Cita APA (7a ed.)

Morris, J. E. (1993). Electronics packaging forum. Multichip module technology issues (1a ed.). I.E.E.E.

Cita Chicago Style (17a ed.)

Morris, James E. Electronics Packaging Forum. Multichip Module Technology Issues. 1a ed. New York: I.E.E.E, 1993.

Cita MLA (9a ed.)

Morris, James E. Electronics Packaging Forum. Multichip Module Technology Issues. 1a ed. I.E.E.E, 1993.