Advances in embedded and fan-out wafer level packaging technologies
Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging "FO-WLP" technologies have been developed across the industry over the...
| Otros Autores: | , |
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Hoboken, New Jersey, USA :
John Wiley & Sons, Inc
2019.
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| Edición: | First edition |
| Colección: | THEi Wiley ebooks.
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| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009631528806719 |
