TEI '14 : proceedings of the eighth International Conference on Tangible, Embedded and Embodied Interaction : Munich, Germany, February 16-19, 2014

Bibliographic Details
Main Author: Butz, Andreas (-)
Corporate Authors: International Conference on Tangible, Embedded and Embodied Interaction Corporate Author (corporate author), International Conference on Tangible, Embedded and Embodied Interaction (-), SIGCHI (Group : U.S.) Content Provider (content provider)
Format: eBook
Language:Inglés
Published: [Place of publication not identified] ACM 2013
Series:ACM Conferences
Subjects:
See on Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009712899706719

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