Developments in surface contamination and cleaning : methods for surface cleaning

Developments in surface contamination and cleaning methods for surface cleaning

Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning, Volume 9 , part of the Developments in Surface Contamination and Cleaning series provide a state-of-the-art guide to the current knowledge on the behavior of film-type and particulate surface contaminants and their ass...

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Detalles Bibliográficos
Otros Autores: Kohli, Rajiv, author (author), Kohli, Rajiv, editor (editor), Mittal, K. L., editor
Formato: Libro electrónico
Idioma:Inglés
Publicado: Amsterdam, [Netherlands] : William Andrew 2017.
Edición:1st edition
Colección:Developments in Surface Contamination and Cleaning Series ; Volume 9
Materias:
Surfaces (Technology) > Inspection.
Surface contamination > Prevention.
Particles > Measurement.
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009630174306719
Tabla de Contenidos:
  • Front Cover
  • Developments in Surface Contamination and Cleaning
  • Copyright Page
  • Contents
  • List of Contributors
  • About the Editors
  • Preface
  • 1 Nonaqueous Cleaning Challenges for Preventing Damage to Fragile Nanostructures
  • 1 Introduction
  • 2 Water-Caused Problems in Device Fabrication
  • 2.1 High Resistivity of Water
  • 2.2 High Reactivity of Water with Silicon
  • 2.3 High Permittivity of Water
  • 2.4 Dissolution and Corrosion of Metals in Water
  • 2.5 High Surface Tension of Water
  • 3 HF Vapor Processing
  • 4 Cryogenic Aerosol Nitrogen Cleaning
  • 5 Supercritical Fluid Cleaning
  • 5.1 Wafer Drying with SCCO2
  • 5.2 Wafer Cleaning with SCCO2
  • 6 Pinpoint Cleaning
  • 6.1 Laser Cleaning
  • 6.2 Atomic Force Microscopy Nanoprobe Sweeping
  • 6.3 Nanotweezers Pickup
  • 7 Summary
  • References
  • 2 Gas-Phase Cleaning for Removal of Surface Contaminants
  • 1 Introduction
  • 2 Surface Contamination and Cleanliness Levels
  • 3 General Principles of Gas-Phase Cleaning
  • 4 Process Variables in Gas-Phase Cleaning
  • 4.1 Types of Gases
  • 4.2 Cleaning Process Parameters
  • 4.3 Gas Sources and Their Availability
  • 4.4 Types of Contaminants
  • 4.5 Types of Substrates
  • 5 Cleaning Systems
  • 6 Cost Benefits
  • 7 Advantages and Disadvantages of Gas-Phase Cleaning
  • 7.1 Advantages
  • 7.2 Disadvantages
  • 8 Applications
  • 8.1 Precision Cleaning and Etching
  • 8.1.1 Deposition Tool Chamber Cleaning
  • 8.1.2 Dry Etching and Micromachining
  • 8.1.3 Alternative Gas Chemistries
  • 8.2 Sterilization
  • 8.3 Microbial Decontamination
  • 8.3.1 Removal of Biofilms
  • 8.3.2 Decontamination of Biological Safety Cabinets
  • 8.3.3 Alternative Decontamination Agents
  • 8.3.4 Spacecraft Decontamination
  • 8.4 Nuclear Materials Decontamination
  • 8.4.1 Radioactively Contaminated Materials
  • 8.4.2 Gaseous Diffusion Technology Residues.
  • 8.4.3 Alternative Gas Chemistries for Fluorination of Actinide Species
  • 9 Summary
  • AcknowledgementS
  • Disclaimer
  • References
  • 3 Laser-Induced Spray Jet Cleaning
  • 1 Introduction
  • 2 Laser-Induced Spray Jet Cleaning
  • 2.1 Concept of Laser-Induced Spray Jet Cleaning
  • 2.2 Particle Removal Mechanism
  • 3 Nanoscale Particle Removal
  • 3.1 Experimental Setup
  • 3.2 Hydrodynamic Phenomena
  • 3.2.1 Effect of Incident Laser Energy (E)
  • 3.2.2 Effect of Droplet Position (s)
  • 3.2.3 Effect of Droplet Size (D)
  • 3.3 Cleaning Results
  • 3.3.1 Optimization of Microspray Jet
  • 3.3.2 Effect of Process Parameters
  • 3.3.3 Sub-100-nm Particle Cleaning
  • 4 LSJC Using Isopropyl Alcohol
  • 4.1 Hydrodynamic Phenomena
  • 4.2 Nanoscale Particle Cleaning
  • 4.3 Side Effects of LSJC
  • 5 Summary and Conclusions
  • Acknowledgements
  • References
  • 4 Brush Scrubbing for Post-CMP Cleaning
  • 1 Introduction
  • 2 Particle Removal Mechanism
  • 3 Process and Tool Kinematics
  • 4 Consumables
  • 4.1 Brush
  • 4.2 Chemical Formulations
  • 5 Related Issues
  • 6 Summary
  • Appendix: Application of Tribology to Post-CMP Brush Scrubbing
  • References
  • 5 Contamination Removal From UV and EUV Photomasks
  • 1 Introduction
  • 2 Effect of Photomask Contamination on Lithography Process
  • 2.1 Photomask for Lithography Process
  • 2.2 Photomask Contamination
  • 2.3 Impact of Contamination on Mask Properties and Imprinted Images
  • 3 Haze Effect on Photomask Surface
  • 3.1 Background
  • 3.2 Major Components of Haze
  • 3.3 Haze Control
  • 4 The Particle Removal Process
  • 4.1 Megasonic Cleaning
  • 4.2 Jet Spray Cleaning
  • 4.2.1 Gas Flow Rate
  • 4.2.2 Liquid Flow Rate
  • 4.2.3 Distance Between the Nozzle and the Photomask Surface
  • 4.2.4 Nozzle Design
  • 4.2.5 Other Parameters
  • 4.2.6 Challenges and Future Scope
  • 4.3 Aerosol Cleaning
  • 5 Organics Removal
  • 5.1 SPM Cleaning.
  • 5.2 Ozone Cleaning
  • 5.2.1 Ozone Reactions with Organics
  • 5.2.2 Ozone-Cleaning Process
  • 6 EUVL Mask Cleaning
  • 6.1 Impact of Contamination on EUV Mask
  • 6.2 Cleaning Process to Remove Hydrocarbon Contamination
  • 6.3 Cleaning Process to Remove Particle Contamination
  • 7 Summary
  • References
  • 6 Aqueous Displacement of Water-Immiscible Cleaning Solvents: Cleaning Enhancement Using Ultrasonics
  • 1 Background
  • 2 The Aqueous Displacement Solution Process
  • 3 ADS Cleaning Process Requirements and Parameters
  • 4 Drying
  • 4.1 Method 1
  • 4.2 Method 2
  • 4.3 Method 3
  • 4.4 Results
  • 5 Evaluation for Hydrophilicity and Wettability
  • 6 Results of Displacement Tests
  • 7 Cleanliness Evaluation Tests
  • 8 Summary
  • Acknowledgements
  • References
  • Index
  • Back Cover.

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