Characterization of integrated circuit packaging materials

Characterization of integrated circuit packaging materials

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues ar...

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Detalles Bibliográficos
Otros Autores: Moore, Thomas M., editor (editor), McKenna, Robert G., editor (designer), Fitzpatrick, Lee E., editor (compositor), Simon, Christopher, designer, Oliver, Deborah, editor, Brill, Stephen, compositor
Formato: Libro electrónico
Idioma:Inglés
Publicado: Stoneham, Massachusetts ; Greenwich, Connecticut : Butterworth-Heinemann 1993.
Colección:Materials characterization series.
Materias:
Electronic packaging > Materials.
Integrated circuits > Design and construction.
Ver en Biblioteca Universitat Ramon Llull:https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009629661306719

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