Signal integrity from high speed to radiofrequency applications
This book presents the necessary concepts for the design and testing of radiofrequency and high-speed circuits. Signal and propagation theory is presented for the various circuit levels, from the chip to the PCB. The co-existence of high-speed wideband signals of radiofrequency signals and supply ci...
| Otros Autores: | |
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| Formato: | Libro electrónico |
| Idioma: | Inglés |
| Publicado: |
London, England ; Hoboken, New Jersey :
iSTE
2014.
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| Edición: | 1st edition |
| Colección: | Digital signal and image processing series.
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| Materias: | |
| Ver en Biblioteca Universitat Ramon Llull: | https://discovery.url.edu/permalink/34CSUC_URL/1im36ta/alma991009629560506719 |
Tabla de Contenidos:
- Cover; Title Page; Copyright; Contents; Introduction; Chapter 1. Degradation Of Rise Time In Interconnects; 1.1. Propagation issues in interconnects; 1.1.1. Evolution of digital circuits; 1.1.2. Evolution of signals in interconnects; 1.1.3. Propagation time on networks; 1.1.4. Propagation delay in integrated circuits; 1.1.5. Spectral analysis of signals; 1.2. Behavior of components at high frequencies; 1.2.1. Contact wire behavior; 1.2.2. Resistance behavior at radiofrequencies (RF); 1.2.3. RF inductance behavior; 1.2.4. Capacitance behavior at RF
- 1.2.5. Effects of losses due to conductors: skin effect1.3. Effect on transmission of signals on interconnects; 1.3.1. Filtering by transmission channel; 1.3.2. Degradation of rise time in a limited-bandwidth channel; 1.3.3. Example of a first-order low-pass RC filter; 1.3.4. Effects of resistive losses from skin effect; 1.3.5. Rise time in cascading circuits; 1.3.6. Transmission quality criteria: eye diagram; 1.4. Measurement of rise time; 1.4.1. Different definitions of rise time; 1.4.2. Measurement principle; 1.4.3. Effect of measuring sensor; 1.5. Conclusion
- Chapter 2. Electromagnetic Modeling Of Interconnects2.1. Global modeling of signal integrity; 2.1.1. ICEM and ICIM models; 2.1.2. IBIS models; 2.1.3. I/V characteristics of buffers; 2.1.4. I/V characteristics of the IBIS model; 2.2. RC interconnect model; 2.2.1. RC model; 2.2.2. The Elmore constant; 2.3. Capacitive and inductive modeling; 2.3.1. Capacitive modeling; 2.3.2. Inductive modeling; 2.4. LC line modeling; 2.5. Application to electronic packages and MCM; 2.5.1. Different types of electronic packages; 2.5.2. Multichip modules; 2.5.3. LC modeling of packages
- 2.5.4. 2.5D and 3D electromagnetic simulations2.6. Conclusion; Chapter 3. Controlled Impedance Interconnects; 3.1. Why control impedance?; 3.1.1. Effect of interconnect length; 3.1.2. Classification of interconnects by the signal carried; 3.2. Influence of rise time on signal degradation; 3.3. Model of a controlled impedance interconnect; 3.3.1. Characteristic impedance: definition; 3.3.2. Configuration of controlled impedance interconnects; 3.4. Interconnects on PCBs; 3.4.1. Controlled impedance on PCB; 3.4.2. Transition between lines and discontinuity
- 3.4.3. Extraction of values from equivalent schema3.5. Impedance control for a microstrip configuration; 3.5.1. Effect of effective permittivity; 3.5.2. Limitations on a typical digital circuit; 3.5.3. Effect of ribbon thickness or protective resin; 3.6. Analysis of propagation in interconnects; 3.6.1. Reflection and transmission on termination; 3.6.2. Reflection and transmission during an impedance break; 3.6.3. Reflection and transmission on a bus; 3.7. Effect on data bus configuration; 3.8. Application to clock distribution; 3.9. Conclusion; Chapter 4. Propagation On Transmission Lines
- 4.1. Transmission line model
