APA (7th ed.) Citation

Keser, B., & Kroehnert, S. (2019). Advances in embedded and fan-out wafer level packaging technologies (First edition.). John Wiley & Sons, Inc.

Chicago Style (17th ed.) Citation

Keser, Beth, and Steffen Kroehnert. Advances in Embedded and Fan-out Wafer Level Packaging Technologies. First edition. Hoboken, New Jersey, USA: John Wiley & Sons, Inc, 2019.

MLA (9th ed.) Citation

Keser, Beth, and Steffen Kroehnert. Advances in Embedded and Fan-out Wafer Level Packaging Technologies. First edition. John Wiley & Sons, Inc, 2019.