Proceedings of the Thirteenth International Conference on Tangible, Embedded, and Embodied Interaction

Welcome to ACM TEI 2019, the 13th International Conference on Tangible, Embedded and Embodied Interactions, hosted in Tempe, Arizona, United States, from the 17th to the 20th of March 2019. The TEI conference features top-tier work that addresses issues of human-computer interaction, novel tools and...

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Detalles Bibliográficos
Otros Autores: Kuznetsov, Stacey, author (author)
Formato: Libro electrónico
Idioma:Inglés
Publicado: New York, NY, USA : ACM 2019.
Colección:ACM Conferences
Materias:
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009714289306719

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