International Conference on Software Engineering, ACM Sigsoft, sponsoring body, Erdogmus, H., & Péraire, C. (2017). SECM 2017: 2017 IEEE/ACM 1st International Workshop on Software Engineering Curricula for Millennials : proceedings : 27 May 2017, Buenos Aires, Argentina. IEEE Press.
Cita Chicago Style (17a ed.)International Conference on Software Engineering, sponsoring body ACM Sigsoft, Hakan Erdogmus, y Cécile Péraire. SECM 2017: 2017 IEEE/ACM 1st International Workshop on Software Engineering Curricula for Millennials : Proceedings : 27 May 2017, Buenos Aires, Argentina. Piscataway, New Jersey: IEEE Press, 2017.
Cita MLA (9a ed.)International Conference on Software Engineering, et al. SECM 2017: 2017 IEEE/ACM 1st International Workshop on Software Engineering Curricula for Millennials : Proceedings : 27 May 2017, Buenos Aires, Argentina. IEEE Press, 2017.
