The Circuit designer's companion
The fourth edition of this classic work on circuit design gives you the understanding and practical know-how to produce optimized, reliable, cost-effective electronic circuits. It bridges the gap between the theoretical learning that most university courses provide and the practical knowledge and ap...
| Otros Autores: | |
|---|---|
| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
Oxford, England ; Cambridge, Massachusetts :
Newnes
2017.
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| Edición: | Fourth edition |
| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009630144906719 |
Tabla de Contenidos:
- Front Cover
- The Circuit Designer's Companion
- The Circuit Designer's Companion
- Copyright
- Contents
- Introduction
- INTRODUCTION TO THE FOURTH EDITION
- INTRODUCTION TO THE THIRD EDITION
- INTRODUCTION TO THE SECOND EDITION (TIM WILLIAMS,2004)
- INTRODUCTION TO THE FIRST EDITION (TIM WILLIAMS, 1990)
- 1 - Grounding and Wiring
- 1.1 GROUNDING
- When to Consider Grounding?
- 1.1.1 GROUNDING WITHIN ONE UNIT
- 1.1.2 CHASSIS GROUND
- 1.1.3 THE CONDUCTIVITY OF ALUMINUM
- 1.1.4 GROUND LOOPS
- 1.1.5 POWER SUPPLY RETURNS
- Varying Loads
- Power Rail Feed
- Conductor Impedance
- 1.1.6 INPUT SIGNAL GROUND
- Connection to 0V Elsewhere on the Printed Circuit Board
- Connection to 0V Within the Unit
- External Ground Connection
- 1.1.7 OUTPUT SIGNAL GROUND
- Avoiding the Common Impedance
- 1.1.8 INTERBOARD INTERFACE SIGNALS
- Partitioning the Signal Return
- 1.1.9 STAR-POINT GROUNDING
- 1.1.10 GROUND CONNECTIONS BETWEEN UNITS
- Breaking the Ground Link
- 1.1.11 SHIELDING
- Which End to Ground for Low-Frequency Shielding?
- Electrostatic Screening
- Surface Transfer Impedance
- 1.1.12 THE SAFETY EARTH
- 1.2 WIRING AND CABLES
- 1.2.1 WIRE TYPES
- Wire Inductance
- Equipment Wire
- Wire-Wrap Wire
- 1.2.2 CABLE TYPES
- 1.2.3 POWER CABLES
- 1.2.4 DATA AND MULTICORE CABLES
- Data Communication Cables
- Structured Data Cable
- Shielding and Microphony
- 1.2.5 RADIO FREQUENCY CABLES
- 1.2.6 TWISTED PAIR
- 1.2.7 CROSS TALK
- Digital Cross Talk
- 1.3 TRANSMISSION LINES
- Transmission Line Effects
- Critical Lengths for Pulses
- 1.3.1 CHARACTERISTIC IMPEDANCE
- 1.3.2 TIME DOMAIN
- Forward and Reflected Waves
- Ringing
- The Bergeron Diagram
- The Uses of Mismatching
- 1.3.3 FREQUENCY DOMAIN
- Standing Wave Distribution Versus Frequency
- Impedance Transformation
- Lossy Lines.
- Understanding the Transmission Line Impedance Graphically
- 2 - Printed Circuits
- 2.1 BOARD TYPES
- 2.1.1 MATERIALS
- Epoxy Glass
- 2.1.2 TYPE OF CONSTRUCTION
- 2.1.3 CHOICE OF TYPE
- 2.1.4 CHOICE OF SIZE
- Subdivision Boundaries
- Panelization
- 2.1.5 HOW A MULTILAYER BOARD IS MADE
- 2.2 DESIGN RULES
- 2.2.1 TRACK WIDTH AND SPACING
- Conductor Resistance
- Voltage Breakdown and Cross Talk
- Constant Impedance
- 2.2.2 HOLE AND PAD SIZE
- Vias
- Through Hole Pads
- Surface Mount Pads
- 2.2.3 TRACK ROUTING
- 2.2.4 GROUND AND POWER DISTRIBUTION
- Ground Rail Inductance
- Gridded Ground Layout
- The Ground Plane
- Inside or Outside Layers
- Multiple Ground Planes
- 2.2.5 COPPER PLATING AND FINISHING
- 2.2.6 SOLDER RESIST
- Screen-Printed Resists
- Photo-Imaged Film
- 2.2.7 TERMINATIONS AND CONNECTIONS
- Two-Part Connectors
- Edge Connectors
- 2.3 BOARD ASSEMBLY: SURFACE MOUNT AND THROUGH HOLE
- 2.3.1 SURFACE MOUNT DESIGN RULES
- Solder Process
- Printed Circuit Board Quality
- Thermal Stresses
- Cleaning and Testing
- 2.3.2 PACKAGE PLACEMENT
- 2.3.3 COMPONENT IDENTIFICATION
- Polarity Indication
- Guarding
- 2.3.4 UNDERSTANDING THERMAL BEHAVIOR
- Thermal Conduction
- Thermal Convection
- Thermal Radiation
- Thermal Capacity
- Thermal Expansion
- Thermal Shock
- Thermal Cycling
- Solder Cracking
- The Impact of Thermal Stress on Reliability
- 2.4 SURFACE PROTECTION
- Variations in Surface Resistance
- Circuit Design Versus Surface Resistance
- 2.4.1 CONFORMAL COATING
- Coating Versus Encapsulation
- Steps to Take Before Coating
- Application
- Test and Rework
- 2.5 SOURCING BOARDS AND ARTWORK
- 2.5.1 ARTWORK
- Using a Bureau
- Disadvantages of a Bureau
- 2.5.2 BOARDS
- 3 - Passive Components
- 3.1 RESISTORS
- 3.1.1 RESISTOR TYPES
- Surface Mount Chip
- Metal Film
- Carbon.
- Wirewound
- Precision Resistors
- Resistor Networks
- 3.1.2 TOLERANCING
- Basic Statistical Behavior
- Modeling Distributions
- Tolerance Variations
- 3.1.3 TEMPERATURE COEFFICIENT
- 3.1.4 POWER
- 3.1.5 INDUCTANCE
- 3.1.6 PULSE HANDLING
- Limiting Element Voltage
- 3.1.7 EXTREME VALUES
- Very Low Values
- Very High Values
- 3.1.8 FUSIBLE AND SAFETY RESISTORS
- 3.1.9 RESISTOR NETWORKS
- Production Efficiency
- Value Tracking: Thick Film Versus Thin Film
- 3.2 POTENTIOMETERS
- 3.2.1 TRIMMER TYPES
- Carbon
- Cermet
- Wirewound
- Multiturn
- 3.2.2 PANEL TYPES
- Carbon, Cermet, and Wirewound
- Conductive Plastic
- 3.2.3 POT APPLICATIONS
- Use as a Rheostat
- Adjustability
- Law Accuracy
- Manufacturing Processes
- 3.3 CAPACITORS
- 3.3.1 METALIZED FILM AND PAPER
- Polyester
- Polycarbonate
- Polypropylene and Polystyrene
- Metalized Paper
- 3.3.2 MULTILAYER CERAMICS
- COG
- X5R and X7R
- Y5V and Z5U
- 3.3.3 SINGLE-LAYER CERAMICS
- Barrier Layer
- Low-K and High-K Dielectrics
- 3.3.4 ELECTROLYTICS
- Construction
- Leakage
- Ripple Current and Equivalent Series Resistance
- Temperature and Lifetime
- Size and Weight
- 3.3.5 SOLID TANTALUM
- Tantalum Chip Capacitors
- 3.3.6 CAPACITOR APPLICATIONS
- Value Shifts
- 3.3.7 SERIES CAPACITORS AND DC LEAKAGE
- Adding Bleed Resistors
- 3.3.8 DIELECTRIC ABSORPTION
- 3.3.9 SELF-RESONANCE
- Consequences of Self-Resonance
- 3.4 INDUCTORS
- 3.4.1 PERMEABILITY
- Ferrites
- Iron Powder
- 3.4.2 MAGNETIC MATERIAL DEFINITIONS AND METRICS
- Hysteresis Loop Definitions
- Hysteresis Loop Metrics
- 3.4.3 INDUCTOR APPLICATIONS
- Tuned Circuits
- Power Circuits
- Suppression
- Leakage Inductance
- Measurement Methods
- Numerical Methods
- Issues With Unusual Winding Configurations
- 3.4.4 SELF-CAPACITANCE
- Measurement Methods
- 3.4.5 WINDING LOSSES.
- Background
- Theoretical Methods
- Measurement Methods
- Proximity Effect
- 3.4.6 THE DANGER OF INDUCTIVE TRANSIENTS
- Relay Coils
- Transient Protection
- Protection Against Negative Transients
- AC Circuits
- 3.5 CRYSTALS AND RESONATORS
- Angle of Cut
- 3.5.1 RESONANCE
- 3.5.2 OSCILLATOR CIRCUITS
- Drive Level Resistance
- Series Circuit
- Layout
- 3.5.3 TEMPERATURE
- 3.5.4 CERAMIC RESONATORS
- 4 - Active Components
- 4.1 DIODES
- 4.1.1 FORWARD BIAS
- Forward Current
- Temperature Dependence of Forward Voltage
- 4.1.2 REVERSE BIAS
- Breakdown
- 4.1.3 LEAKAGE
- Leakage Variability
- 4.1.4 HIGH-FREQUENCY PERFORMANCE
- 4.1.5 SWITCHING TIMES
- Reverse Recovery
- Interference Due to Fast Recovery
- 4.1.6 SCHOTTKY DIODES
- General Purpose
- RF Mixers
- Rectifiers
- 4.1.7 ZENER DIODES
- Slope Resistance
- Leakage
- Temperature Coefficient
- Precision Zeners
- Zener Noise
- 4.1.8 THE ZENER AS A CLAMP
- An Application Example
- 4.2 THYRISTORS AND TRIACS
- 4.2.1 THYRISTOR VERSUS TRIAC
- 4.2.2 TRIGGERING CHARACTERISTICS
- 4.2.3 FALSE TRIGGERING
- 4.2.4 CONDUCTION
- 4.2.5 SWITCHING
- Turn-Off
- 4.2.6 SNUBBING
- Values for R and C
- 4.3 BIPOLAR TRANSISTORS
- 4.3.1 LEAKAGE
- A Simple Leakage Example
- Adding a Base-Emitter Resistor
- 4.3.2 SATURATION
- 4.3.3 THE DARLINGTON
- 4.3.4 SAFE OPERATING AREA
- Second Breakdown
- Safe Operating Area Curve
- 4.3.5 GAIN
- 4.3.6 SWITCHING AND HIGH-FREQUENCY PERFORMANCE
- Speeding Up the Turn-Off
- 4.3.7 GRADING
- 4.4 JUNCTION FIELD-EFFECT TRANSISTORS
- 4.4.1 PINCH-OFF
- 4.4.2 APPLICATIONS
- Analog Switches
- RF Circuits
- Current Regulators
- 4.4.3 HIGH-IMPEDANCE CIRCUITS
- The Gate Current Breakpoint
- Depressed Zin
- 4.5 MOSFETS
- 4.5.1 LOW-POWER MOSFETS
- Gate Breakdown
- Protection for the Gate
- MOSFET Trade-Offs.
- 4.5.2 VERTICAL METAL-OXIDE SEMICONDUCTOR POWER FIELD-EFFECT TRANSISTORS
- 4.5.3 GATE DRIVE IMPEDANCE
- Gate-Source Overvoltage
- Source Lead Inductance
- 4.5.4 SWITCHING SPEED
- 4.5.5 ON-STATE RESISTANCE
- P-Channel Vertical Metal-Oxide Semiconductor
- 4.6 INSULATED GATE BIPOLAR TRANSISTORS
- 4.6.1 INSULATED GATE BIPOLAR TRANSISTOR STRUCTURE
- 4.6.2 ADVANTAGES OVER MOSFETS AND BIPOLARS
- 4.6.3 DISADVANTAGES
- 4.7 WIDE BAND GAP DEVICES
- 5 - Analog Integrated Circuits
- 5.1 THE IDEAL OP-AMP
- 5.1.1 APPLICATIONS CATEGORIES
- 5.2 THE PRACTICAL OP-AMP
- 5.2.1 OFFSET VOLTAGE
- Output Saturation Due to Amplified Offset
- Reducing the Effect of Offset
- Offset Drift
- Circuit Techniques to Remove the Effect of Drift
- 5.2.2 BIAS AND OFFSET CURRENTS
- Bias Current Levels
- Output Offsets Due to Bias and Offset Currents
- 5.2.3 COMMON-MODE EFFECTS
- Common-Mode Rejection Ratio
- Power Supply Rejection Ratio
- 5.2.4 INPUT VOLTAGE RANGE
- Absolute Maximum Input
- 5.2.5 OUTPUT PARAMETERS
- Power Rail Voltage
- Load Impedance
- 5.2.6 AC PARAMETERS
- 5.2.7 SLEW RATE AND LARGE-SIGNAL BANDWIDTH
- Slew Rate
- Large-Signal Bandwidth
- Slewing Distortion
- 5.2.8 SMALL-SIGNAL BANDWIDTH
- 5.2.9 SETTLING TIME
- 5.2.10 THE OSCILLATING AMPLIFIER
- Ground Coupling
- Power Supply Coupling
- Output-Stage Instability
- Stray Capacitance at the Input
- Parasitic Feedback
- 5.2.11 OPEN-LOOP GAIN
- Sagging AOL
- 5.2.12 NOISE
- Definitions
- 5.2.13 CALCULATING THE EFFECT OF NOISE IN A CIRCUIT
- Power Spectral Density of Noise
- Types of Noise
- Thermal Noise
- Amplifier Noise
- Noise Bandwidth
- Modeling and Simulation of Noise
- 5.2.14 SUPPLY CURRENT AND VOLTAGE
- Supply Voltage
- Supply Current
- lS Versus Speed and Dissipation
- 5.2.15 TEMPERATURE RATINGS
- Specification Validity
- Package Reliability.
- 5.2.16 COST AND AVAILABILITY.
