Cita APA (7a ed.)

Moore, T. M., McKenna, R. G., Fitzpatrick, L. E., Simon, C., Oliver, D., & Brill, S. (1993). Characterization of integrated circuit packaging materials. Butterworth-Heinemann.

Cita Chicago Style (17a ed.)

Moore, Thomas M., Robert G. McKenna, Lee E. Fitzpatrick, Christopher Simon, Deborah Oliver, y Stephen Brill. Characterization of Integrated Circuit Packaging Materials. Stoneham, Massachusetts ; Greenwich, Connecticut: Butterworth-Heinemann, 1993.

Cita MLA (9a ed.)

Moore, Thomas M., et al. Characterization of Integrated Circuit Packaging Materials. Butterworth-Heinemann, 1993.