Latest Advances in Electrothermal Models

This book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulati...

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Detalles Bibliográficos
Otros Autores:	Górecki, Krzysztof (Editor), Górecki, Paweł (Otro)
Formato:	Libro electrónico
Idioma:	Inglés
Publicado:	Basel, Switzerland MDPI - Multidisciplinary Digital Publishing Institute 2021
Materias:	History of engineering & technology Dual-Phase-Lag heat transfer model thermal simulation algorithm thermal measurements Finite Difference Method scheme Grünwald–Letnikov fractional derivative Krylov subspace-based model order reduction algorithm efficiency analysis relative error analysis algorithm convergence analysis computational complexity analysis finite difference method scheme BJT modelling self-heating silicon carbide SPICE IGBT DC–DC converter electrothermal model averaged model thermal phenomena diode–transistor switch power electronics multi-LED lighting modules device thermal coupling compact thermal models temperature sensors microprocessor throughput improvement inductors ferromagnetic cores thermal model transient thermal impedance thermal resistance electrothermal (ET) simulation finite-element method (FEM) model-order reduction (MOR) multicellular power MOSFET silicon carbide (SiC)
Ver en Biblioteca Universitat Ramon Llull:	https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009654560506719