Physical design for 3D integrated circuits

Detalles Bibliográficos
Otros Autores: Todri-Sanial, Aida, editor (editor), Tan, Chuan Seng, editor, Iniewski, Krzysztof, 1960- editor
Formato: Libro electrónico
Idioma:Inglés
Publicado: Boca Raton : Taylor & Francis [2016]
Edición:1st ed
Colección:Devices, circuits, and systems.
Materias:
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009633558706719
Tabla de Contenidos:
  • section 1. 3D integration overview
  • section 2. Physical design methods for 3D integration
  • section 3. Reliability concerns for 3D integration
  • section 4. CAD design tools and future directions for 3D physical design.