 3.5 Hot-Plug-Architekturen -- 3.6 Die wichtigsten Übertragungsmedien -- 3.6.1 Twisted-Pair-Kabel -- 3.6.2 Unshielded Twisted Pair -- 3.6.3 Shielded Twisted Pair‌ -- 3.6.4 Koaxialkabel -- 3.6.5 Lichtwellenleiter‌ -- 3.7 Netzwerkkarten -- 3.7.1 Wake on LAN‌ -- 3.7.2 Adapter Teaming -- 3.7.3 Medienkonverter -- 3.8 Virtuelle Netzwerkkomponenten -- 3.9 BIOS in ROM? …”

Tabla de Contenidos: “…14.5.1 Signalling Flows 322 -- 14.5.2 Performance 326 -- 14.6 Summary 331 -- References 331 -- 15 Inter-layer Mobility Optimization 333 /Jari Salo and Jussi Reunanen -- 15.1 Introduction 333 -- 15.2 Inter-layer Idle Mode Mobility and Measurements 334 -- 15.2.1 Initial Cell Selection and Minimum Criteria for UE to Camp on a Cell 334 -- 15.2.2 Summary of Cell Reselection Rules 336 -- 15.2.3 Idle Mode Measurements 338 -- 15.3 Inter-layer Connected Mode Measurements 344 -- 15.4 Inter-layer Mobility for Coverage-Limited Network 350 -- 15.4.1 Basic Concepts 350 -- 15.4.2 Mapping Throughput Target to SINR, RSRQ and RSRP 353 -- 15.4.3 Inter-layer Mobility Example #1 (Non-equal Priority Non-equal Bandwidth LTE Layers) 361 -- 15.4.4 Inter-layer Mobility Example #2 (Equal Priority Equal Bandwidth LTE Layers) 368 -- 15.5 Inter-layer Mobility for Capacity-Limited Networks 370 -- 15.5.1 Static Load Balancing via Mobility Thresholds 371 -- 15.5.2 Dynamic Load Balancing via eNodeB Algorithms 375 -- 15.6 Summary 377 -- References 377 -- 16 Smartphone Optimization 379 /Rafael Sanchez-Mejias, Laurent NoŠ el and Harri Holma -- 16.1 Introduction 379 -- 16.2 Smartphone Traffic Analysis in LTE Networks 380 -- 16.2.1 Data Volumes and Asymmetry 380 -- 16.2.2 Traffic-Related Signalling 381 -- 16.2.3 Mobility-Related Signalling 382 -- 16.2.4 User Connectivity 382 -- 16.3 Smartphone Power Consumption Optimization 384 -- 16.3.1 Impact of Downlink Carrier Aggregation 384 -- 16.3.2 Impact of Discontinuous Reception 385 -- 16.4 Smartphone Operating Systems 391 -- 16.5 Messaging Applications 391 -- 16.6 Streaming Applications 393 -- 16.7 Voice over LTE 394 -- 16.7.1 VoLTE System Architecture 395 -- 16.7.2 VoLTE Performance Analysis 396 -- 16.7.3 Standby Performance 404 -- 16.7.4 Impact of Network Loading and Radio Quality 405 -- 16.8 Smartphone Battery, Baseband and RF Design Aspects 406 -- 16.8.1 Trends in Battery Capacity 406 -- 16.8.2 Trends in Cellular Chipset Power Consumption 409 -- 16.8.3 Impact of Small Cells on Smartphone Power Consumption 412.…”

“…The recent development of various application systems and platforms, such as 5G, B5G, 6G, and IoT, is based on the advancement of CMOS integrated circuit (IC) technology that enables them to implement high-performance chipsets. In addition to development in the traditional fields of analog and digital integrated circuits, the development of CMOS IC design and application in high-power and high-frequency operations, which was previously thought to be possible only with compound semiconductor technology, is a core technology that drives rapid industrial development. …”

“…Get details on regulatory and technical organizations Learn about different wireless standards and the basics of RF technologies Understand and determine client-side hardware requirements, including chipsets and various wireless interfaces Select infrastructure-side wireless hardware, such as antennas, wireless access points (WAPs), residential gateways, switches/controllers, routers, and bridges Learn about WLANs, WWANs, WMANs, and WPANs Work with standard wireless network protocols--TCP/IP (IPv4 and IPv6) Understand DNS, DHCP, and other supporting infrastructure services Secure wireless networks using cryptography Configure infrastructure devices, including a wireless access point device and wireless network switches and controllers Configure and manage wireless Microsoft Windows, Mac OS X, and Linux clients Plan, design, survey, deploy, and troubleshoot your wireless network…”