TEI '15 : Proceedings of the Ninth International Conference on Tangible, Embedded, and Embodied Interaction

TEI '15 Proceedings of the Ninth International Conference on Tangible, Embedded, and Embodied Interaction

Welcome to ACM TEI 2015, the 9th International Conference on Tangible, Embedded and Embodied Interaction, hosted at Stanford University in California, USA from January 15th to January 19th, 2015! This year's conference continues TEI's tradition of being the premiere forum for research and...

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Detalles Bibliográficos
Otros Autores: Verplank, Bill, author (author)
Formato: Libro electrónico
Idioma:Inglés
Publicado: New York, NY : Association for Computing Machinery 2015.
Colección:ACM Conferences
Materias:
Embedded computer systems > Congresses.
Human-computer interaction > Congresses.
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009712903706719

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