Handbook of 3D integration. Volume 4, Design, test, and thermal management

Handbook of 3D integration Volume 4, Design, test, and thermal management Volume 4, Design, test, and thermal management /

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of...

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Bibliographic Details
Other Authors: Franzon, Paul D., editor (editor), Marinissen, Eric Jan, editor, Bakir, Muhannad S., editor
Format: eBook
Language:Inglés
Published: Weinheim, Germany : Wiley-VCH [2019]
Subjects:
Three-dimensional integrated circuits > Design and construction > Handbooks, manuals, etc.
Three-dimensional imaging > Handbooks, manuals, etc.
See on Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009752717906719

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